STM32L052K8T7

Part: STM32L052K8T7 — STMicroelectronics (STM32L052x6/x8 family)

Type: Ultra-low-power ARM Cortex-M0+ MCU

Description: 32-bit Arm Cortex-M0+ MCU at up to 32 MHz with up to 64 KB Flash, 8 KB SRAM and 2 KB data EEPROM, 1.65–3.6 V supply, USB 2.0, 12-bit ADC and DAC.

Operating Conditions:

• Supply voltage (VDD): 1.65–3.6 V (BOR disabled); 1.8–3.6 V at power-on with BOR enabled
• Operating temperature: -40 to 105 °C for the T7 suffix (range 7); range 6 is -40 to 85 °C and range 3 is -40 to 125 °C
• Max CPU/bus clock: 32 MHz
• Junction temperature range (range 7): -40 to 125 °C
• VIN on FT/FTf/RST pins: up to 5.5 V (VDD ≥ 2.0 V), 5.2 V (VDD 1.65–2.0 V)

Absolute Maximum Ratings:

• Max supply voltage (VDD − VSS): 4.0 V
• Input voltage on FT/FTf pins: VSS − 0.3 to VDD + 4.0 V
• Total current into all VDD lines: 105 mA
• Max current per VDD or VSS pin: 100 mA
• Max output current sunk by any I/O (except FTf): 16 mA; FTf pins: 22 mA
• Max output current sourced by any I/O: -16 mA
• Max junction temperature: 150 °C
• Storage temperature: -65 to +150 °C

Key Specs:

• Supply range: 1.65–3.6 V
• Max HCLK/PCLK frequency: 32 MHz
• Run mode consumption: 88 μA/MHz
• Stop mode: 0.4 μA; Standby mode: 0.27 μA (2 wakeup pins)
• Stop mode with RTC and 8 KB RAM retention: 0.8 μA
• Wakeup time: 3.5 μs (from RAM), 5 μs (from Flash)
• 12-bit ADC: 1.14 Msps, up to 16 channels (down to 1.65 V)
• VDD_USB: 3.0–3.6 V when USB is used
• Power dissipation at TA = 105 °C (range 7): 351 mW (LQFP32), 526 mW (UFQFPN32)

Features:

• Arm Cortex-M0+ core with MPU, 0.95 DMIPS/MHz
• Up to 64 KB Flash with ECC, 8 KB RAM, 2 KB data EEPROM with ECC, 20-byte backup registers
• Up to 51 fast I/Os (45 are 5 V tolerant)
• BOR with 5 selectable thresholds, POR/PDR, PVD
• 12-bit ADC, 1-channel 12-bit DAC, 2 ultra-low-power comparators
• Up to 24 capacitive sensing channels
• 7-channel DMA controller
• USB 2.0 crystal-less with battery charging detection and LPM
• 2x USART, 1x low-power UART, up to 4x SPI (16 Mbit/s), 2x I2C (SMBus/PMBus)
• 9 timers and 2 watchdogs
• CRC unit, 96-bit unique ID, true RNG, firewall
• Serial wire debug, pre-programmed bootloader (USART, SPI)
• Clock sources: 1–25 MHz crystal oscillator, 32 kHz RTC oscillator, 16 MHz HSI, 37 kHz LSI, multispeed MSI, 48 MHz RC for USB, PLL
• ECOPACK2 packages

Applications:

• Ultra-low-power battery-powered embedded systems
• Touch-sensing user interfaces
• USB-connected devices

Package:

• LQFP32 (7x7 mm), the package of the K-series 32-pin variant
• Family also offered in UFQFPN32 (5x5 mm), LQFP48 (7x7 mm), UFQFPN48 (7x7 mm), LQFP64 (10x10 mm), TFBGA64 (5x5 mm) and standard/thin WLCSP36 (2.61x2.88 mm)

Figure 3. STM32L052x6/8 LQFP64 pinout

1. The above figure shows the package top view.
2. The I/O pins supplied by VDD_USB are shown in grey.

Figure 4. STM32L052x6/8 TFBGA64 ballout

1. The above figure shows the package top view.
2. the I/O pins supplied by VDD_USB are shown in grey.

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Figure 5. STM32L052x6/8 LQFP48 pinout

1. The above figure shows the package top view.
2. The I/O pins supplied by VDD_USB are shown in grey.
3. The above figure shows the package top view.
4. The I/O pins supplied by VDD_USB are shown in grey.

Figure 6. STM32L052x6/8 UFQFPN48

Figure 7. STM32L052x6/8 WLCSP36 ballout

1. The above figure shows the package top view.
2. The above figure shows the package top view.

Figure 8. STM32L052x6/8 LQFP32 pinout

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Figure 9. STM32L052x6/8 UFQFPN32 pinout

1. The above figure shows the package top view.

Table 15. Legend/abbreviations used in the pinout table

Table 15. Legend/abbreviations used in the pinout table

Table 16. STM32L052x6/8 pin definitions

Table 16. STM32L052x6/8 pin definitions

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Table 16. STM32L052x6/8 pin definitions (continued)

Table 16. STM32L052x6/8 pin definitions (continued)

Table 16. STM32L052x6/8 pin definitions (continued)

Table 16. STM32L052x6/8 pin definitions (continued)

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Table 16. STM32L052x6/8 pin definitions (continued)

Table 16. STM32L052x6/8 pin definitions (continued)

Table 16. STM32L052x6/8 pin definitions (continued)

Table 16. STM32L052x6/8 pin definitions (continued)

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Table 16. STM32L052x6/8 pin definitions (continued)

1. PB9/12/13/14/15, PH0/1 and PC13 GPIOs should be configured as output and driven Low, even if they are not available on this package.

2. PA4 offers a reduced touch sensing sensitivity. It is thus recommended to use it as sampling capacitor I/O.

3. These pins are powered by VDD_USB. For all characteristics that refer to V DD , V DD_USB must be used instead.

Table 17. Alternate function port A

Table 18. Alternate function port B

Table 18. Alternate function port B

Table 19. Alternate function port C

Table 19. Alternate function port C

The definition and values of input/output AC characteristics are given in Figure 26 and Table 61 , respectively.

Unless otherwise specified, the parameters given in Table 61 are derived from tests performed under ambient temperature and V DD supply voltage conditions summarized in Table 25 .

Table 61. I/O AC characteristics (1)

1. The maximum frequency is defined in Figure 26 .
2. When Fm+ configuration is set, the I/O speed control is bypassed. Refer to the line reference manual for a detailed description of Fm+ I/O configuration.

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Figure 26. I/O AC characteristics definition

Stresses above the absolute maximum ratings listed in Table 22: Voltage characteristics , Table 23: Current characteristics , and Table 24: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Device mission profile (application conditions) is compliant with JEDEC JESD47 Qualification Standard. Extended mission profiles are available on demand.

Table 22. Voltage characteristics

Table 23. Current characteristics

1. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be sunk/sourced between two consecutive power supply pins referring to high pin count LQFP packages.
2. Positive current injection is not possible on these I/Os. A negative injection is induced by V IN <V SS . I INJ(PIN) must never be exceeded. Refer to Table 22 for maximum allowed input voltage values.
3. A positive injection is induced by V IN > V DD while a negative injection is induced by V IN < V SS . I INJ(PIN) must never be exceeded. Refer to Table 22: Voltage characteristics for the maximum allowed input voltage values.
4. When several inputs are submitted to a current injection, the maximum Σ I INJ(PIN) is the absolute sum of the positive and negative injected currents (instantaneous values).

Table 24. Thermal characteristics

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The maximum chip-junction temperature, T J max, in degrees Celsius, may be calculated using the following equation:

T J max = T A max + (P D max × Θ JA )

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at www.st.com. ECOPACK is an ST trademark.