SA8155

Automotive Cockpit System-on-Chip

The SA8155 is a automotive cockpit system-on-chip from Qualcomm. View the full SA8155 datasheet below including key specifications.

Official SA8155 datasheet (PDF) — the source this page was extracted from.

Manufacturer

Qualcomm

SA8155 Key Specifications

Parameter	Value
CPU	Kryo octa-core 64-bit (ARMv8)
DSP	Hexagon 6 with HVX (4 instances)
GPU	Adreno 640
USB	2x USB 3.0 (host and endpoint)
PCIe	1x 2-lane Gen3 + 1x 1-lane Gen3
Cache	384 KB L1 I/D + 1.875 MB L2 + 2 MB L3 + 3 MB system cache
GPIOs	150 general purpose I/Os
Video	Up to 4k120 decode, 4k60 encode
Storage	1x UFS 3.0, QSPI for boot
Ethernet	1x GigE with RGMII
Process Node	7nm FinFET
Estimated TDP	7 W at 65°C ambient
Qualification	AEC-Q100 Grade-3
Companion PMIC	PMM8155AU
ML Performance	>10 TOPS at <7 W
Display Support	Up to 3x 4kp60, 2x DSI V1.0, DisplayPort V1.4 with MST
Audio Interfaces	5x I2S and PCM/TDM; 3x high-speed I2S (70 MHz)
Camera Interface	4x4 CSI 2.0 lanes
Memory Interface	4x16 LPDDR4X, up to 68 GBps with ECC support
Modem (Optional)	Integrated 4G LTE, up to 2 Gbps
Package Dimensions	23 mm x 23 mm, 0.7 mm ball pitch
Junction Temperature Range	-40°C to 105°C
Programmable Serial Interfaces	Up to 16

SA8155 Overview

Part: SA8155P — Qualcomm Technologies, Inc.

Type: Automotive Cockpit System-on-Chip (SoC)

Description: 7 nm automotive application processor SoC featuring an octa-core Kryo CPU, Adreno 640 GPU, Hexagon 6 DSP, and >10 TOPS NPU delivering up to 3x 4K60 display support with an estimated 7 W TDP.

Operating Conditions:

Operating temperature: -40 to 105 °C (junction temperature)

Key Specs:

Process technology: 7 nm FinFET
CPU: Octa-core Qualcomm Kryo 64-bit ARMv8
GPU: Qualcomm Adreno 640
NPU performance: >10 TOPS (at <7 W machine learning architecture consumption)
Display support: Up to 3x 4K at 60 fps (24 Mpix total hardware display compositor)
Video decode: Up to 4K at 120 fps
Video encode: Up to 4K at 60 fps
Memory interface: 4x16 LPDDR4x, up to 68 GBps with compression (UBWC Gen 3), ECC support
Storage interface: 1x UFS 3.0, QSPI for boot
Thermal Design Power: Estimated 7 W TDP (at 65 °C ambient)

Features:

Custom Adreno 640 GPU with FlexRender, OpenGL ES 3.x, OpenCL 2.0 Full, Vulkan, and RenderScript
Qualcomm Hexagon 6 DSP subsystem with four Hexagon Vector eXtensions (HVX) instances
Dedicated Low Power Audio Subsystem (LPASS) with ECNS and ANC support
4x4 CSI 2.0 lane camera support for Around View Monitoring (AVM) and Rear-View Camera (RVC)
Display output via 2x DSI V1.0 and DisplayPort V1.4 with Multi-Stream Transport (MST)
High-speed I/O: 1x 2-lane PCIe Gen3, 1x 1-lane PCIe Gen3, 2x USB 3.0, and 1x Gigabit Ethernet with RGMII
Dedicated security hardware SPU, secure boot (RSA2048/SHA256), inline crypto, and Qualcomm TEE
Automotive AEC-Q100 Grade-3 qualified with PPAP documentation

Applications:

Integrated automotive digital cockpit and instrument cluster
Surround-view and around-view monitoring (AVM)
Rear-view camera (RVC) systems
In-cabin advanced audio and infotainment processing

Package:

989-ball FCBGA (23 mm x 23 mm, 0.7 mm ball pitch)

SA8155 Thermal Information

-40° to 105°C junction temperature support
Estimated TDP of 7 W (at 65°C ambient)
Support for always-on/suspend to RAM

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part Number	Manufacturer	Package
SA8155P	Qualcomm	FCBGA-989 23x23mm

Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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