STM32L053R8T6

Part: STM32C011x4/x6 from STMicroelectronics

Type: Arm® Cortex®-M0+ 32-bit MCU

Description: Arm® Cortex®-M0+ 32-bit MCU with up to 48 MHz CPU, up to 32 KB flash, 6 KB SRAM, multiple communication interfaces, and a 12-bit ADC.

Operating Conditions:

• Supply voltage: 2.0 V to 3.6 V
• Operating temperature: -40°C to 125°C
• Max CPU frequency: 48 MHz

Absolute Maximum Ratings:

• Max supply voltage: -0.3 to 4.0 V (VDD)
• Max continuous current: ±100 mA (into any I/O port pin)
• Max junction/storage temperature: -65 to 150 °C

Key Specs:

• CPU: Arm® 32-bit Cortex®-M0+
• Flash memory: Up to 32 Kbytes
• SRAM: 6 Kbytes with hardware parity check
• ADC: 12-bit, 0.4 μs conversion time, 0 to 3.6 V conversion range
• I/Os: Up to 18 fast I/Os, all 5 V-tolerant
• Internal 48 MHz RC oscillator accuracy: ±1 %
• I2C speed: 1 Mbit/s (Fast-mode Plus)
• SPI speed: 24 Mbit/s

Features:

• Core: Arm® 32-bit Cortex®-M0+ CPU, frequency up to 48 MHz
• Up to 32 Kbytes of flash memory with protection and securable area
• 6 Kbytes of SRAM with hardware parity check
• Voltage range: 2.0 V to 3.6 V
• Low-power modes: Sleep, Stop, Standby, Shutdown
• Up to 18 fast I/Os, all 5 V-tolerant
• 3-channel DMA controller with flexible mapping
• 12-bit, 0.4 μs ADC (up to 13 ext. channels)
• 8 timers: 16-bit for advanced motor control, four 16-bit general-purpose, two watchdogs, SysTick timer
• Calendar RTC with alarm
• One I2C-bus interface supporting Fast-mode Plus (1 Mbit/s)
• Two USARTs with master/slave synchronous SPI
• One SPI (24 Mbit/s) with 4- to 16-bit programmable bitframe
• Serial wire debug (SWD)

Applications:

• null

Package:

• SO8N
• WLCSP12
• TSSOP20
• UFQFPN20

• Includes ST state-of-the-art patented technology
• Core: Arm ® 32-bit Cortex ® -M0+ CPU, frequency up to 48 MHz
• -40°C to 85°C/105°C/125°C operating temperature
• Memories
• -Up to 32 Kbytes of flash memory with protection and securable area
• -6 Kbytes of SRAM with hardware parity check
• CRC calculation unit
• Reset and power management
• -Voltage range: 2.0 V to 3.6 V
• -Power-on / power-down reset (POR/PDR)
• -Programmable brownout reset (BOR)
• -Low-power modes: Sleep, Stop, Standby, Shutdown
• Clock management
• -4 to 48 MHz crystal oscillator
• -32 kHz crystal oscillator with calibration
• -Internal 48 MHz RC oscillator (±1 %)
• -Internal 32 kHz RC oscillator (±5 %)
• Up to 18 fast I/Os
• -All mappable on external interrupt vectors
• -All 5 V-tolerant
• 3-channel DMA controller with flexible mapping
• 12-bit, 0.4 μs ADC (up to 13 ext. channels) -Conversion range: 0 to 3.6 V
• 8 timers: 16-bit for advanced motor control, four 16-bit general-purpose, two watchdogs, SysTick timer
• Calendar RTC with alarm

Figure 3. STM32C011JxM SO8N pinout

Figure 4. STM32C011DxY WLCSP12 ballout

Figure 5. STM32C011FxP TSSOP20 pinout

Figure 6. STM32C011FxU UFQFPN20 pinout

Table 11. Terms and symbols used in the pin assignment table

Table 12. Pin assignment and description

Table 12. Pin assignment and description

Table 12. Pin assignment and description (continued)

Table 13. Port A alternate function mapping (AF0 to AF7)

Table 13. Port A alternate function mapping (AF0 to AF7)

Table 13. Port A alternate function mapping (AF0 to AF7)

The definition and values of input/output AC characteristics are given in Figure 18 and Table 51 , respectively.

Unless otherwise specified, the parameters given are derived from tests performed under the ambient temperature and supply voltage conditions summarized in Table 23: General operating conditions .

Table 51. I/O AC characteristics

Table 51. I/O AC characteristics

Table 51. I/O AC characteristics (continued)

1. The fall time is defined between 70% and 30% of the output waveform, according to I 2 C specification.
2. This value represents the I/O capability but the maximum system frequency is limited to 48 MHz.

Figure 18. I/O AC characteristics definition (1)

1. Refer to Table 51: I/O AC characteristics .

Stresses above the absolute maximum ratings listed in Table 20 , Table 21 and Table 22 may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. The device mission profile (application conditions) is compliant with the JEDEC JESD47 qualification standard.

All voltages are defined with respect to V SS .

Table 20. Voltage characteristics

Table 21. Current characteristics

Table 22. Thermal characteristics

Table 22. Thermal characteristics

The operating junction temperature T J must never exceed the maximum given in Table 23: General operating conditions .

The maximum junction temperature in °C that the device can reach if respecting the operating conditions, is:T _ { J } ( max ) = T _ { A } ( max ) + P _ { D } ( max ) × Θ _ { J A }

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com . ECOPACK is an ST trademark.