PIC16F877A-I/P

Part: PIC16F873A, PIC16F874A, PIC16F876A, PIC16F877A from Microchip Type: Enhanced Flash Microcontrollers

Key Specs:

• Operating speed: DC – 20 MHz clock input
• Instruction cycle: DC – 200 ns
• Flash Program Memory: Up to 8K x 14 words
• Data Memory (RAM): Up to 368 x 8 bytes
• EEPROM Data Memory: Up to 256 x 8 bytes
• Operating Voltage: 2.0V to 5.5V
• Flash Erase/Write Cycles: 100,000 typical
• EEPROM Erase/Write Cycles: 1,000,000 typical
• EEPROM Data Retention: > 40 years

Features:

• High-Performance RISC CPU with 35 single-word instructions
• Pinout compatible to other 28-pin or 40/44-pin PIC16CXXX and PIC16FXXX microcontrollers
• Timer0: 8-bit timer/counter with 8-bit prescaler
• Timer1: 16-bit timer/counter with prescaler, can be incremented during Sleep
• Timer2: 8-bit timer/counter with 8-bit period register, prescaler and postscaler
• Two Capture, Compare, PWM modules (16-bit Capture, 16-bit Compare, 10-bit PWM resolution)
• Synchronous Serial Port (SSP) with SPI (Master mode) and I2C™ (Master/Slave)
• Universal Synchronous Asynchronous Receiver Transmitter (USART/SCI) with 9-bit address detection
• Parallel Slave Port (PSP) 8 bits wide with external RD, WR and CS controls (40/44-pin only)
• Brown-out detection circuitry for Brown-out Reset (BOR)
• 10-bit, up to 8-channel Analog-to-Digital Converter (A/D)
• Analog Comparator module with two comparators, programmable on-chip voltage reference, programmable input multiplexing, and externally accessible outputs
• Self-reprogrammable under software control
• In-Circuit Serial Programming™ (ICSP™) via two pins, single-supply 5V
• Watchdog Timer (WDT) with on-chip RC oscillator
• Programmable code protection
• Power saving Sleep mode
• Selectable oscillator options
• In-Circuit Debug (ICD) via two pins
• Low-power, high-speed Flash/EEPROM technology
• Fully static design
• Low-power consumption

Applications:

• null

Package:

• 28-pin packages
• 40-pin packages
• 44-pin packages

• Timer0: 8-bit timer/counter with 8-bit prescaler
• Timer1: 16-bit timer/counter with prescaler, can be incremented during Sleep via external crystal/clock
• Timer2: 8-bit timer/counter with 8-bit period register, prescaler and postscaler
• Two Capture, Compare, PWM modules
  • Capture is 16-bit, max. resolution is 12.5 ns
  • Compare is 16-bit, max. resolution is 200 ns
  • PWM max. resolution is 10-bit
• Synchronous Serial Port (SSP) with SPI (Master mode) and I2C™ (Master/Slave)
• Universal Synchronous Asynchronous Receiver Transmitter (USART/SCI) with 9-bit address detection
• Parallel Slave Port (PSP) 8 bits wide with external RD, WR and CS controls (40/44-pin only)
• Brown-out detection circuitry for Brown-out Reset (BOR)

Analog Features:

• 10-bit, up to 8-channel Analog-to-Digital Converter (A/D)
• Brown-out Reset (BOR)
• Analog Comparator module with:
  • Two analog comparators
  • Programmable on-chip voltage reference (VREF) module
  • Programmable input multiplexing from device inputs and internal voltage reference
  • Comparator outputs are externally accessible

In Capture mode, the RC2/CCP1 pin should be configured as an input by setting the TRISC<2> bit.

• Note 1: This is the limit to which VDD can be lowered without losing RAM data.
  • 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading, switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption.
    • The test conditions for all IDD measurements in active operation mode are:
      • OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
      • MCLR = VDD; WDT enabled/disabled as specified.
  • 3: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD and VSS.
  • 4: For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in k.
  • 5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from characterization and is for design guidance only. This is not tested.
  • 6: The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement.
  • 7: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached.

• Storage temperature -65°C to +150°C

• Voltage on any pin with respect to VSS (except VDD, MCLR. and RA4) -0.3V to (VDD + 0.3V)

• Voltage on VDD with respect to VSS -0.3 to +7.5V

• Voltage on MCLR with respect to VSS (Note 2) 0 to +14V

• Voltage on RA4 with respect to Vss0 to +8.5V

• Total power dissipation (Note 1) 1.0W

• Maximum current out of VSS pin 300 mA

• Maximum current into VDD pin 250 mA

• Input clamp current, IIK (VI < 0 or VI > VDD) 20 mA

• Output clamp current, IOK (VO < 0 or VO > VDD)  20 mA

• Maximum output current sunk by any I/O pin25 mA

• Maximum output current sourced by any I/O pin 25 mA

• Maximum current sunk by PORTA, PORTB and PORTE (combined) (Note 3)200 mA

• Maximum current sourced by PORTA, PORTB and PORTE (combined) (Note 3)200 mA

• Maximum current sunk by PORTC and PORTD (combined) (Note 3) 200 mA

• Maximum current sourced by PORTC and PORTD (combined) (Note 3) 200 mA

• Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD -  IOH} +  {(VDD - VOH) x IOH} + (VOl x IOL)

• 2: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100 should be used when applying a "low" level to the MCLR pin rather than pulling this pin directly to VSS.

• 3: PORTD and PORTE are not implemented on PIC16F873A/876A devices.

† NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.