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SIR668DP

N-Channel MOSFET

The SIR668DP is a n-channel mosfet from Vishay Siliconix. View the full SIR668DP datasheet below including key specifications.

Manufacturer

Vishay Siliconix

Category

N-Channel MOSFET

Key Specifications

ParameterValue
Continuous Drain Current (ID)95 A
Continuous Drain Current95A (Tc)
Drain to Source Breakdown Voltage100 V
Drain to Source Resistance4.8 mΩ
Drain-Source Voltage (Vdss)100 V
Drain-Source Voltage (Vdss)100 V
Drive Voltage (Max Rds On, Min Rds On)7.5V, 10V
FET TypeN-Channel
Gate Charge (Qg)83 nC @ 7.5 V
Gate to Source Voltage (Vgs)20 V
Height1.17 mm
Input Capacitance (Ciss)5400 pF @ 50 V
Introduction Date2017-03-22
Lifecycle StatusNRND (Last Updated: 4 months ago)
Manufacturer Package IdentifierS17-0173-Single
Max Junction Temperature (Tj)150 °C
Max Operating Temperature150 °C
Max Power Dissipation104 W
Min Breakdown Voltage100 V
Min Operating Temperature-55 °C
Mounting TypeSurface Mount
Number of Channels1
Number of Elements1
Number of Terminals5
Operating Temperature-55°C ~ 150°C (TJ)
Package / CasePowerPAK® SO-8
Power Dissipation6.25 W
Power Dissipation (Max)104W (Tc)
Rds(on)4.8mOhm @ 20A, 10V Ω
RoHSCompliant
Schedule B8541290080, 8541290080|8541290080|8541290080|8541290080|8541290080
Supplier Device PackagePowerPAK® SO-8
Diode TechnologyMOSFET (Metal Oxide)
Turn-Off Delay Time30 ns
Turn-On Delay Time17 ns
Vgs (Max)±20V
Gate Threshold Voltage3.4V @ 250µA

Overview

Part: SiR668DP — Vishay Siliconix

Type: N-Channel 100 V (D-S) MOSFET

Description: N-Channel 100 V (D-S) MOSFET featuring TrenchFET Gen IV technology, very low RDS-Qg figure-of-merit, and tuned for the lowest RDS-Qoss FOM.

Operating Conditions:

  • Operating junction and storage temperature: -55 to +150 °C

Absolute Maximum Ratings:

  • Max drain-source voltage: 100 V
  • Max gate-source voltage: ± 20 V
  • Max continuous drain current (Tc=25°C): 95 A
  • Max pulsed drain current (t=100 μs): 200 A
  • Max continuous source-drain diode current (Tc=25°C): 94 A
  • Max single pulse avalanche current: 35 A
  • Max single pulse avalanche energy: 61.2 mJ
  • Max power dissipation (Tc=25°C): 104 W
  • Max junction and storage temperature: +150 °C

Key Specs:

  • Drain-source breakdown voltage: 100 V (VGS = 0 V, ID = 250 μA)
  • Gate-source threshold voltage: 2 V min, 3.4 V max (VDS = VGS, ID = 250 μA)
  • Zero gate voltage drain current: 1 μA max (VDS = 100 V, VGS = 0 V)
  • Drain-source on-state resistance: 0.00480 Ω max (VGS = 10 V, ID = 20 A)
  • Input capacitance: 5400 pF typ (VDS = 50 V, VGS = 0 V, f = 1 MHz)
  • Total gate charge: 72 nC typ (VDS = 50 V, VGS = 10 V, ID = 10 A)
  • Body diode voltage: 0.73 V typ, 1.1 V max (IS = 5 A, VGS = 0 V)
  • Body diode reverse recovery time: 59 ns typ, 118 ns max (IS = 5 A, VGS = 0 V)

Features:

  • TrenchFET Gen IV power MOSFET
  • Very low RDS - Qg figure-of-merit (FOM)
  • Tuned for the lowest RDS - Qoss FOM
  • 100 % Rg and UIS tested
  • Material categorization: lead (Pb)-free and halogen-free

Applications:

  • Synchronous rectification
  • Primary side switch
  • DC/DC converters
  • OR-ing
  • Power supplies
  • Motor drive control
  • Battery and load switch

Package:

  • PowerPAK SO-8 (Single/Dual)

Features

  • TrenchFET ® Gen IV power MOSFET
  • Very low RDS - Qg figure-of-merit (FOM)
  • Tuned for the lowest RDS - Qoss FOM
  • 100 % Rg and UIS tested

Vishay Siliconix

Applications

  • Synchronous rectification
  • Primary side switch
  • DC/DC converters
  • OR-ing
  • Power supplies
  • Motor drive control
  • Battery and load switch

  • Package
  • Lead (Pb)-free and halogen-free
ABSOLUTE MAXIMUM RATINGS (T A = 25 °C, PARAMETERABSOLUTE MAXIMUM RATINGS (T A = 25 °C, PARAMETERunless otherwise SYMBOLLIMITUNIT
Drain-source voltageDrain-source voltageV DS100V
Gate-source voltageGate-source voltageV GS± 20V
Continuous drain current (T J = 150 °C)T C = 25 °CI D95A
Continuous drain current (T J = 150 °C)T C = 70 °CI D76A
Continuous drain current (T J = 150 °C)T A = 25 °CI D23.2 b, cA
Continuous drain current (T J = 150 °C)T A = 70 °CI D18.6 b, cA
Pulsed drain current (t = 100 μs)Pulsed drain current (t = 100 μs)I DM200A
Continuous source-drain diode currentT C = 25 °CI S94A
Continuous source-drain diode currentT A = 25 °CI S5.6 b, cA
Single pulse avalanche currentL = 0.1 mHI AS35A
Single pulse avalanche energyL = 0.1 mHE AS61.2mJ
Maximum power dissipationT C = 25 °CP D104W
Maximum power dissipationT C = 70 °CP D66.6W
Maximum power dissipationT A = 25 °CP D6.25 b, cW
Maximum power dissipationT A = 70 °CP D4 b, cW
Operating junction and storage temperature rangeOperating junction and storage temperature rangeT J , T stg-55 to +150°C
Soldering recommendations (peak temperature) cSoldering recommendations (peak temperature) c260°C
THERMAL RESISTANCE RATINGSTHERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient bt 10 s
Maximum junction-to-case (drain)Steady state

Thermal Information

Because of the common footprint, a PowerPAK SO-8 can be mounted on an existing standard SO-8 pad pattern. The question then arises as to the thermal performance of the PowerPAK device under these conditions. A characterization was made comparing a standard SO-8 and a PowerPAK device on a board with a trough cut out underneath the PowerPAK drain pad. This configuration restricted the heat flow to the SO-8 land pads. The results are shown in figure 5.

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
SIR668DP-T1-RE3Vishay SiliconixPowerPAK® SO-8
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