STM32L432KCU6

Part: STM32L432KC (STM32L432KB / STM32L432KC) — STMicroelectronics

Type: Ultra-low-power ARM Cortex-M4 MCU with FPU

Description: 32-bit Arm Cortex-M4 MCU with FPU at up to 80 MHz (100 DMIPS) with up to 256 KB Flash and 64 KB SRAM, 1.71–3.6 V supply, USB FS, 12-bit ADC and DAC.

Operating Conditions:

• Supply voltage (VDD): 1.71–3.6 V
• Operating temperature: -40 to 85 °C (suffix-dependent: suffix 6 is -40 to 85 °C, suffix 7 is -40 to 105 °C, suffix 3 is -40 to 125 °C; see Table 21)
• Max AHB/APB clock frequency: 80 MHz
• Analog supply VDDA: 1.62–3.6 V with ADC or COMP used; 1.8–3.6 V with DAC or OPAMP used
• USB supply VDDUSB: 3.0–3.6 V when USB is used

Absolute Maximum Ratings:

• Max external main supply voltage (VDDX - VSS): 4.0 V (min -0.3 V)
• Input voltage on FT_xxx pins: min(VDD, VDDA, VDDUSB) + 4.0 V max
• Input voltage on TT_xx and other pins: 4.0 V max
• Total current into all VDD lines: 140 mA; total current out of all VSS lines: 140 mA
• Current per VDD or VSS pin: 100 mA
• Output current per I/O pin (sunk or sourced): 20 mA
• Total injected current (sum of all I/Os): 25 mA
• Max junction temperature: 150 °C
• Storage temperature: -65 to +150 °C

Key Specs:

• Core clock: up to 80 MHz (fHCLK, fPCLK1, fPCLK2)
• Memory: up to 256 KB single-bank Flash, 64 KB SRAM (16 KB with hardware parity)
• Run mode current: 84 μA/MHz
• Stop 2 mode: 1.0 μA (1.28 μA with RTC)
• Standby mode: 28 nA (280 nA with RTC)
• Shutdown mode: 8 nA
• Wakeup from Stop mode: 4 μs
• ADC: 1x 12-bit, 5 Msps, up to 16-bit with hardware oversampling
• Power dissipation (UFQFPN32): 523 mW at TA = 85 °C (suffix 6)
• Junction temperature range: -40 to 105 °C (suffix 6), 125 °C (suffix 7), 130 °C (suffix 3)

Features:

• Ultra-low-power with FlexPowerControl, brown-out reset, batch acquisition mode
• Arm Cortex-M4 with FPU, MPU, DSP instructions and ART Accelerator
• Up to 26 fast I/Os, most 5 V-tolerant
• 11 timers, 2 watchdogs, RTC with hardware calendar
• 1x 12-bit ADC, 2x 12-bit DAC, 1x op-amp with PGA, 2x comparators
• USB 2.0 full-speed crystal-less, CAN 2.0B, 2x I2C FM+, 3x USART, 1x LPUART, 2x SPI, Quad SPI, SAI, SWPMI, IRTIM
• 14-channel DMA, true random number generator, CRC unit, 96-bit unique ID
• Up to 3 capacitive sensing channels
• SWD, JTAG and Embedded Trace Macrocell debug
• ECOPACK2 compliant

Applications:

• Battery-powered and ultra-low-power embedded systems
• Audio and USB-connected devices

Package:

• UFQFPN32 (5x5 mm, 0.5 mm pitch)

• Ultra-low-power with FlexPowerControl

• -1.71 V to 3.6 V power supply

• --40 °C to 85/105/125 °C temperature range

• -8 nA Shutdown mode (2 wakeup pins)

• -28 nA Standby mode (2 wakeup pins)

• -280 nA Standby mode with RTC

• -1.0 μA Stop 2 mode, 1.28 μA with RTC

• -84 μA/MHz run mode

• -Batch acquisition mode (BAM)

• -4 μs wakeup from Stop mode

• -Brown out reset (BOR)

• -Interconnect matrix

• Core: Arm ® 32-bit Cortex ® -M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait-state execution from Flash memory, frequency up to 80 MHz, MPU, 100DMIPS and DSP instructions

• Performance benchmark

• -1.25 DMIPS/MHz (Drystone 2.1)

• -273.55 CoreMark ® (3.42 CoreMark/MHz @ 80 MHz)

• Energy benchmark

• -176.7 ULPBench ® score

• Clock Sources

• -32 kHz crystal oscillator for RTC (LSE)

• -Internal 16 MHz factory-trimmed RC (±1%)

• -Internal low-power 32 kHz RC (±5%)

• -Internal multispeed 100 kHz to 48 MHz oscillator, auto-trimmed by LSE (better than ±0.25 % accuracy)

• -Internal 48 MHz with clock recovery

• -2 PLLs for system clock, USB, audio, ADC

• CRC calculation unit, 96-bit unique ID

• Development support: serial wire debug (SWD), JTAG, Embedded Trace Macrocell™

• All packages are ECOPACK2 ® compliant

Figure 5. STM32L432Kx UFQFPN32 pinout (1)

1. The above figure shows the package top view.
2. The related I/O structures in Table 14 are: FT_f, FT_fa.
3. The related I/O structures in Table 14 is: FT_u.
4. The related I/O structures in Table 14 are: FT_a, FT_fa, TT_a.

Table 13. Legend/abbreviations used in the pinout table

Table 13. Legend/abbreviations used in the pinout table

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Table 14. STM32L432xx pin definitions

Table 14. STM32L432xx pin definitions

Table 14. STM32L432xx pin definitions (continued)

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Table 14. STM32L432xx pin definitions (continued)

1. PC14 and PC15 are supplied through the power switch. Since the switch only sinks a limited amount of current (3 mA), the use of GPIOs PC14 to PC15 in output mode is limited:

• These GPIOs must not be used as current sources (e.g. to drive an LED).

• The speed should not exceed 2 MHz with a maximum load of 30 pF

1. After a Backup domain power-up, PC14 and PC15 operate as GPIOs. Their function then depends on the content of the RTC registers which are not reset by the system reset. For details on how to manage these GPIOs, refer to the Backup domain and RTC register descriptions in the RM0394 reference manual.
2. After reset, these pins are configured as JTAG/SW debug alternate functions, and the internal pull-up on PA15, PA13, PB4 pins and the internal pull-down on PA14 pin are activated.

Table 15. Alternate function AF0 to AF7 (1)

Table 15. Alternate function AF0 to AF7 (1)

Table 15. Alternate function AF0 to AF7 (1) (continued)

Table 15. Alternate function AF0 to AF7 (1) (continued)

Table 16. Alternate function AF8 to AF15 (1)

Table 16. Alternate function AF8 to AF15 (1)

Table 16. Alternate function AF8 to AF15 (1) (continued)

The definition and values of input/output AC characteristics are given in Figure 19 and Table 59 , respectively.

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Unless otherwise specified, the parameters given are derived from tests performed under the ambient temperature and supply voltage conditions summarized in Table 21: General operating conditions .

Table 59. I/O AC characteristics (1)(2)

Table 59. I/O AC characteristics (1)(2)

Table 59. I/O AC characteristics (1)(2) (continued)

1. This value represents the I/O capability but the maximum system frequency is limited to 80 MHz.
2. The fall time is defined between 70% and 30% of the output waveform accordingly to I 2 C specification.

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Figure 19. I/O AC characteristics definition (1)

1. Refer to Table 59: I/O AC characteristics .

Stresses above the absolute maximum ratings listed in Table 18: Voltage characteristics , Table 19: Current characteristics and Table 20: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Device mission profile (application conditions) is compliant with JEDEC JESD47 qualification standard, extended mission profiles are available on demand.

Table 18. Voltage characteristics (1)

Table 18. Voltage characteristics (1)

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1. All main power (V DD , V DDA , V DDUSB ,) and ground (V SS , V SSA ) pins must always be connected to the external power supply, in the permitted range.
2. VIN maximum must always be respected. Refer to Table 19: Current characteristics for the maximum allowed injected current values.
3. This formula has to be applied only on the power supplies related to the IO structure described in the pin definition table.
4. To sustain a voltage higher than 4 V the internal pull-up/pull-down resistors must be disabled.
5. Include VREF- pin.
6. Positive injection (when V IN > V DDIOx ) is not possible on these I/Os and does not occur for input voltages lower than the specified maximum value.
7. A negative injection is induced by V IN < V SS . I INJ(PIN) must never be exceeded. Refer also to Table 18: Voltage characteristics for the maximum allowed input voltage values.
8. When several inputs are submitted to a current injection, the maximum ∑ |I INJ(PIN) | is the absolute sum of the negative injected currents (instantaneous values).

Table 19. Current characteristics

Table 20. Thermal characteristics

Table 20. Thermal characteristics

The maximum chip junction temperature (T J max) must never exceed the values given in Table 21: General operating conditions .

The maximum chip-junction temperature, T J max, in degrees Celsius, may be calculated using the following equation:

$$T_J \max = T_A \max + (P_D \max \times \Theta_{JA})$$

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com . ECOPACK ® is an ST trademark.