STM32C011F6U6TR
ARM Cortex-M0+ MCUThe STM32C011F6U6TR is a arm cortex-m0+ mcu from STMicroelectronics. View the full STM32C011F6U6TR datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
Official STM32C011F6U6TR datasheet (PDF) — the source this page was extracted from.
STM32C011F6U6TR Key Specifications
| Parameter | Value |
|---|---|
| Connectivity | I2C, IrDA, LINbus, SPI, UART/USART |
| Core Processor | ARM® Cortex®-M0+ |
| Core Size | 32-Bit |
| Data Converters | A/D 15x12b SAR |
| DigiKey Programmable | Not Verified |
| Mounting Type | Surface Mount |
| Number of I/O | 18 |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Oscillator Type | External, Internal |
| Package / Case | 20-UFQFN |
| Peripherals | Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT |
| Flash Memory Size | 32KB (32K x 8) |
| Program Memory Type | FLASH |
| RAM Size | 6K x 8 B |
| Clock Speed | 48MHz |
| Supplier Device Package | 20-UFQFPN (3x3) |
| Supply Voltage | 2V ~ 3.6V |
STM32C011F6U6TR Overview
Part: STM32C011F6U6TR — STMicroelectronics
Type: Arm Cortex-M0+ 32-bit MCU
Description: 32-bit Arm Cortex-M0+ MCU at up to 48 MHz with 32 KB flash and 6 KB SRAM, 2.0–3.6 V supply, 2 USARTs, I2C, SPI/I2S, and a 12-bit ADC in a UFQFPN20 package.
Operating Conditions:
- Supply voltage: 2.0–3.6 V
- Operating temperature: -40 to 85 °C (suffix 6 ambient; other grades available: suffix 7 up to 105 °C, suffix 3 up to 125 °C)
- Max AHB/APB clock frequency: 48 MHz
- I/O input voltage: -0.3 V to min(VDDIO1 + 3.6, 5.5) V
Absolute Maximum Ratings:
- Max supply voltage (VDD): 4.0 V
- Max current into VDD/VDDA power pin: 100 mA
- Max output current sunk or sourced by any I/O pin: 20 mA
- Max total output current sunk or sourced by all I/Os: 80 mA
- Max junction temperature: 130 °C
- Storage temperature: -65 to +150 °C
Key Specs:
- Core: Arm Cortex-M0+ up to 48 MHz
- Memory: 32 KB flash with protection and securable area, 6 KB SRAM with hardware parity
- Up to 18 fast I/Os, all 5 V-tolerant
- ADC: 12-bit, 0.4 μs conversion time, up to 13 external channels, 0 to 3.6 V conversion range
- Communication: 1 I2C (Fast-mode Plus, 1 Mbit/s), 2 USARTs, 1 SPI (24 Mbit/s) multiplexed with I2S
- Timers: one 16-bit advanced-control timer, four 16-bit general-purpose timers, two watchdogs, SysTick
- Junction temperature (suffix 6): -40 to 105 °C
- Clock sources: 4–48 MHz crystal oscillator, 32 kHz crystal oscillator, internal 48 MHz RC (±1 %), internal 32 kHz RC (±5 %)
Features:
- 3-channel DMA controller with flexible mapping
- Calendar RTC with alarm
- CRC calculation unit
- Power-on/power-down reset (POR/PDR) and programmable brownout reset (BOR)
- Low-power modes: Sleep, Stop, Standby, Shutdown
- Serial wire debug (SWD)
- SESIP3 and PSA Level 3 target certification
- ECOPACK 2 compliant packages
Applications:
- Consumer, industrial and appliance domains
- Internet of Things (IoT) solutions
Package:
- UFQFPN20 (STM32C011FxU)
- Other family packages: SO8N, WLCSP12, TSSOP20
STM32C011F6U6TR Features
- Includes ST state-of-the-art patented technology
- Core: Arm ® 32-bit Cortex ® -M0+ CPU, frequency up to 48 MHz
- -40°C to 85°C/105°C/125°C operating temperature
- Memories
- -Up to 32 Kbytes of flash memory with protection and securable area
- -6 Kbytes of SRAM with hardware parity check
- CRC calculation unit
- Reset and power management
- -Voltage range: 2.0 V to 3.6 V
- -Power-on / power-down reset (POR/PDR)
- -Programmable brownout reset (BOR)
- -Low-power modes: Sleep, Stop, Standby, Shutdown
- Clock management
- -4 to 48 MHz crystal oscillator
- -32 kHz crystal oscillator with calibration
- -Internal 48 MHz RC oscillator (±1 %)
- -Internal 32 kHz RC oscillator (±5 %)
- Up to 18 fast I/Os
- -All mappable on external interrupt vectors
- -All 5 V-tolerant
- 3-channel DMA controller with flexible mapping
- 12-bit, 0.4 μs ADC (up to 13 ext. channels) -Conversion range: 0 to 3.6 V
- 8 timers: 16-bit for advanced motor control, four 16-bit general-purpose, two watchdogs, SysTick timer
- Calendar RTC with alarm
STM32C011F6U6TR Pin Configuration
Figure 3. STM32C011JxM SO8N pinout
Figure 4. STM32C011DxY WLCSP12 ballout
Figure 5. STM32C011FxP TSSOP20 pinout
Figure 6. STM32C011FxU UFQFPN20 pinout
Table 11. Terms and symbols used in the pin assignment table
| Column | Column | Symbol | Definition |
|---|---|---|---|
| Pin name | Pin name | Terminal name corresponds to its by-default function at reset, unless otherwise specified in parenthesis under the pin name. | Terminal name corresponds to its by-default function at reset, unless otherwise specified in parenthesis under the pin name. |
| S | Supply pin | ||
| Pin type | Pin type | I | Input only pin |
| I/O | Input / output pin | ||
| FT | 5 V tolerant I/O | ||
| RST | Reset pin with embedded weak pull-up resistor | ||
| Options for FT I/Os | Options for FT I/Os | ||
| I/O structure | I/O structure | _f | I/O, Fm+ capable |
| _a | I/O, with analog switch function | ||
| Note | Note | Upon reset, all I/Os are set as analog inputs, unless otherwise specified. | Upon reset, all I/Os are set as analog inputs, unless otherwise specified. |
| Pin | Alternate functions | Functions selected through GPIOx_AFR registers | Functions selected through GPIOx_AFR registers |
| functions | Additional functions | Functions directly selected/enabled through peripheral registers | Functions directly selected/enabled through peripheral registers |
Table 12. Pin assignment and description
| Pin - SO8N | Pin - WLCSP12 | Pin - TSSOP20 | Pin - UFQFPN20 | Pin name (function upon reset) | Pin type | I/O structure | Note | Alternate functions | Additional functions |
|---|---|---|---|---|---|---|---|---|---|
| 1 | B3 | 2 | 20 | PC14-OSCX_IN (PC14) | I/O | FT_f | - | USART1_TX, TIM1_ETR, TIM1_BKIN2, IR_OUT, USART2_RTS_DE_CK, TIM17_CH1, TIM3_CH2, I2C1_SDA, EVENTOUT | OSCX_IN |
| 8 | A4 | 3 | 1 | PC15- OSCX_OUT (PC15) | I/O | FT | - | OSC32_EN, OSC_EN, TIM1_ETR, TIM3_CH3 | OSCX_OUT |
| 2 | C4 | 4 | 2 | VDD/VDDA | S | - | - | - | - |
| 3 | E4 | 5 | 3 | VSS/VSSA | S | - | - | - | - |
| 4 | F3 | 6 | 4 | PF2-NRST | I/O | RST, FT | (1) | MCO, TIM1_CH4 | NRST |
| 4 | F3 | 7 | 5 | PA0 | I/O | FT_a | - | USART2_CTS, TIM16_CH1, USART1_TX, TIM1_CH1 | ADC_IN0, WKUP1 |
Table 12. Pin assignment and description
Table 12. Pin assignment and description (continued)
| Pin - SO8N | Pin - WLCSP12 | Pin - TSSOP20 | Pin - UFQFPN20 | Pin name (function upon reset) | Pin type | I/O structure | Note | Alternate functions | Additional functions |
|---|---|---|---|---|---|---|---|---|---|
| 4 | F3 | 8 | 6 | PA1 | I/O | FT_a | - | SPI1_SCK/I2S1_CK, USART2_RTS_DE_CK, TIM17_CH1, USART1_RX, TIM1_CH2, I2C1_SMBA, EVENTOUT | ADC_IN1 |
| 4 | F3 | 9 | 7 | PA2 | I/O | FT_a | - | SPI1_MOSI/I2S1_SD, USART2_TX, TIM16_CH1N, TIM3_ETR, TIM1_CH3 | ADC_IN2, WKUP4,LSCO |
| - | F1 | 10 | 8 | PA3 | I/O | FT_a | - | USART2_RX, TIM1_CH1N, TIM1_CH4, EVENTOUT | ADC_IN3 |
| - | F1 | 11 | 9 | PA4 | I/O | FT_a | - | SPI1_NSS/I2S1_WS, USART2_TX, TIM1_CH2N, TIM14_CH1, TIM17_CH1N, EVENTOUT | ADC_IN4, RTC_TS, RTC_OUT1, WKUP2 |
| - | F1 | 12 | 10 | PA5 | I/O | FT_a | - | SPI1_SCK/I2S1_CK, USART2_RX, TIM1_CH3N, TIM1_CH1, EVENTOUT | ADC_IN5 |
| - | F1 | 13 | 11 | PA6 | I/O | FT_a | - | SPI1_MISO/I2S1_MCK, TIM3_CH1, TIM1_BKIN, TIM16_CH1 | ADC_IN6 |
| - | E2 | 14 | 12 | PA7 | I/O | FT_a | - | SPI1_MOSI/I2S1_SD, TIM3_CH2, TIM1_CH1N, TIM14_CH1, TIM17_CH1 | ADC_IN7 |
| 5 | D1 | 15 | 13 | PA8 | I/O | FT_a | - | MCO, USART2_TX, TIM1_CH1, EVENTOUT, SPI1_NSS/I2S1_WS, TIM1_CH2N, TIM1_CH3N, TIM3_CH3, TIM3_CH4, TIM14_CH1, USART1_RX, MCO2 | ADC_IN8 |
| - | - | - | - | PA9 | I/O | FT_f | (2) | MCO, USART1_TX, TIM1_CH2, TIM3_ETR, I2C1_SCL, EVENTOUT | - |
| - | - | - | - | PA10 | I/O | FT_f | (2) | USART1_RX, TIM1_CH3, MCO2, TIM17_BKIN, I2C1_SDA, EVENTOUT | - |
| 5 | D1 | 16 | 14 | PA11 [PA9] | I/O | FT_a | (2) | SPI1_MISO/I2S1_MCK, USART1_CTS, TIM1_CH4, TIM1_BKIN2 | ADC_IN11 |
| 6 | E2 | 17 | 15 | PA12 [PA10] | I/O | FT_a | (2) | SPI1_MOSI/I2S1_SD, USART1_RTS_DE_CK, TIM1_ETR, I2S_CKIN | ADC_IN12 |
| 7 | B1 | 18 | 16 | PA13 | I/O | FT_a | (3) | SWDIO, IR_OUT, TIM3_ETR, USART2_RX, EVENTOUT | ADC_IN13 |
| 8 | C2 | 19 | 17 | PA14-BOOT0 | I/O | FT_a | (3) | SWCLK, USART2_TX, EVENTOUT, SPI1_NSS/I2S1_WS, USART2_RX, TIM1_CH1, MCO2, USART1_RTS_DE_CK | ADC_IN14, BOOT0 |
| 8 | A2 | 20 | 18 | PB6 | I/O | FT_f | - | USART1_TX, TIM1_CH3, TIM16_CH1N, TIM3_CH3, USART1_RTS_DE_CK, USART1_CTS, I2C1_SCL, I2C1_SMBA, SPI1_MOSI/I2S1_SD, SPI1_MISO/I2S1_MCK, SPI1_SCK/I2S1_CK, TIM1_CH2, TIM3_CH1, TIM3_CH2, TIM16_BKIN, TIM17_BKIN | WKUP3 |
| 1 | D3 | 1 | 19 | PB7 | I/O | FT_f | - | USART1_RX, TIM1_CH4, TIM17_CH1N, TIM3_CH4, I2C1_SDA, EVENTOUT, USART2_CTS, TIM16_CH1, TIM3_CH1, I2C1_SCL | RTC_REFIN |
Table 13. Port A alternate function mapping (AF0 to AF7)
| Port | AF0 | AF1 | AF2 | AF3 | AF4 | AF5 | AF6 | AF7 |
|---|---|---|---|---|---|---|---|---|
| PA0 | - | USART2_CTS | TIM16_CH1 | - | USART1_TX | TIM1_CH1 | - | - |
| PA1 | SPI1_SCK/I2S1_ CK | USART2_RTS_ DE_CK | TIM17_CH1 | - | USART1_RX | TIM1_CH2 | I2C1_SMBA | EVENTOUT |
| PA2 | SPI1_MOSI/I2S1 _SD | USART2_TX | TIM16_CH1N | TIM3_ETR | - | TIM1_CH3 | - | - |
| PA3 | - | USART2_RX | TIM1_CH1N | - | - | TIM1_CH4 | - | EVENTOUT |
| PA4 | SPI1_NSS/I2S1_ WS | USART2_TX | TIM1_CH2N | - | TIM14_CH1 | TIM17_CH1N | - | EVENTOUT |
| PA5 | SPI1_SCK/I2S1_ CK | USART2_RX | TIM1_CH3N | - | - | TIM1_CH1 | - | EVENTOUT |
| PA6 | SPI1_MISO/I2S1 _MCK | TIM3_CH1 | TIM1_BKIN | - | - | TIM16_CH1 | - | - |
| PA7 | SPI1_MOSI/I2S1 _SD | TIM3_CH2 | TIM1_CH1N | - | TIM14_CH1 | TIM17_CH1 | - | - |
| PA8 | MCO | USART2_TX | TIM1_CH1 | - | - | - | - | EVENTOUT |
| PA9 | MCO | USART1_TX | TIM1_CH2 | TIM3_ETR | - | - | I2C1_SCL | EVENTOUT |
| PA10 | - | USART1_RX | TIM1_CH3 | MCO2 | - | TIM17_BKIN | I2C1_SDA | EVENTOUT |
| PA11 | SPI1_MISO/I2S1 _MCK | USART1_CTS | TIM1_CH4 | - | - | TIM1_BKIN2 | - | - |
| PA12 | SPI1_MOSI/I2S1 _SD | USART1_RTS_ DE_CK | TIM1_ETR | - | - | I2S_CKIN | - | - |
| PA13 | SWDIO | IR_OUT | - | TIM3_ETR | USART2_RX | - | - | EVENTOUT |
| PA14 | SWCLK | USART2_TX | - | - | - | - | - | EVENTOUT |
Table 13. Port A alternate function mapping (AF0 to AF7)
STM32C011F6U6TR Electrical Characteristics
The definition and values of input/output AC characteristics are given in Figure 18 and Table 51 , respectively.
Unless otherwise specified, the parameters given are derived from tests performed under the ambient temperature and supply voltage conditions summarized in Table 23: General operating conditions .
Table 51. I/O AC characteristics
| Speed | Symbol | Parameter (1)(2) | Conditions | Min | Max | Unit |
|---|---|---|---|---|---|---|
| 00 | Fmax | Maximum frequency | C=50 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V | - | 2 | MHz |
| 00 | Fmax | Maximum frequency | C=50 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V | - | 0.35 | MHz |
| 00 | Fmax | Maximum frequency | C=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V | - | 3.00 | MHz |
| 00 | Fmax | Maximum frequency | C=10 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V | - | 0.45 | MHz |
| 00 | Tr/Tf | Output rise and fall time (3) | C=50 pF,2.7 V ≤ V DDIO1 ≤ 3.6 V | - | 100.00 | ns |
| 00 | Tr/Tf | Output rise and fall time (3) | C=50 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V | - | 225.00 | ns |
| 00 | Tr/Tf | Output rise and fall time (3) | C=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V | - | 75.00 | ns |
| 00 | Tr/Tf | Output rise and fall time (3) | C=10 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V | - | 150.00 | ns |
Table 51. I/O AC characteristics
Table 51. I/O AC characteristics (continued)
| Speed | Symbol | Parameter (1)(2) | Conditions | Min | Max | Unit |
|---|---|---|---|---|---|---|
| 01 | C=50 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V | - | 10.00 | MHz | ||
| 01 | Fmax | Maximum frequency | C=50 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V | - | 2.00 | MHz |
| 01 | C=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V | - | 15.00 | MHz | ||
| 01 | C=10 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V | - | 2.50 | MHz | ||
| 01 | Tr/Tf | rise and fall time (3) | C=50 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V | - | 30.00 | ns |
| 01 | Tr/Tf | rise and fall time (3) | C=50 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V | - | 60.00 | ns |
| 01 | Tr/Tf | rise and fall time (3) | C=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V | - | 15.00 | ns |
| 01 | Tr/Tf | rise and fall time (3) | C=10 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V | - | 30.00 | ns |
| 10 | Fmax | Maximum frequency | C=50 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V | - | 30.00 | MHz |
| 10 | Fmax | Maximum frequency | C=50 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V | - | 15.00 | MHz |
| 10 | Fmax | Maximum frequency | C=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V | - | 60.00 (4) | MHz |
| 10 | Fmax | Maximum frequency | C=10 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V | - | 30.00 | MHz |
| 10 | Tr/Tf | rise and fall time (3) | C=50 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V | - | 11.00 | ns |
| 10 | Tr/Tf | rise and fall time (3) | C=50 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V | - | 22.00 | ns |
| 10 | Tr/Tf | rise and fall time (3) | C=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V | - | 4.00 | ns |
| 10 | Tr/Tf | rise and fall time (3) | C=10 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V | - | 8.00 | ns |
| 11 | Fmax | Maximum frequency | C=30 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V | - | 60.00 (4) | MHz |
| 11 | Fmax | Maximum frequency | C=30 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V | - | 30.00 | MHz |
| 11 | Fmax | Maximum frequency | C=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V | - | 80.00 (4) | MHz |
| 11 | Fmax | Maximum frequency | C=10 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V | - | 40.00 | MHz |
| rise and fall time (3) | C=30 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V | - | 5.50 | ns | ||
| Tr/Tf | rise and fall time (3) | C=30 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V | - | 11.00 | ns | |
| rise and fall time (3) | C=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V | - | 2.50 | ns | ||
| rise and fall time (3) | C=10 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V | - | 5.00 | ns |
- The fall time is defined between 70% and 30% of the output waveform, according to I 2 C specification.
- This value represents the I/O capability but the maximum system frequency is limited to 48 MHz.
Figure 18. I/O AC characteristics definition (1)
- Refer to Table 51: I/O AC characteristics .
STM32C011F6U6TR Absolute Maximum Ratings
Stresses above the absolute maximum ratings listed in Table 20 , Table 21 and Table 22 may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. The device mission profile (application conditions) is compliant with the JEDEC JESD47 qualification standard.
All voltages are defined with respect to V SS .
Table 20. Voltage characteristics
| Symbol | Ratings | Min | Max | Unit |
|---|---|---|---|---|
| V DD | External supply voltage | - 0.3 | 4.0 | V |
| V IN (1) | Input voltage on pin | - 0.3 | V DDIO1 + 4.0 (2)(3) | V |
Table 21. Current characteristics
| Symbol | Ratings | Max | Unit |
|---|---|---|---|
| I VDD/VDDA | Current into VDD/VDDA power pin (source) | 100 | mA |
| I VSS/VSSA | Current out of VSS/VSSA ground pin (sink) | 100 | mA |
| I IO(PIN) | Output current sunk by any I/O and control pin | 20 | mA |
| I IO(PIN) | Output current sourced by any I/O and control pin | 20 | mA |
| ∑ I (PIN) | Total output current sunk by sum of all I/Os and control pins (1) | 80 | mA |
| ∑ I (PIN) | Total output current sourced by sum of all I/Os and control pins (1) | 80 | mA |
| I INJ(PIN) (1)(2) | Injected current on a FT_xx pin | -5 / NA | mA |
| ∑ I INJ(PIN) | Total injected current (sum of all I/Os and control pins) (3) | -25 | mA |
Table 22. Thermal characteristics
| Symbol | Ratings | Value | Unit |
|---|---|---|---|
| T STG | Storage temperature range | -65 to +150 | °C |
| T J | Maximum junction temperature | 130 | °C |
Table 22. Thermal characteristics
STM32C011F6U6TR Thermal Information
The operating junction temperature T J must never exceed the maximum given in Table 23: General operating conditions .
The maximum junction temperature in °C that the device can reach if respecting the operating conditions, is:
$$T_J(max) = T_A(max) + P_D(max) \times \Theta_{JA}$$
STM32C011F6U6TR Package Information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com . ECOPACK is an ST trademark.
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