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SI4463-BXX-FM

Synchronous Buck Converter

The SI4463-BXX-FM is a synchronous buck converter from Silicon Laboratories. View the full SI4463-BXX-FM datasheet below including electrical characteristics.

Manufacturer

Silicon Laboratories

Category

Synchronous Buck Converter

Overview

Part: Si4463-B1B-FMR — Silicon Laboratories

Type: High-Performance, Low-Current Transceiver

Description: A high-performance, low-current transceiver covering sub-GHz frequency bands from 119 to 1050 MHz, offering -126 dBm receive sensitivity and up to +20 dBm output power, with low active power consumption (10/13 mA RX, 18 mA TX at +10 dBm for Si4460) and ultra-low powerdown modes.

Operating Conditions:

  • Supply voltage: 1.8–3.6 V
  • Frequency range: 119–1050 MHz
  • Data rate: 100 bps to 1 Mbps

Key Specs:

  • Supply Voltage Range (V DD): 1.8 V (Min), 3.3 V (Typ), 3.6 V (Max)
  • RX Sensitivity (P RX_0.5): -126 dBm (BER < 0.1%, 500 bps, GFSK, BT = 0.5, f = 250Hz)
  • TX Mode Current (I TX_+20, Si4464/63): 85 mA (+20 dBm, 915 MHz, 3.3 V)
  • RX Mode Current (I RXH): 13.7 mA (High Performance Mode)
  • Shutdown Current (I Shutdown): 30 nA (RC Oscillator, Main Digital Regulator, and Low Power Digital Regulator OFF)
  • Synthesizer Frequency Range (F SYN, Si4463/61/60): 142–1050 MHz
  • 1-Ch Offset Selectivity (C/I 1-CH, 169 MHz): -60 dB (12.5 kHz channel spacing)
  • Blocking 1 MHz Offset (1M BLOCK): -75 dB

Features:

  • Frequency range = 119-1050 MHz
  • Receive sensitivity = -126 dBm
  • Modulation: (G)FSK, 4(G)FSK, (G)MSK, OOK
  • Max output power: +20 dBm (Si4464/63)
  • Low active power consumption: 10/13 mA RX, 18 mA TX at +10 dBm (Si4460)
  • Ultra low current powerdown modes: 30 nA shutdown, 50 nA standby
  • Data rate = 100 bps to 1 Mbps
  • Highly configurable packet handler
  • TX and RX 64 byte FIFOs
  • Auto frequency control (AFC)
  • Automatic gain control (AGC)
  • Low battery detector
  • Temperature sensor
  • IEEE 802.15.4g compliant

Applications:

  • Smart metering (802.15.4g & MBus)
  • Remote keyless entry
  • Remote control
  • Home security and alarm
  • Telemetry
  • Garage and gate openers
  • Home automation
  • Industrial control
  • Sensor networks
  • Health monitors
  • Electronic shelf labels

Package:

  • 20-Pin QFN package

Features

  • Frequency range = 119-1050 MHz

  • Receive sensitivity = -126 dBm

  • Modulation

  • (G)FSK, 4(G)FSK, (G)MSK

  • OOK

  • Max output power

  • +20 dBm (Si4464/63)

  • +16 dBm (Si4461)

  • +13 dBm (Si4460)

  • PA support for +27 or +30 dBm

  • Low active power consumption

  • 10/13 mA RX

  • 18 mA TX at +10 dBm (Si4460)

  • Ultra low current powerdown modes

  • 30 nA shutdown, 50 nA standby

  • Data rate = 100 bps to 1 Mbps

  • Fast wake and hop times

  • Power supply = 1.8 to 3.6 V

  • Excellent selectivity performance

  • 60 dB adjacent channel

  • 75 dB blocking at 1 MHz

  • Antenna diversity and T/R switch control

  • Highly configurable packet handler

  • TX and RX 64 byte FIFOs

  • Auto frequency control (AFC)

  • Automatic gain control (AGC)

  • Low BOM

  • Low battery detector

  • Temperature sensor

  • 20-Pin QFN package

  • IEEE 802.15.4g compliant

  • FCC Part 90 Mask D, FCC part 15.247, 15,231, 15,249, ARIB T-108, T-96, T-67, RCR STD-30, China regulatory

  • ETSI Class-I Operation with SAW

Applications

  • Smart metering (802.15.4g & MBus)
  • Remote keyless entry
  • Remote control
  • Home security and alarm
  • Telemetry
  • Garage and gate openers

Pin Configuration

PinPin NameI/0Description
1SDNIShutdown Input Pin . 0-VDD V digital input. SDN should be = 0 in all modes except Shutdown mode. When SDN = 1, the chip will be completely shut down, and the contents of the registers will be lost.
2RXpIDifferential RF Input Pins of the LNA. See application schematic for example matching network.
3RXnIDifferential RF Input Pins of the LNA. See application schematic for example matching network.
4TXOTransmit Output Pin. The PA output is an open-drain connection, so the L-C match must supply VDD (+3.3 VDC nominal) to this pin.
5NCNo Connect. Not connected internally to any circuitry.
6VDDVDD+1.8 to +3.6 V Supply Voltage Input to Internal Regulators. The recommended VDD supply voltage is +3.3 V.
7TXRAMPOProgrammable Bias Output with Ramp Capability for External FET PA. See "5.4. Transmitter (TX)" on page 34.
8VDDVDD+1.8 to +3.6 V Supply Voltage Input to Internal Regulators. The recommended VDD supply voltage is +3.3 V.
9GPIO0I/OGeneral Purpose Digital I/O. May be configured through the registers to perform various functions Microcontroller Clock Output, FIFO status, POR, Wake-Up timer, Low Battery
10GPIO1I/Oincluding: Detect, TRSW, AntDiversity control, etc.
11nIRQOGeneral Microcontroller Interrupt Status Output. When the Si4463/61 exhibits any one of the interrupt events, the nIRQ pin will be set low = 0. The Microcontroller can then determine the state of the inter- rupt by reading the interrupt status. No external resistor pull-up is required, but it may be desirable if multiple interrupt lines are connected.
PinPin NameI/0Description
12SCLKISerial Clock Input. 0-VDD V digital input. This pin provides the serial data clock function for the 4-line serial data bus. Data is clocked into the Si4463/61 on positive edge tran- sitions.
13SDOO0-VDD V Digital Output. Provides a serial readback function of the internal control registers.
14SDIISerial Data Input. 0-VDD V digital input. This pin provides the serial data stream for the 4-line serial data bus.
15nSELISerial Interface Select Input. 0-VDD V digital input. This pin provides the Select/Enable function for the 4-line serial data bus.
16XOUTOCrystal Oscillator Output. Connect to an external 25 to 32 MHz crystal, or leave floating when driving with an external source on XIN.
17XINICrystal Oscillator Input. Connect to an external 25 to 32 MHz crystal, or connect to an external source.
18GNDGNDConnect to PCB ground.
19GPIO2I/OGeneral Purpose Digital I/O. May be configured through the registers to perform various functions, including Microcontroller Clock Output, FIFO status, POR, Wake-Up timer, Low Battery
20GPIO3I/ODetect, TRSW, AntDiversity control, etc.
PKGPADDLE_GNDGNDThe exposed metal paddle on the bottom of the Si446x supplies the RF and cir- cuit ground(s) for the entire chip. It is very important that a good solder connec- tion is made between this exposed metal paddle and the ground plane of the PCB underlying the Si446x.

Electrical Characteristics

Table 1. DC Characteristics 1

ParameterSymbolTest ConditionMinTypMaxUnit
Supply Voltage RangeV DD1.83.33.6V
Power Saving ModesI ShutdownRC Oscillator, Main Digital Regulator, and Low Power Digital Regulator OFF-30-nA
Power Saving ModesI StandbyRegister values maintained and RC oscillator/WUT OFF-50-nA
Power Saving ModesI SleepRCRC Oscillator/WUT ON and all register values main- tained, and all other blocks OFF-900-nA
Power Saving ModesI SleepXOSleep current using an external 32 kHz crystal. 2-1.7-μA
Power Saving ModesI Sensor -LBDLow battery detector ON, register values maintained, and all other blocks OFF-1-μA
Power Saving ModesI ReadyCrystal Oscillator and Main Digital Regulator ON, all other blocks OFF-1.8-mA
TUNE Mode CurrentI Tune_RXRX Tune, High Performance Mode-7.2-mA
TUNE Mode CurrentI Tune_TXTX Tune, High Performance Mode-8-mA
RX Mode CurrentI RXHHigh Performance Mode-13.7-mA
RX Mode CurrentI RXLLow Power Mode 2-10.7-mA
TX Mode Current (Si4464/63)I TX_+20+20 dBm output power, class-E match, 915 MHz, 3.3 V-85-mA
TX Mode Current (Si4464/63)I TX_+20+20 dBm output power, class-E match, 460 MHz, 3.3 V-75-mA
TX Mode Current (Si4464/63)I TX_+20+20 dBm output power, square-wave match, 169 MHz, 3.3 V-70-mA
TX Mode Current (Si4461)I TX_+16+16 dBm output power, class-E match, 868 MHz, 3.3 V 2-43-mA
TX Mode Current (Si4461)I TX_+14+14 dBm output power, Switched-current match, 868 MHz, 3.3 V 2-37-mA
TX Mode Current (Si4461)I TX_+13+13 dBm output power, switched-current match, 868 MHz, 3.3 V 2-29-mA
TX Mode Current (Si4460)I TX_+10+10 dBm output power, Class-E match, 868 MHz, 3.3 V 2-18-mA

Notes:

  1. All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in the "Production Test Conditions" section of "1.1. Definition of Test Conditions" on page 14.

  2. Guaranteed by qualification. Qualification test conditions are listed in the 'Qualification Test Conditions' section in "1.1. Definition of Test Conditions" on page 14.

Table 2. Synthesizer AC Electrical Characteristics 1

ParameterSymbolTest ConditionMinTypMaxUnit
Synthesizer Frequency Range (Si4463/61/60)F SYN850-1050MHz
Synthesizer Frequency Range (Si4463/61/60)420-525MHz
Synthesizer Frequency Range (Si4463/61/60)284-350MHz
Synthesizer Frequency Range (Si4463/61/60)142-175MHz
Synthesizer Frequency Range (Si4464)F SYN705-960MHz
Synthesizer Frequency Range (Si4464)353-639MHz
Synthesizer Frequency Range (Si4464)177-319MHz
Synthesizer Frequency Range (Si4464)119-159MHz
Synthesizer Frequency Resolution 3F RES-960850-1050 MHz-28.6-Hz
Synthesizer Frequency Resolution 3F RES-525420-525 MHz-14.3-Hz
Synthesizer Frequency Resolution 3F RES-350283-350 MHz-9.5-Hz
Synthesizer Frequency Resolution 3F RES-175142-175 MHz-4.7-Hz
Synthesizer Frequency Resolution (Si4464) 3F RES-960705-960 MHz-28.6-Hz
Synthesizer Frequency Resolution (Si4464) 3F RES-639470-639 MHz-19.1-Hz
Synthesizer Frequency Resolution (Si4464) 3F RES-479353-479 MHz-14.3-Hz
Synthesizer Frequency Resolution (Si4464) 3F RES-319235-319 MHz-9.5-Hz
Synthesizer Frequency Resolution (Si4464) 3F RES-239177-239 MHz-7.1-Hz
Synthesizer Frequency Resolution (Si4464) 3F RES-159119-159 MHz-4.7-Hz
Synthesizer Settling Time 4t LOCKMeasured from exiting Ready mode with XOSC running to any frequency. Including VCO Calibration.-50-μs
Phase Noise 4L (f M )F = 10 kHz, 460 MHz, High Perf Mode--106-dBc/Hz
Phase Noise 4F = 100 kHz, 460 MHz, High Perf Mode--110-dBc/Hz
Phase Noise 4F = 1 MHz, 460 MHz, High Perf Mode--123-dBc/Hz
Phase Noise 4F = 10 MHz, 460 MHz, High Perf Mode--130-dBc/Hz
  1. All specification guaranteed by production test unless otherwise noted. Production test conditions and max limits are listed in the 'Production Test Conditions' section in "1.1. Definition of Test Conditions" on page 14.
  2. For applications that use the major bands covered by Si4463/61/60, customers should use those parts instead of Si4464.
  3. Default API setting for modulation deviation resolution is double the typical value specified.
  4. Guaranteed by qualification. Qualification test conditions are listed in the "Qualification Test Conditions" section in "1.1. Definition of Test Conditions" on page 14.

Package Information

Figure 20 illustrates the package details for the Si446x. Table 17 lists the values for the dimensions shown in the illustration.

Figure 20. 20-Pin Quad Flat No-Lead (QFN)

Table 17. Package Dimensions

DimensionMinNomMax
A0.800.850.90
A10.000.020.05
A30.20 REF0.20 REF0.20 REF
b0.180.250.30
D4.00 BSC4.00 BSC4.00 BSC
D22.452.602.75
e0.50 BSC0.50 BSC0.50 BSC
E4.00 BSC4.00 BSC4.00 BSC
E22.452.602.75
L0.300.400.50
aaa0.150.150.15
bbb0.150.150.15
ccc0.100.100.10
ddd0.100.100.10
eee0.080.080.08
  1. All dimensions are shown in millimeters (mm) unless otherwise noted.
  2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
  3. This drawing conforms to the JEDEC Solid State Outline MO-220, Variation VGGD-8.
  4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
SI4460Silicon Laboratories
SI4461Silicon Laboratories
SI4463Silicon LaboratoriesQFN-20
SI4463-B1B-FMRSilicon LaboratoriesQFN-20
SI4463/1/0Silicon Laboratories
SI4463/61Silicon Laboratories
SI4463/61/60Silicon Laboratories
SI4464Silicon Laboratories
SI446XSilicon Laboratories
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