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SX1278

LoRa Transceiver

The SX1278 is a lora transceiver from Semtech. View the full SX1278 datasheet below including key specifications, absolute maximum ratings.

Official SX1278 datasheet (PDF) — the source this page was extracted from.

Manufacturer

Semtech

Category

LoRa Transceiver

SX1278 Key Specifications

ParameterValue
Case/PackageVQFN
China RoHSCompliant
Current - Receiving10.8mA ~ 12mA
Current - Receiving12 mA
Current - Transmitting20mA ~ 120mA
Current - Transmitting120 mA
Data Rate300 kbps
Data Rate (Max)300kbps
DigiKey ProgrammableNot Verified
Frequency137MHz ~ 525MHz
Frequency525 MHz
GPIO6
Height - Seated (Max)1 mm
InterfaceSPI
Introduction Date2013-10-30
Lead FreeLead Free
Length6 mm
Lifecycle StatusProduction (Last Updated: 1 month ago)
Max Operating Temperature85 °C
Min Operating Temperature-40 °C
ModulationFSK, GFSK, GMSK, MSK, OOK
Mounting TypeSurface Mount
Nominal Supply Voltage (DC)3.3 V
Number of Circuits1
Number of GPIO6
Number of Pins28
Number of Terminals28
Operating Temperature-40°C ~ 85°C
Package / Case28-VQFN Exposed Pad
PackagingMouseReel
PackagingTape & Reel (TR)
Power - Output20dBm
ProtocolLoRa™
REACH SVHCUnaffected
RF Family/Standard802.15.4
RoHSCompliant
Sensitivity-148dBm
Sensitivity (dBm)-148 dBm
Serial InterfacesSPI
Standard Pack Qty3000
Supplier Device Package28-QFN (6x6)
Temperature GradeIndustrial
Terminal Pitch650 µm
TypeTxRx Only
Supply Voltage1.8V ~ 3.7V
Width6 mm

SX1278 Overview

Part: SX1278IMLTRT — Semtech

Type: Sub-GHz LoRa / (G)FSK / OOK Transceiver

Description: Low-power long-range transceiver (SX1276/77/78/79 family) covering 137–1020 MHz, with LoRa modem, sensitivity down to -148 dBm, +20 dBm PA, 168 dB maximum link budget and programmable bit rate up to 300 kbps.

Operating Conditions:

  • Operating temperature: -40 to +85 °C (QFN-28 package operating range)
  • Frequency range: 137–1020 MHz (family)
  • Bit rate: up to 300 kbps

Absolute Maximum Ratings:

  • Max supply voltage (VDDmr): 3.9 V (min -0.5 V)
  • Storage/ambient temperature (Tmr): -55 to +115 °C
  • Max junction temperature (Tj): +125 °C
  • Max RF input level (Pmr): +10 dBm

Key Specs:

  • Sensitivity: down to -148 dBm (LoRa)
  • Maximum link budget: 168 dB
  • RF output power: up to +20 dBm (100 mW, constant vs. supply voltage); +14 dBm high-efficiency PA
  • RX current: 9.9 mA; 200 nA register retention
  • Bit rate: programmable up to 300 kbps
  • IIP3: -11 dBm
  • RSSI dynamic range: 127 dB
  • Synthesizer resolution: 61 Hz

Features:

  • LoRa modem with long-range spread-spectrum communication
  • FSK, GFSK, MSK, GMSK, LoRa and OOK modulation
  • Built-in bit synchronizer for clock recovery and preamble detection
  • Automatic RF Sense and CAD with ultra-fast AFC
  • Packet engine up to 256 bytes with CRC
  • Built-in temperature sensor and low battery indicator
  • Excellent blocking immunity
  • Supports WMBus and IEEE 802.15.4g in (G)FSK modes

Applications:

  • Automated meter reading
  • Home and building automation
  • Wireless alarm and security systems
  • Industrial monitoring and control
  • Long-range irrigation systems

Package:

  • QFN-28 (tape & reel, 3000 pieces MOQ; Pb-free, halogen-free, RoHS/WEEE compliant)

SX1278 Features

  • LoRa® Modem
  • 168 dB maximum link budget
  • +20 dBm - 100 mW constant RF output vs. V supply
  • +14 dBm high efficiency PA
  • Programmable bit rate up to 300 kbps
  • High sensitivity: down to -148 dBm
  • Bullet-proof front end: IIP3 = -11 dBm
  • Excellent blocking immunity
  • Low RX current of 9.9 mA, 200 nA register retention
  • Fully integrated synthesizer with a resolution of 61 Hz
  • FSK, GFSK, MSK, GMSK, LoRa® and OOK modulation
  • Built-in bit synchronizer for clock recovery
  • Preamble detection
  • 127 dB Dynamic Range RSSI
  • Automatic RF Sense and CAD with ultra-fast AFC
  • Packet engine up to 256 bytes with CRC
  • Built-in temperature sensor and low battery indicator

SX1278 Applications

  • Automated Meter Reading.
  • Home and Building Automation.
  • Wireless Alarm and Security Systems.
  • Industrial Monitoring and Control
  • Long range Irrigation Systems

DATASHEET

  • Section Section Page
    1. General Description................................................................................................................................................. 9
  • 1.1. Simplified Block Diagram................................................................................................................................. 9
  • 1.2. Product Versions ............................................................................................................................................10
  • 1.3. Pin Diagram ................................................................................................................................................... 10
  • 1.4. Pin Description ...............................................................................................................................................11
  • 1.5. Package Marking ............................................................................................................................................12
    1. Electrical Characteristics ....................................................................................................................................... 13
  • 2.1. ESD Notice .................................................................................................................................................... 13
  • 2.2. Absolute Maximum Ratings ........................................................................................................................... 13
  • 2.3. Operating Range............................................................................................................................................ 13
  • 2.4. Thermal Properties ........................................................................................................................................ 13
  • 2.5. Chip Specification ..........................................................................................................................................14
  • 2.5.1. Power Consumption.................................................................................................................................. 14
  • 2.5.2. Frequency Synthesis................................................................................................................................. 14
  • 2.5.3. FSK/OOK Mode Receiver .........................................................................................................................16
  • 2.5.4. FSK/OOK Mode Transmitter ..................................................................................................................... 17
  • 2.5.5. Electrical Specification for LoRa Modulation............................................................................................. 19
  • 2.5.6. Digital Specification................................................................................................................................... 22
    1. SX1276/77/78/79 Features.................................................................................................................................... 23
  • 3.1. LoRa® Modem............................................................................................................................................... 24
  • 3.2. FSK/OOK Modem.......................................................................................................................................... 24
    1. SX1276/77/78/79 Digital Electronics ..................................................................................................................... 25
  • 4.1. Link Design The LoRa® Modem........................................................................................................................................ Using the LoRa® Modem 25 ......................................................................................................26
  • 4.1.1. 4.1.2. LoRa® Digital Interface .............................................................................................................................34
  • 4.1.3. Operation of the LoRa® Modem ............................................................................................................... 36
  • 4.1.4. Frequency Settings ................................................................................................................................... 36
  • 4.1.5. Frequency Error Indication........................................................................................................................ 37
  • 4.1.6. LoRa AFC.................................................................................................................................................. 37
  • 4.1.7. Digital IO Pin Mapping............................................................................................................................... 45
  • 4.1.8. Modem Status Indicators........................................................................................................................... 46
  • 4.2. FSK/OOK Modem.......................................................................................................................................... 46 46
  • 4.2.1. Bit Rate Setting .........................................................................................................................................
  • 4.2.2. FSK/OOK Transmission............................................................................................................................ 47
  • 4.2.3. FSK/OOK Reception ................................................................................................................................. 48
  • 4.2.4. Operating Modes in FSK/OOK Mode........................................................................................................ 54
  • 4.2.5. Startup Times ............................................................................................................................................56
  • 4.2.6. Receiver Startup Options .......................................................................................................................... 59
  • 4.2.7. 60
  • Receiver Restart Methods.........................................................................................................................

DATASHEET

  • Section Section Page
  • 4.2.8. Top Level Sequencer ................................................................................................................................ 61
  • 4.2.9. Data Processing in FSK/OOK Mode......................................................................................................... 65
  • 4.2.10. FIFO........................................................................................................................................................ 66
  • 4.2.11. Digital IO Pins Mapping ...........................................................................................................................69
  • 4.2.12. Continuous Mode ....................................................................................................................................70
  • 4.2.13. Packet Mode ........................................................................................................................................... 71
  • 4.2.14. io-homecontrol® Compatibility Mode ...................................................................................................... 79
  • 4.3. SPI Interface ..................................................................................................................................................80
    1. SX1276/77/78/79 Analog & RF Frontend Electronics............................................................................................ 81
  • 5.1. Power Supply Strategy .................................................................................................................................. 81
  • 5.2. Low Battery Detector ..................................................................................................................................... 81
  • 5.3. Frequency Synthesis ..................................................................................................................................... 81
  • 5.3.1. Crystal Oscillator ....................................................................................................................................... 81
  • 5.3.2. CLKOUT Output........................................................................................................................................ 82
  • 5.3.3. PLL............................................................................................................................................................ 82
  • 5.3.4. RC Oscillator ............................................................................................................................................. 82
  • 5.4. Transmitter Description ..................................................................................................................................83
  • 5.4.1. Architecture Description ............................................................................................................................ 83
  • 5.4.2. RF Power Amplifiers.................................................................................................................................. 83
  • 5.4.3. High Power +20 dBm Operation ............................................................................................................... 84
  • 5.4.4. Over Current Protection ............................................................................................................................85
  • 5.5. Receiver Description...................................................................................................................................... 85
  • 5.5.1. Overview ................................................................................................................................................... 85
  • 5.5.2. Receiver Enabled and Receiver Active States.......................................................................................... 85
  • 5.5.3. Automatic Gain Control In FSK/OOK Mode.............................................................................................. 85
  • 5.5.4. RSSI in FSK/OOK Mode........................................................................................................................... 86
  • 5.5.5. RSSI and SNR in LoRa Mode................................................................................................................... 87
  • 5.5.6. Channel Filter............................................................................................................................................ 88
  • 5.5.7. Temperature Measurement....................................................................................................................... 89
    1. Description of the Registers................................................................................................................................... 90
  • 6.1. Register Table Summary............................................................................................................................... 90
  • 6.2. FSK/OOK Mode Register Map .......................................................................................................................93
  • 6.3. Band Specific Additional Registers.............................................................................................................. 106
  • 6.4. LoRa Mode Register Map............................................................................................................................ 108
    1. Application Information ........................................................................................................................................ 116
  • 7.1. Crystal Resonator Specification................................................................................................................... 116
  • 7.2. Reset of the Chip ......................................................................................................................................... 116
  • 7.2.1. POR......................................................................................................................................................... 116

7.2.2. Manual Reset 117

DATASHEET

  • Section Page
  • 7.3. Top Sequencer: Listen Mode Examples...................................................................................................... 7.3.1. Wake on Preamble Interrupt ................................................................................................................... 7.3.2. Wake on SyncAddress Interrupt ..............................................................................................................120 7.4. Top Sequencer: Beacon Mode ....................................................................................................................123 7.4.1. Timing diagram........................................................................................................................................ 7.4.2. Sequencer Configuration......................................................................................................................... 7.5. Example CRC Calculation ........................................................................................................................... 7.6. Example Temperature Reading ...................................................................................................................126 Packaging Information......................................................................................................................................... 117 117 123 123 125
    1. 128
  • 8.1. Package Outline Drawing ............................................................................................................................ 128
  • 8.2. Recommended Land Pattern....................................................................................................................... 129
  • 8.3. Tape & Reel Information.............................................................................................................................. 130
  • 8.4. Wafer Delivery ............................................................................................................................................. 130

DATASHEET

  • Section Page
  • Table 1. SX1276/77/78/79 Device Variants and Key Parameters .................................................................................10
  • Table 2. Pin Description ................................................................................................................................................11
  • Table 3. Absolute Maximum Ratings .............................................................................................................................13
  • Table 4. Operating Range .............................................................................................................................................13
  • Table 5. Thermal Properties ..........................................................................................................................................13
  • Table 6. Power Consumption Specification ...................................................................................................................14
  • Table 7. Frequency Synthesizer Specification ..............................................................................................................14
  • Table 8. FSK/OOK Receiver Specification ....................................................................................................................16
  • Table 9. Transmitter Specification .................................................................................................................................17
  • Table 10. LoRa Receiver Specification .........................................................................................................................19
  • Table 11. Digital Specification .......................................................................................................................................22
  • Table 12. Example LoRa® Modem Performances, 868MHz Band ...............................................................................25
  • Table 13. Range of Spreading Factors ..........................................................................................................................27
  • Table 14. Cyclic Coding Overhead ................................................................................................................................27
  • Table 15. LoRa Bandwidth Options ...............................................................................................................................28
  • Table 16. LoRa® Operating Mode Functionality ...........................................................................................................36
  • Table 17. LoRa CAD Consumption Figures ..................................................................................................................45
  • Table 18. DIO Mapping LoRa® Mode ...........................................................................................................................46
  • Table 19. Bit Rate Examples .........................................................................................................................................47
  • Table 20. Preamble Detector Settings ...........................................................................................................................53
  • Table 21. RxTrigger Settings to Enable Timeout Interrupts ..........................................................................................54
  • Table 22. Basic Transceiver Modes ..............................................................................................................................54
  • Table 23. Receiver Startup Time Summary ..................................................................................................................57
  • Table 24. Receiver Startup Options ..............................................................................................................................60
  • Table 25. Sequencer States ..........................................................................................................................................61
  • Table 26. Sequencer Transition Options .......................................................................................................................62
  • Table 27. Sequencer Timer Settings .............................................................................................................................63
  • Table 28. Status of FIFO when Switching Between Different Modes of the Chip .........................................................67
  • Table 29. DIO Mapping, Continuous Mode ...................................................................................................................69
  • Table 30. DIO Mapping, Packet Mode ..........................................................................................................................69
  • Table 31. CRC Description ...........................................................................................................................................77
  • Table 32. Frequency Bands ..........................................................................................................................................82
    1. Power Amplifier Mode Selection Truth Table ................................................................................................83
  • Table
  • Table 34. High Power Settings ......................................................................................................................................84
  • Table 35. Operating Range, +20dBm Operation ...........................................................................................................84
  • Table 36. Operating Range, +20dBm Operation ...........................................................................................................84 Table 37. Trimming of the OCP Current ........................................................................................................................85
  • Table
    1. RssiSmoothing Options .................................................................................................................................86

DATASHEET

  • Section Page
  • Table 40. Available RxBw Settings ................................................................................................................................88
  • Table 41. Registers Summary .......................................................................................................................................90
  • Table 42. Register Map .................................................................................................................................................93
  • Table 43. Low Frequency Additional Registers ...........................................................................................................106
  • Table 44. High Frequency Additional Registers ..........................................................................................................107
  • Table 45. Crystal Specification ....................................................................................................................................116
  • Table 46. Listen Mode with PreambleDetect Condition Settings .................................................................................119
  • Table 47. Listen Mode with PreambleDetect Condition Recommended DIO Mapping ...............................................119
  • Table 48. Listen Mode with SyncAddress Condition Settings .....................................................................................122
  • Table 49. Listen Mode with PreambleDetect Condition Recommended DIO Mapping ...............................................122
  • Table 50. Beacon Mode Settings ................................................................................................................................124
  • Table 51. Revision History ...........................................................................................................................................131

SX1278 Pin Configuration

Table 2 Pin Description

NumberName SX1276/77/79/(78)Type SX1276/77/79/(78)Description
0GROUND-Exposed ground pad
1RFI_LFIRF input for bands 2&3
2VR_ANA-Regulated supply voltage for analogue circuitry
3VBAT_ANA-Supply voltage for analogue circuitry
4VR_DIG-Regulated supply voltage for digital blocks
5XTAI/OXTAL connection or TCXO input
6XTBI/OXTAL connection
7NRESETI/OReset trigger input
8DIO0I/ODigital I/O, software configured
9DIO1/DCLKI/ODigital I/O, software configured
10DIO2/DATAI/ODigital I/O, software configured
11DIO3I/ODigital I/O, software configured
12DIO4I/ODigital I/O, software configured
13DIO5I/ODigital I/O, software configured
14VBAT_DIG-Supply voltage for digital blocks
15GND-Ground
16SCKISPI Clock input
17MISOOSPI Data output
18MOSIISPI Data input
19NSSISPI Chip select input
20RXTX/RF_MODORx/Tx switch control: high in Tx
21RFI_HF (GND)I (-)RF input for band 1 (Ground)
22RFO_HF (GND)O (-)RF output for band 1 (Ground)
23GND-Ground
24VBAT_RF-Supply voltage for RF blocks
25VR_PA-Regulated supply for the PA
26GND-Ground
27PA_BOOSTOOptional high-power PA output, all frequency bands
28RFO_LFORF output for bands 2&3

Table 2 Pin Description

DATASHEET

SX1278 Absolute Maximum Ratings

Stresses above the values listed below may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may affect device reliability.

Table 3 Absolute Maximum Ratings

SymbolDescriptionMinMaxUnit
VDDmrSupply Voltage-0.53.9V
TmrTemperature-55+115° C
TjJunction temperature-+125° C
PmrRF Input Level-+10dBm

Note Specific ratings apply to +20 dBm operation (see Section 3.4.3).

SX1278 Thermal Information

Table 5 Thermal Properties

SymbolDescriptionMinTypMaxUnit
THETA_JAPackage ja (Junction to ambient)-22.185-°C/W
THETA_JCPackage jc (Junction to case ground paddle)-0.757-°C/W

Table 5 Thermal Properties

DATASHEET

SX1278 Package Information

The SX1276/77/78/79 is available in a 28-lead QFN package as shown in Figure 57.

Figure 57. Package Outline Drawing

DATASHEET

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
SX1276IMLTRTSemtech28-VQFN Exposed Pad
SX1277IMLTRTSemtech28-VQFN Exposed Pad
SX1278IMLTRTSemtech28-VQFN Exposed Pad
SX1279IMLTRTSemtech28-VQFN Exposed Pad

More datasheets

All Semtech datasheets (15)

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