SA8155P
The SA8155P is an electronic component from Qualcomm. View the full SA8155P datasheet below including key specifications.
Manufacturer
Qualcomm
Category
System on Chip (SoC)
Lifecycle
Production (Last Updated: 7 months ago)
Key Specifications
| Parameter | Value |
|---|---|
| Case/Package | BGA |
| Case/Package | BGA |
| Introduction Date | 2022-05-20 |
| Introduction Date | 2022-05-20 |
| Lifecycle Status | Production (Last Updated: 7 months ago) |
| Lifecycle Status | Production (Last Updated: 7 months ago) |
| Max Operating Temperature | 105 °C |
| Max Operating Temperature | 105 °C |
| Min Operating Temperature | -40 °C |
| Min Operating Temperature | -40 °C |
| Number of Terminals | 989 |
| Number of Terminals | 989 |
| Ratings | AEC-Q100 |
| Ratings | AEC-Q100 |
Overview
SoC, CMOS, PBGA989
Thermal Information
- -40° to 105°C junction temperature support
- Estimated TDP of 7 W (at 65°C ambient)
- Support for always-on/suspend to RAM
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| SA8155 | Qualcomm | — |
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