Part: SWPA4030S Series — Shenzhen Sunlord Electronics Co., Ltd.

Type: Wire Wound SMD Power Inductor

Description: A wire wound surface-mount power inductor series with an operating temperature range of -40 °C to +125 °C, available in a 4.0x4.0x3.0 mm package.

Operating Conditions:

• Operating and storage temperature range (individual chip): -40 °C to +125 °C (Including Self-heating)
• Storage temperature range (packaging conditions): -10 °C to +40 °C and RH 70% (Max.)

Absolute Maximum Ratings:

• Max junction/storage temperature: 125 °C (operating)

Key Specs:

• Inductance Tolerance: ±20% (M), ±30% (N)
• Package Dimensions (A x B x C): 4.0±0.2 mm x 4.0±0.2 mm x 3.0 mm Max.
• Ferrite Core Material: Ni-Zn Ferrite
• Wire Material: Polyurethane system enameled copper wire
• Electrodes Material: Sn Alloy
• Recommended Reflow Max Temperature: 260 °C
• Recommended Iron Soldering Tip Temperature: 350 °C Max.

Features:

• Wire wound construction
• SMD (Surface Mount Device)
• RoHS Compliant

Applications:

• General electronics equipment (not for high-reliability applications like aerospace, medical, military, etc.)

Package:

• SWPA4030S (4.0±0.2 mm x 4.0±0.2 mm x 3.0 mm Max.)

SWPA4030S — Wire Wound SMD Power Inductor

Package Type: SMD (Surface Mount Device) — 4.0 × 4.0 × 3.0 mm

Pinout

Notes

• Component Type: This is a passive inductor, not a logic IC. It has only two solder terminals (pads) for connection to a PCB.
• No pin diagram with numbered pads was provided in the attached images. The images show dimensional drawings (Fig. 4-1, Fig. 4-2, Fig. 4-3) and internal structure (Fig. 4-3), but do not label the two solder pads with pin numbers.
• Pin assignment is arbitrary: For a two-terminal passive component, the terminals are functionally equivalent. Pin 1 and Pin 2 refer to the two solder pads on the PCB footprint; either pad may be connected to either side of the circuit.
• Electrical characteristics vary by inductance value (0.68 μH to 500 μH); see Appendix A in the datasheet for the specific variant's L, DCR, Isat, and Irms ratings.
• Recommended soldering: Reflow soldering only (see Section 10.1); iron soldering max. 30W, 350°C tip, 3 seconds per pad, 1 time only.

Please refer to Appendix A (Page 13).

• 1. Operating and storage temperature range (individual chip without packing): -40 °C ~+125 °C( Including Self-heating )
• 1. Storage temperature range (packaging conditions): -10 °C ~+40 °C and RH 70% (Max.).