PMEG3020EP,115

Part: PMEG3020EP — Nexperia

Type: Schottky barrier rectifier

Description: 2 A, 30 V Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection.

Operating Conditions:

• Reverse voltage: 30 V
• Operating temperature: -55 to +150 °C
• Max junction temperature: 150 °C

Absolute Maximum Ratings:

• Max reverse voltage: 30 V
• Max average forward current: 2 A
• Max non-repetitive peak forward current: 50 A (square wave; tp = 8 ms)
• Max junction temperature: 150 °C
• Max storage temperature: 150 °C

Key Specs:

• Forward voltage (VF): 250 mV (typ) at IF = 0.5 A, Tj = 25 °C
• Forward voltage (VF): 310 mV (typ) at IF = 2 A, Tj = 25 °C
• Reverse current (IR): 130 μA (typ) at VR = 5 V, Tj = 25 °C
• Reverse current (IR): 1 mA (typ) at VR = 30 V, Tj = 25 °C
• Diode capacitance (Cd): 325 pF (typ) at VR = 1 V, f = 1 MHz
• Total power dissipation (Ptot): 2100 mW (max) at Tamb ≤ 25 °C (device mounted on FR4 PCB, single-sided copper, tin-plated and standard footprint)

Features:

• Average forward current: IF(AV) ≤ 2 A
• Reverse voltage: VR ≤ 30 V
• Low forward voltage
• High power capability due to clip-bond technology
• AEC-Q101 qualified
• Small and flat lead SMD plastic package

Applications:

• Low voltage rectification
• High efficiency DC-to-DC conversion
• Switch Mode Power Supply (SMPS)
• Reverse polarity protection
• Low power consumption applications

Package:

• SOD128 (2 leads)

• n Average forward current: IF(AV) £ 2 A
• n Reverse voltage: VR £ 30 V
• n Low forward voltage
• n High power capability due to clip-bond technology
• n AEC-Q101 qualified
• n Small and flat lead SMD plastic package

• n Low voltage rectification
• n High efficiency DC-to-DC conversion
• n Switch Mode Power Supply (SMPS)
• n Reverse polarity protection
• n Low power consumption applications

• [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2 .

[5] Device mounted on a ceramic PCB, Al2O3, standard footprint.

[6] Soldering point of cathode tab.

FR4 PCB, standard footprint

Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

10 3

Zth(j-a)

(K/W)

10 2

10

1

1

10

3

10

duty cycle =

1

0.5

0.75

0.25

0.1

0.02

0

2

10

1

FR4 PCB, mounting pad for cathode 1 cm 2

Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

0.33

0.2

0.05

0.01

10

006aab729

10 3

t p (s)

1

10

10 2

2 A low VF MEGA Schottky barrier rectifier