SA8155P

Part: SA8155P — Qualcomm Technologies, Inc.

Type: Automotive Cockpit System-on-Chip (SoC)

Description: 7 nm automotive application processor featuring an octa-core Kryo CPU, Adreno 640 GPU, Hexagon 6 DSP, and >10 TOPS neural processing engine for integrated cockpit and cluster architectures.

Operating Conditions:

• Operating temperature: -40 to 105 °C (junction temperature)

Key Specs:

• Process technology: 7 nm FinFET
• CPU architecture: 64-bit Kryo octa-core CPU (ARMv8)
• GPU: Qualcomm Adreno 640 GPU (OpenGL ES 3.x, OpenCL 2.0 Full, Vulkan, RenderScript)
• Machine learning performance: >10 TOPS at <7 W
• Memory interface: 4x16 LPDDR4X, up to 68 GBps with compression (UBWC Gen 3), ECC support
• Display output: Up to 3x 4K at 60 fps (2x DSI V1.0 and DisplayPort V1.4 with MST)
• Video decode/encode: Up to 4K at 120 fps decode, 4K at 60 fps encode
• Camera interface: 4x4 CSI 2.0 lanes
• Thermal Design Power (TDP): Estimated 7 W (at 65 °C ambient)

Features:

• Four instances of Qualcomm Hexagon 6 DSP with Hexagon Vector eXtensions (HVX)
• Dedicated Audio Low Power Audio Subsystem (LPASS) with ECNS and ANC support
• Peripheral interfaces including PCIe Gen 3 (1x 2-lane, 1x 1-lane), 2x USB 3.0, and 1x Gigabit Ethernet with RGMII
• 150 general purpose I/Os and up to 16 programmable serial interfaces
• Hardware security subsystem (SPU) supporting secure boot (RSA2048/SHA256), inline crypto, RNG, and Qualcomm TEE
• Optional integrated 4G LTE modem supporting up to 2 Gbps bandwidth

Applications:

• Automotive integrated digital cockpit and instrument clusters
• Surround-view monitoring and rear-view camera systems
• In-vehicle infotainment and audio processing

Package:

• 989-ball FCBGA (23 mm x 23 mm, 0.7 mm ball pitch)

• -40° to 105°C junction temperature support
• Estimated TDP of 7 W (at 65°C ambient)
• Support for always-on/suspend to RAM