SW H 15P03

*P-channel Enhanced mode SOP-8/DFN3\*3 MOSFET*

Manufacturer

SAMWIN

Overview

Part: SAMWIN SW15P03

Type: P-channel Enhanced Mode Power MOSFET

Key Specs:

  • Drain-to-Source Voltage (BVDSS): -30V
  • Continuous Drain Current (ID): -15A (@TC=25°C)
  • On-State Resistance (RDS(ON)): 10mΩ (Typ) @VGS=-10V, ID=-7.5A
  • Total Gate Charge (Qg): 48nC (Typ)

Features:

  • High ruggedness
  • Low RDS(ON) (Typ 14mΩ)@VGS=-4.5V Low RDS(ON) (Typ 10mΩ)@VGS=-10V
  • Low Gate Charge (Typ 48nC)
  • Improved dv/dt Capability
  • 100% Avalanche Tested
  • Fast switching time
  • Low on resistance
  • Excellent Avalanche characteristics

Applications:

  • Adaptor Input Switch for Notebook PC

Package:

  • SOP-8
  • DFN3*3

Features

  • High ruggedness
  • Low RDS(ON) (Typ 14mΩ)@VGS=-4.5V Low RDS(ON) (Typ 10mΩ)@VGS=-10V
  • Low Gate Charge (Typ 48nC)
  • Improved dv/dt Capability
  • 100% Avalanche Tested
  • Application: Adaptor Input Switch for Notebook PC

SOP-8/DFN3*3: 4.Gate 5,6,7,8.Drain 1,2,3.Source

Absolute Maximum Ratings

SymbolParameterValue
SOP-8
VDSSDrain to source voltage-30
IDContinuous drain current (@TC=25°C)-15*
Continuous drain current (@TC=100°C)-9.5*
IDMDrain current pulsed(note 1)-60
VGSGate to source voltage± 25
EASSingle pulsed avalanche energy(note 2)81
dv/dtPeak diode recovery dv/dt(note 3)5
PDTotal power dissipation (@Ta=25°C)2.5
Derating factor above 25°C0.02
TSTG, TJOperating junction temperature & storage temperature-55 ~ + 150

*. Drain current is limited by junction temperature.

Thermal characteristics

SymbolValue
ParameterSOP-8
RthjaThermal resistance, Junction to ambient(note)50

Note: Rthja is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is d efined as the solder mounting surface of the drain pins. Rthjc is guaranteed by design while Rthca is determined by the user's board design.

SOP-8: 50oC/W on a 1 in2 pad of 2oz copper. DFN3*3:60oC/W on a 1 in2 pad of 2oz copper.

Thermal Information

SymbolValue
ParameterSOP-8
RthjaThermal resistance, Junction to ambient(note)50

Note: Rthja is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is d efined as the solder mounting surface of the drain pins. Rthjc is guaranteed by design while Rthca is determined by the user's board design.

SOP-8: 50oC/W on a 1 in2 pad of 2oz copper. DFN3*3:60oC/W on a 1 in2 pad of 2oz copper.

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
AP15P03QSAMWINPDFN3x3-8
SW K 15P03SAMWIN
SW15P03SAMWIN
Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

Get structured datasheet data via API

Get started free