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PMEG3020EP-TP

Schottky barrier rectifier

The PMEG3020EP-TP is a schottky barrier rectifier from Nexperia. View the full PMEG3020EP-TP datasheet below including key specifications, pinout.

Manufacturer

Nexperia

Category

Schottky barrier rectifier

Package

CFP5 (SOD128)

Key Specifications

ParameterValue
Forward Voltage (VF)310 mV (typ) to 360 mV (max) at IF=2A, Tj=25°C
Reverse Current (IR)1 mA (typ) to 3 mA (max) at VR=30V, Tj=25°C
Reverse Voltage (VR)30 V
Operating Temperature Range-55 °C to 15
Total Power Dissipation (Ptot)2.1 W (max)
Average Forward Current (IF(AV))2 A

Overview

Part: PMEG3020EP — Nexperia

Type: Schottky barrier rectifier

Description: 30 V, 2 A low VF Schottky barrier rectifier with an integrated guard ring, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package.

Operating Conditions:

  • Operating temperature: -55 to 150 °C
  • Max average forward current: 2 A (T amb ≤ 110 °C or T sp ≤ 140 °C)
  • Max reverse voltage: 30 V

Absolute Maximum Ratings:

  • Max supply voltage: 30 V (Reverse voltage VR)
  • Max continuous current: 2 A (Average forward current IF(AV))
  • Max junction/storage temperature: 150 °C

Key Specs:

  • Forward voltage (VF): 310 mV (Typ) / 360 mV (Max) at IF = 2 A, Tj = 25 °C
  • Reverse current (IR): 1 mA (Typ) / 3 mA (Max) at VR = 30 V, Tj = 25 °C
  • Diode capacitance (Cd): 325 pF (Typ) at VR = 1 V, f = 1 MHz, Tj = 25 °C
  • Diode capacitance (Cd): 110 pF (Typ) at VR = 10 V, f = 1 MHz, Tj = 25 °C
  • Non-repetitive peak forward current (IFSM): 50 A (t p = 8 ms; square wave; T j(init) = 25 °C)
  • Thermal resistance from junction to solder point (Rth(j-sp)): 12 K/W (Max)

Features:

  • Average forward current: IF(AV) ≤ 2 A
  • Reverse voltage: VR ≤ 30 V
  • Low forward voltage
  • High power capability due to clip-bond technology
  • Small and flat lead SMD plastic package
  • Suitable for both reflow and wave soldering

Applications:

  • Low voltage rectification
  • High efficiency DC-to-DC conversion
  • Switch Mode Power Supply (SMPS)
  • Reverse polarity protection
  • Low power consumption applications

Package:

  • CFP5 (SOD128) - 2 terminals; 3.8 mm x 2.6 mm x 1 mm body

Features

  • Average forward current: IF(AV) ≤ 2 A
  • Reverse voltage: VR ≤ 30 V
  • Low forward voltage
  • High power capability due to clip-bond technology
  • Small and flat lead SMD plastic package
  • Suitable for both reflow and wave soldering

Applications

  • Low voltage rectification
  • High efficiency DC-to-DC conversion
  • Switch Mode Power Supply (SMPS)
  • Reverse polarity protection
  • Low power consumption applications

Pin Configuration

PMEG3020EP-TP — SOD128 Package

Pin NumberPin NameTypeDescription
1KCathode (marked with bar)
2AAnode

Notes

  • This is a 2-terminal Schottky barrier rectifier diode in a SOD128 (CFP5) surface-mounted package.
  • Pin 1 (Cathode) is identified by a marking bar on the device body.
  • Rated for 30 V reverse voltage and 2 A average forward current.
  • Low forward voltage: typical 310 mV @ IF = 2 A, TJ = 25 °C.

Thermal Information

SymbolParameterConditionsMinTypMaxUnit
R th(j-a)thermal resistance from junction to ambientin free air[1] [2]--200K/W
R th(j-a)thermal resistance from junction to ambient[3] [2]--120K/W
R th(j-a)thermal resistance from junction to ambient[4] [2]--60K/W
R th(j-sp)thermal resistance from junction to solder point[5]--12K/W
  • [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
  • [2] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses.
  • [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2 .
  • [4] Device mounted on a ceramic PCB, Al2O3, standard footprint.
  • [5] Soldering point of cathode tab.

Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

Package Information

Ordering Information

No ordering information found in the provided section.

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
PMEG3020EPNexperiaSOD128
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