STM32F401XB/C

Part: STM32F401xB STM32F401xC

Type: ARM Cortex-M4 32-bit MCU

Description: 32-bit ARM Cortex-M4 MCU with FPU, operating at up to 84 MHz, featuring up to 256 KB Flash, up to 64 KB SRAM, 11 timers, 1 ADC, and 11 communication interfaces.

Operating Conditions:

• Supply voltage: 1.7 V to 3.6 V
• Operating temperature: -40 to 125 °C
• Max CPU frequency: 84 MHz

Absolute Maximum Ratings:

• Max supply voltage: 4.0 V
• Max junction/storage temperature: 150 °C

Key Specs:

• Core: ARM 32-bit Cortex-M4 CPU with FPU
• Max CPU Frequency: 84 MHz
• Flash Memory: Up to 256 Kbytes
• SRAM Memory: Up to 64 Kbytes
• ADC: 1x 12-bit, 2.4 MSPS, up to 16 channels
• I/O Ports: Up to 81, 5 V tolerant
• Run mode current: 128 μA/MHz (peripheral off)
• Standby mode current: 2.4 μA @25 °C / 1.7 V (without RTC)

Features:

• Adaptive real-time accelerator (ART Accelerator™)
• USB 2.0 full-speed device/host/OTG controller with on-chip PHY
• Up to 81 5 V tolerant I/O ports
• Serial wire debug (SWD) & JTAG interfaces
• CRC calculation unit
• 96-bit unique ID

Applications:

Package:

• WLCSP49
• UFQFPN48
• LQFP64
• LQFP100
• UFBGA100

• Dynamic efficiency line with BAM (batch acquisition mode)
• -1.7 V to 3.6 V power supply
• --40 °C to 85/105/125 °C temperature range
• Core: Arm ® 32-bit Cortex ® -M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 84 MHz, memory protection unit, 105 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
• Memories
• -Up to 256 Kbytes of Flash memory
• -512 bytes of OTP memory
• -Up to 64 Kbytes of SRAM
• Clock, reset and supply management
• -1.7 V to 3.6 V application supply and I/Os
• -POR, PDR, PVD and BOR
• -4-to-26 MHz crystal oscillator
• -Internal 16 MHz factory-trimmed RC
• -32 kHz oscillator for RTC with calibration
• -Internal 32 kHz RC with calibration
• Power consumption
• -Run: 128 μA/MHz (peripheral off)
• -Stop (Flash in Stop mode, fast wakeup time): 42 μA typ @ 25 °C; 65 μA max @25 °C
• -Stop (Flash in Deep power down mode, slow wakeup time): down to 10 μA typ@ 25 °C; 28 μA max @25 °C
• -Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V
• -VBAT supply for RTC: 1 μA @25 °C
• 1×12-bit, 2.4 MSPS A/D converter: up to 16 channels
• General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
• Up to 11 timers: up to six 16-bit, two 32-bit timers up to 84 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature

April 2019

DS9716 Rev 11

Figure 10. STM32F401xB/STM32F401xC WLCSP49 pinout

1. The above figure shows the package top view.

Figure 11. STM32F401xB/STM32F401xC UFQFPN48 pinout

Figure 11. STM32F401xB/STM32F401xC UFQFPN48 pinout

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Figure 12. STM32F401xB/STM32F401xC LQFP64 pinout

1. The above figure shows the package top view.

Figure 13. STM32F401xB/STM32F401xC LQFP100 pinout

Figure 13. STM32F401xB/STM32F401xC LQFP100 pinout

1. The above figure shows the package top view.

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Figure 14. STM32F401xB/STM32F401xC UFBGA100 pinout

1. This figure shows the package top view

06 9

Table 7. Legend/abbreviations used in the pinout table

Table 8. STM32F401xB/STM32F401xC pin definitions

Table 8. STM32F401xB/STM32F401xC pin definitions

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The definition and values of input/output AC characteristics are given in Figure 31 and Table 56 , respectively.

Unless otherwise specified, the parameters given in Table 56 are derived from tests performed under the ambient temperature and V DD supply voltage conditions summarized in Table 14 .

Table 56. I/O AC characteristics (1)(2)

Table 56. I/O AC characteristics (1)(2)

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1. Guaranteed by characterization.
2. The I/O speed is configured using the OSPEEDRy[1:0] bits. Refer to the STM32F4xx reference manual for a description of the GPIOx_SPEEDR GPIO port output speed register.
3. The maximum frequency is defined in Figure 31 .
4. For maximum frequencies above 50 MHz and V DD > 2.4 V, the compensation cell should be used.

Figure 31. I/O AC characteristics definition

Stresses above the absolute maximum ratings listed in Table 11: Voltage characteristics , Table 12: Current characteristics , and Table 13: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Device mission profile (application conditions) is compliant with JEDEC JESD47 Qualification Standard. Extended mission profiles are available on demand.

Table 11. Voltage characteristics

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Table 12. Current characteristics

1. Negative injection disturbs the analog performance of the device. See note in Section 6.3.20: 12-bit ADC characteristics .
2. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the specified maximum value.
3. When several inputs are submitted to a current injection, the maximum Σ I INJ(PIN) is the absolute sum of the positive and negative injected currents (instantaneous values).

Table 13. Thermal characteristics

Table 13. Thermal characteristics

The maximum chip junction temperature (T J max) must never exceed the values given in Table 14: General operating conditions on page 59 .

The maximum chip-junction temperature, T J max., in degrees Celsius, may be calculated using the following equation:

T J max = T A max + (PD max x Θ JA )

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com . ECOPACK is an ST trademark.