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STM32C011F6U6TR

ARM Cortex-M0+ MCU

The STM32C011F6U6TR is a arm cortex-m0+ mcu from STMicroelectronics. View the full STM32C011F6U6TR datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

Official STM32C011F6U6TR datasheet (PDF) — the source this page was extracted from.

Manufacturer

STMicroelectronics

Package

20-UFQFN

STM32C011F6U6TR Key Specifications

ParameterValue
ConnectivityI2C, IrDA, LINbus, SPI, UART/USART
Core ProcessorARM® Cortex®-M0+
Core Size32-Bit
Data ConvertersA/D 15x12b SAR
DigiKey ProgrammableNot Verified
Mounting TypeSurface Mount
Number of I/O18
Operating Temperature-40°C ~ 85°C (TA)
Oscillator TypeExternal, Internal
Package / Case20-UFQFN
PeripheralsBrown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Flash Memory Size32KB (32K x 8)
Program Memory TypeFLASH
RAM Size6K x 8 B
Clock Speed48MHz
Supplier Device Package20-UFQFPN (3x3)
Supply Voltage2V ~ 3.6V

STM32C011F6U6TR Overview

Part: STM32C011F6U6TR — STMicroelectronics

Type: Arm Cortex-M0+ 32-bit MCU

Description: 32-bit Arm Cortex-M0+ MCU at up to 48 MHz with 32 KB flash and 6 KB SRAM, 2.0–3.6 V supply, 2 USARTs, I2C, SPI/I2S, and a 12-bit ADC in a UFQFPN20 package.

Operating Conditions:

  • Supply voltage: 2.0–3.6 V
  • Operating temperature: -40 to 85 °C (suffix 6 ambient; other grades available: suffix 7 up to 105 °C, suffix 3 up to 125 °C)
  • Max AHB/APB clock frequency: 48 MHz
  • I/O input voltage: -0.3 V to min(VDDIO1 + 3.6, 5.5) V

Absolute Maximum Ratings:

  • Max supply voltage (VDD): 4.0 V
  • Max current into VDD/VDDA power pin: 100 mA
  • Max output current sunk or sourced by any I/O pin: 20 mA
  • Max total output current sunk or sourced by all I/Os: 80 mA
  • Max junction temperature: 130 °C
  • Storage temperature: -65 to +150 °C

Key Specs:

  • Core: Arm Cortex-M0+ up to 48 MHz
  • Memory: 32 KB flash with protection and securable area, 6 KB SRAM with hardware parity
  • Up to 18 fast I/Os, all 5 V-tolerant
  • ADC: 12-bit, 0.4 μs conversion time, up to 13 external channels, 0 to 3.6 V conversion range
  • Communication: 1 I2C (Fast-mode Plus, 1 Mbit/s), 2 USARTs, 1 SPI (24 Mbit/s) multiplexed with I2S
  • Timers: one 16-bit advanced-control timer, four 16-bit general-purpose timers, two watchdogs, SysTick
  • Junction temperature (suffix 6): -40 to 105 °C
  • Clock sources: 4–48 MHz crystal oscillator, 32 kHz crystal oscillator, internal 48 MHz RC (±1 %), internal 32 kHz RC (±5 %)

Features:

  • 3-channel DMA controller with flexible mapping
  • Calendar RTC with alarm
  • CRC calculation unit
  • Power-on/power-down reset (POR/PDR) and programmable brownout reset (BOR)
  • Low-power modes: Sleep, Stop, Standby, Shutdown
  • Serial wire debug (SWD)
  • SESIP3 and PSA Level 3 target certification
  • ECOPACK 2 compliant packages

Applications:

  • Consumer, industrial and appliance domains
  • Internet of Things (IoT) solutions

Package:

  • UFQFPN20 (STM32C011FxU)
  • Other family packages: SO8N, WLCSP12, TSSOP20

STM32C011F6U6TR Features

  • Includes ST state-of-the-art patented technology
  • Core: Arm ® 32-bit Cortex ® -M0+ CPU, frequency up to 48 MHz
  • -40°C to 85°C/105°C/125°C operating temperature
  • Memories
  • -Up to 32 Kbytes of flash memory with protection and securable area
  • -6 Kbytes of SRAM with hardware parity check
  • CRC calculation unit
  • Reset and power management
  • -Voltage range: 2.0 V to 3.6 V
  • -Power-on / power-down reset (POR/PDR)
  • -Programmable brownout reset (BOR)
  • -Low-power modes: Sleep, Stop, Standby, Shutdown
  • Clock management
  • -4 to 48 MHz crystal oscillator
  • -32 kHz crystal oscillator with calibration
  • -Internal 48 MHz RC oscillator (±1 %)
  • -Internal 32 kHz RC oscillator (±5 %)
  • Up to 18 fast I/Os
  • -All mappable on external interrupt vectors
  • -All 5 V-tolerant
  • 3-channel DMA controller with flexible mapping
  • 12-bit, 0.4 μs ADC (up to 13 ext. channels) -Conversion range: 0 to 3.6 V
  • 8 timers: 16-bit for advanced motor control, four 16-bit general-purpose, two watchdogs, SysTick timer
  • Calendar RTC with alarm

STM32C011F6U6TR Pin Configuration

Figure 3. STM32C011JxM SO8N pinout

Figure 4. STM32C011DxY WLCSP12 ballout

Figure 5. STM32C011FxP TSSOP20 pinout

Figure 6. STM32C011FxU UFQFPN20 pinout

Table 11. Terms and symbols used in the pin assignment table

ColumnColumnSymbolDefinition
Pin namePin nameTerminal name corresponds to its by-default function at reset, unless otherwise specified in parenthesis under the pin name.Terminal name corresponds to its by-default function at reset, unless otherwise specified in parenthesis under the pin name.
SSupply pin
Pin typePin typeIInput only pin
I/OInput / output pin
FT5 V tolerant I/O
RSTReset pin with embedded weak pull-up resistor
Options for FT I/OsOptions for FT I/Os
I/O structureI/O structure_fI/O, Fm+ capable
_aI/O, with analog switch function
NoteNoteUpon reset, all I/Os are set as analog inputs, unless otherwise specified.Upon reset, all I/Os are set as analog inputs, unless otherwise specified.
PinAlternate functionsFunctions selected through GPIOx_AFR registersFunctions selected through GPIOx_AFR registers
functionsAdditional functionsFunctions directly selected/enabled through peripheral registersFunctions directly selected/enabled through peripheral registers

Table 12. Pin assignment and description

Pin - SO8NPin - WLCSP12Pin - TSSOP20Pin - UFQFPN20Pin name (function upon reset)Pin typeI/O structureNoteAlternate functionsAdditional functions
1B3220PC14-OSCX_IN (PC14)I/OFT_f-USART1_TX, TIM1_ETR, TIM1_BKIN2, IR_OUT, USART2_RTS_DE_CK, TIM17_CH1, TIM3_CH2, I2C1_SDA, EVENTOUTOSCX_IN
8A431PC15- OSCX_OUT (PC15)I/OFT-OSC32_EN, OSC_EN, TIM1_ETR, TIM3_CH3OSCX_OUT
2C442VDD/VDDAS----
3E453VSS/VSSAS----
4F364PF2-NRSTI/ORST, FT(1)MCO, TIM1_CH4NRST
4F375PA0I/OFT_a-USART2_CTS, TIM16_CH1, USART1_TX, TIM1_CH1ADC_IN0, WKUP1

Table 12. Pin assignment and description

Table 12. Pin assignment and description (continued)

Pin - SO8NPin - WLCSP12Pin - TSSOP20Pin - UFQFPN20Pin name (function upon reset)Pin typeI/O structureNoteAlternate functionsAdditional functions
4F386PA1I/OFT_a-SPI1_SCK/I2S1_CK, USART2_RTS_DE_CK, TIM17_CH1, USART1_RX, TIM1_CH2, I2C1_SMBA, EVENTOUTADC_IN1
4F397PA2I/OFT_a-SPI1_MOSI/I2S1_SD, USART2_TX, TIM16_CH1N, TIM3_ETR, TIM1_CH3ADC_IN2, WKUP4,LSCO
-F1108PA3I/OFT_a-USART2_RX, TIM1_CH1N, TIM1_CH4, EVENTOUTADC_IN3
-F1119PA4I/OFT_a-SPI1_NSS/I2S1_WS, USART2_TX, TIM1_CH2N, TIM14_CH1, TIM17_CH1N, EVENTOUTADC_IN4, RTC_TS, RTC_OUT1, WKUP2
-F11210PA5I/OFT_a-SPI1_SCK/I2S1_CK, USART2_RX, TIM1_CH3N, TIM1_CH1, EVENTOUTADC_IN5
-F11311PA6I/OFT_a-SPI1_MISO/I2S1_MCK, TIM3_CH1, TIM1_BKIN, TIM16_CH1ADC_IN6
-E21412PA7I/OFT_a-SPI1_MOSI/I2S1_SD, TIM3_CH2, TIM1_CH1N, TIM14_CH1, TIM17_CH1ADC_IN7
5D11513PA8I/OFT_a-MCO, USART2_TX, TIM1_CH1, EVENTOUT, SPI1_NSS/I2S1_WS, TIM1_CH2N, TIM1_CH3N, TIM3_CH3, TIM3_CH4, TIM14_CH1, USART1_RX, MCO2ADC_IN8
----PA9I/OFT_f(2)MCO, USART1_TX, TIM1_CH2, TIM3_ETR, I2C1_SCL, EVENTOUT-
----PA10I/OFT_f(2)USART1_RX, TIM1_CH3, MCO2, TIM17_BKIN, I2C1_SDA, EVENTOUT-
5D11614PA11 [PA9]I/OFT_a(2)SPI1_MISO/I2S1_MCK, USART1_CTS, TIM1_CH4, TIM1_BKIN2ADC_IN11
6E21715PA12 [PA10]I/OFT_a(2)SPI1_MOSI/I2S1_SD, USART1_RTS_DE_CK, TIM1_ETR, I2S_CKINADC_IN12
7B11816PA13I/OFT_a(3)SWDIO, IR_OUT, TIM3_ETR, USART2_RX, EVENTOUTADC_IN13
8C21917PA14-BOOT0I/OFT_a(3)SWCLK, USART2_TX, EVENTOUT, SPI1_NSS/I2S1_WS, USART2_RX, TIM1_CH1, MCO2, USART1_RTS_DE_CKADC_IN14, BOOT0
8A22018PB6I/OFT_f-USART1_TX, TIM1_CH3, TIM16_CH1N, TIM3_CH3, USART1_RTS_DE_CK, USART1_CTS, I2C1_SCL, I2C1_SMBA, SPI1_MOSI/I2S1_SD, SPI1_MISO/I2S1_MCK, SPI1_SCK/I2S1_CK, TIM1_CH2, TIM3_CH1, TIM3_CH2, TIM16_BKIN, TIM17_BKINWKUP3
1D3119PB7I/OFT_f-USART1_RX, TIM1_CH4, TIM17_CH1N, TIM3_CH4, I2C1_SDA, EVENTOUT, USART2_CTS, TIM16_CH1, TIM3_CH1, I2C1_SCLRTC_REFIN

Table 13. Port A alternate function mapping (AF0 to AF7)

PortAF0AF1AF2AF3AF4AF5AF6AF7
PA0-USART2_CTSTIM16_CH1-USART1_TXTIM1_CH1--
PA1SPI1_SCK/I2S1_ CKUSART2_RTS_ DE_CKTIM17_CH1-USART1_RXTIM1_CH2I2C1_SMBAEVENTOUT
PA2SPI1_MOSI/I2S1 _SDUSART2_TXTIM16_CH1NTIM3_ETR-TIM1_CH3--
PA3-USART2_RXTIM1_CH1N--TIM1_CH4-EVENTOUT
PA4SPI1_NSS/I2S1_ WSUSART2_TXTIM1_CH2N-TIM14_CH1TIM17_CH1N-EVENTOUT
PA5SPI1_SCK/I2S1_ CKUSART2_RXTIM1_CH3N--TIM1_CH1-EVENTOUT
PA6SPI1_MISO/I2S1 _MCKTIM3_CH1TIM1_BKIN--TIM16_CH1--
PA7SPI1_MOSI/I2S1 _SDTIM3_CH2TIM1_CH1N-TIM14_CH1TIM17_CH1--
PA8MCOUSART2_TXTIM1_CH1----EVENTOUT
PA9MCOUSART1_TXTIM1_CH2TIM3_ETR--I2C1_SCLEVENTOUT
PA10-USART1_RXTIM1_CH3MCO2-TIM17_BKINI2C1_SDAEVENTOUT
PA11SPI1_MISO/I2S1 _MCKUSART1_CTSTIM1_CH4--TIM1_BKIN2--
PA12SPI1_MOSI/I2S1 _SDUSART1_RTS_ DE_CKTIM1_ETR--I2S_CKIN--
PA13SWDIOIR_OUT-TIM3_ETRUSART2_RX--EVENTOUT
PA14SWCLKUSART2_TX-----EVENTOUT

Table 13. Port A alternate function mapping (AF0 to AF7)

STM32C011F6U6TR Electrical Characteristics

The definition and values of input/output AC characteristics are given in Figure 18 and Table 51 , respectively.

Unless otherwise specified, the parameters given are derived from tests performed under the ambient temperature and supply voltage conditions summarized in Table 23: General operating conditions .

Table 51. I/O AC characteristics

SpeedSymbolParameter (1)(2)ConditionsMinMaxUnit
00FmaxMaximum frequencyC=50 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-2MHz
00FmaxMaximum frequencyC=50 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V-0.35MHz
00FmaxMaximum frequencyC=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-3.00MHz
00FmaxMaximum frequencyC=10 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V-0.45MHz
00Tr/TfOutput rise and fall time (3)C=50 pF,2.7 V ≤ V DDIO1 ≤ 3.6 V-100.00ns
00Tr/TfOutput rise and fall time (3)C=50 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V-225.00ns
00Tr/TfOutput rise and fall time (3)C=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-75.00ns
00Tr/TfOutput rise and fall time (3)C=10 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V-150.00ns

Table 51. I/O AC characteristics

Table 51. I/O AC characteristics (continued)

SpeedSymbolParameter (1)(2)ConditionsMinMaxUnit
01C=50 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-10.00MHz
01FmaxMaximum frequencyC=50 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V-2.00MHz
01C=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-15.00MHz
01C=10 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V-2.50MHz
01Tr/Tfrise and fall time (3)C=50 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-30.00ns
01Tr/Tfrise and fall time (3)C=50 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V-60.00ns
01Tr/Tfrise and fall time (3)C=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-15.00ns
01Tr/Tfrise and fall time (3)C=10 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V-30.00ns
10FmaxMaximum frequencyC=50 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-30.00MHz
10FmaxMaximum frequencyC=50 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V-15.00MHz
10FmaxMaximum frequencyC=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-60.00 (4)MHz
10FmaxMaximum frequencyC=10 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V-30.00MHz
10Tr/Tfrise and fall time (3)C=50 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-11.00ns
10Tr/Tfrise and fall time (3)C=50 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V-22.00ns
10Tr/Tfrise and fall time (3)C=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-4.00ns
10Tr/Tfrise and fall time (3)C=10 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V-8.00ns
11FmaxMaximum frequencyC=30 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-60.00 (4)MHz
11FmaxMaximum frequencyC=30 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V-30.00MHz
11FmaxMaximum frequencyC=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-80.00 (4)MHz
11FmaxMaximum frequencyC=10 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V-40.00MHz
rise and fall time (3)C=30 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-5.50ns
Tr/Tfrise and fall time (3)C=30 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V-11.00ns
rise and fall time (3)C=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-2.50ns
rise and fall time (3)C=10 pF, 2.0 V ≤ V DDIO1 ≤ 2.7 V-5.00ns
  1. The fall time is defined between 70% and 30% of the output waveform, according to I 2 C specification.
  2. This value represents the I/O capability but the maximum system frequency is limited to 48 MHz.

Figure 18. I/O AC characteristics definition (1)

  1. Refer to Table 51: I/O AC characteristics .

STM32C011F6U6TR Absolute Maximum Ratings

Stresses above the absolute maximum ratings listed in Table 20 , Table 21 and Table 22 may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. The device mission profile (application conditions) is compliant with the JEDEC JESD47 qualification standard.

All voltages are defined with respect to V SS .

Table 20. Voltage characteristics

SymbolRatingsMinMaxUnit
V DDExternal supply voltage- 0.34.0V
V IN (1)Input voltage on pin- 0.3V DDIO1 + 4.0 (2)(3)V

Table 21. Current characteristics

SymbolRatingsMaxUnit
I VDD/VDDACurrent into VDD/VDDA power pin (source)100mA
I VSS/VSSACurrent out of VSS/VSSA ground pin (sink)100mA
I IO(PIN)Output current sunk by any I/O and control pin20mA
I IO(PIN)Output current sourced by any I/O and control pin20mA
∑ I (PIN)Total output current sunk by sum of all I/Os and control pins (1)80mA
∑ I (PIN)Total output current sourced by sum of all I/Os and control pins (1)80mA
I INJ(PIN) (1)(2)Injected current on a FT_xx pin-5 / NAmA
∑ I INJ(PIN)Total injected current (sum of all I/Os and control pins) (3)-25mA

Table 22. Thermal characteristics

SymbolRatingsValueUnit
T STGStorage temperature range-65 to +150°C
T JMaximum junction temperature130°C

Table 22. Thermal characteristics

STM32C011F6U6TR Thermal Information

The operating junction temperature T J must never exceed the maximum given in Table 23: General operating conditions .

The maximum junction temperature in °C that the device can reach if respecting the operating conditions, is:

$$T_J(max) = T_A(max) + P_D(max) \times \Theta_{JA}$$

STM32C011F6U6TR Package Information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com . ECOPACK is an ST trademark.

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