STM8L151R6

Part: STM8L151x6/8 STM8L152x6/8

Type: 8-bit ultra-low-power MCU

Description: 8-bit ultra-low-power MCU with up to 64 KB Flash, 2 KB data EEPROM, RTC, LCD, and a maximum frequency of 16 MHz.

Operating Conditions:

• Supply voltage: 1.65 to 3.6 V
• Operating temperature: -40 to 125 °C
• Max CPU frequency: 16 MHz

Absolute Maximum Ratings:

• Max supply voltage: 4.0 V
• Max total current into VDD: 100 mA
• Max storage temperature: -60 to 150 °C

Key Specs:

• Flash memory: Up to 64 Kbytes
• Data EEPROM: Up to 2 Kbytes
• RAM: Up to 4 Kbytes
• CPU frequency: 16 MHz (16 CISC MIPS peak)
• ADC: 12-bit, up to 1 Msps, 28 channels
• DAC: 2x12-bit (dual mode)
• Halt mode current consumption: 400 nA
• Low-power run mode current consumption: 5.9 μA

Features:

• 5 low-power modes (Wait, Low-power run, Low-power wait, Active-halt, Halt)
• Advanced STM8 core with Harvard architecture and 3-stage pipeline
• LCD controller: 8x40 or 4x44 with step-up converter
• Up to 16 capacitive sensing channels
• DMA: 4 channels for peripherals, 1 channel for memory-to-memory
• Low-power RTC with alarm interrupt and anti-tamper detection

Applications:

• Ultra-low-power applications
• Portable devices with LCD
• Touch sensing interfaces

Package:

• UFQFPN48 (7x7mm)
• LQFP80 (14x14mm)
• LQFP64 (10x10mm)
• LQFP48 (7x7mm)
• WLCSP32

• Operating conditions
• -Operating power supply: 1.65 to 3.6 V (without BOR), 1.8 to 3.6 V (with BOR)
• -Temp. range: -40 to 85, 105 or 125 °C
• Low-power features
• -5 low-power modes: Wait, Low-power run (5.9 μA), Low-power wait (3 μA), Activehalt with full RTC (1.4 μA), Halt (400 nA)
• -Consumption: 200 μA/MHz+330 μA
• -Fast wake up from Halt mode (4.7 μs)
• -Ultra low leakage per I/0: 50 nA
• Advanced STM8 core
• -Harvard architecture and 3-stage pipeline
• -Max freq: 16 MHz, 16 CISC MIPS peak
• -Up to 40 external interrupt sources
• Reset and supply management
• -Low-power, ultra safe BOR reset with five programmable thresholds
• -Ultra-low-power POR/PDR
• -Programmable voltage detector (PVD)
• Clock management
• -32 kHz and 1-16 MHz crystal oscillators
• -Internal 16 MHz factory-trimmed RC and 38 kHz low consumption RC
• -Clock security system
• Low-power RTC
• -BCD calendar with alarm interrupt
• -Digital calibration with +/- 0.5ppm accuracy
• -Advanced anti-tamper detection
• LCD: 8x40 or 4x44 w/ step-up converter
• DMA
• -4 ch. for ADC, DACs, SPIs, I 2 C, USARTs, Timers, 1 ch. for memory-to-memory
• 2x12-bit DAC (dual mode) with output buffer
• 12-bit ADC up to 1 Msps/28 channels
• -Temp. sensor and internal ref. voltage
• Memories
• -Up to 64-Kbytes of Flash memory with up to 2 Kbytes of data EEPROM with ECC and RWW
• -Flexible write/read protection modes
• -Up to 4 Kbytes of RAM
• 2 ultra-low-power comparators
• -1 with fixed threshold and 1 rail to rail
• -Wake up capability
• Timers
• -Three 16-bit timers with 2 channels (IC, OC, PWM), quadrature encoder
• -One 16-bit advanced control timer with 3 channels, supporting motor control
• -One 8-bit timer with 7-bit prescaler
• -One window, one independent watchdog
• -Beeper timer with 1, 2 or 4 kHz frequencies
• Communication interfaces
• -Two synchronous serial interface (SPI)
• -Fast I 2 C 400 kHz SMBus and PMBus
• -Three USARTs (ISO 7816 interface + IrDA)
• Up to 67 I/Os, all mappable on interrupt vectors
• Up to 16 capacitive sensing channels supporting touchkey, proximity, linear touch and rotary touch sensors
• Fast on-chip programming and non-intrusive debugging with SWIM, Bootloader using USART
• 96-bit unique ID

LQFP80 (14x14mm) LQFP64 (10x10mm) LQFP48 (7x7mm)

Table 1. Device summary

Table 1. Device summary

Figure 3. STM8L151M8 80-pin package pinout (without LCD)

1. Pin 22 is reserved and must be tied to V DD .
2. The above figure shows the package top view.
3. The above figure shows the package top view.

Figure 4. STM8L152M8 80-pin package pinout (with LCD)

Figure 5. STM8L151R8 and STM8L151R6 64-pin pinout (without LCD)

1. Pin 18 is reserved and must be tied to V DD .
2. The above figure shows the package top view.
3. The above figure shows the package top view.

Figure 6. STM8L152R8 and STM8L152R6 64-pin pinout (with LCD)

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Figure 7. STM8L151C8 48-pin pinout (without LCD)

1. Pin 13 is reserved and must be tied to V DD .
2. The above figure shows the package top view.
3. The above figure shows the package top view.

Figure 8. STM8L152C8 48-pin pinout (with LCD)

Figure 9. STM8L152K8 32-ball ballout

Warning:

For the 32-pin STM8L152K8 devices, some active I/O pins are not bonded out of the package. Effectively, all ports available on 48-pin devices must be considered as active ports also for 32-pin devices - see Table 5: High-density and medium+ density STM8L15x pin description for more details. To avoid spurious effects, users have to configure active ports as input pull-up. A small increase in consumption (typ. < 300 μ A) may occur during the power up and reset phase until these ports are properly configured.

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Table 4. Legend/abbreviation

Table 5. High-density and medium+ density STM8L15x pin description

Table 5. High-density and medium+ density STM8L15x pin description

Table 5. High-density and medium+ density STM8L15x pin description (continued)

Table 5. High-density and medium+ density STM8L15x pin description (continued)

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In the following table, data are guaranteed by design.

Table 50. DAC characteristics

1. Resistive load between DACOUT and GNDA
2. Output on PF0 or PF1
3. Capacitive load at DACOUT pin
4. It gives the output excursion of the DAC

In the following table, data based on characterization results.

Table 51. DAC accuracy

1. Difference between two consecutive codes - 1 LSB.
2. In 48-pin package devices the DAC2 output buffer must be kept off and no load must be applied on the DAC_OUT2 output.
3. Difference between measured value at Code i and the value at Code i on a line drawn between Code 0 and last Code 1023.
4. Difference between the value measured at Code (0x800) and the ideal value = V REF+ /2.
5. Difference between the value measured at Code (0x001) and the ideal value.
6. Difference between the ideal slope of the transfer function and the measured slope computed from Code 0x000 and 0xFFF when buffer is ON, and from Code giving 0.2 V and (V DDA -0.2) V when buffer is OFF.

In the following table, data are guaranteed by design.

Table 52. DAC output on PB4-PB5-PB6 (1)

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Stresses above the absolute maximum ratings listed in Table 15: Voltage characteristics , Table 16: Current characteristics , and Table 17: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect the device's reliability.

The device's mission profile (application conditions) is compliant with the JEDEC JESD47 Qualification Standard, extended mission profiles are available on demand.

Table 15. Voltage characteristics

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Table 16. Current characteristics

Table 17. Thermal characteristics

Table 17. Thermal characteristics

The maximum chip junction temperature (T Jmax ) must never exceed the values given in Table 18: General operating conditions on page 71 .

The maximum chip-junction temperature, T Jmax , in degree Celsius, may be calculated using the following equation:

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com . ECOPACK ® is an ST trademark.