PIC16F1826
Flash MicrocontrollerThe PIC16F1826 is a flash microcontroller from Microchip Technology. View the full PIC16F1826 datasheet below including electrical characteristics, absolute maximum ratings.
Manufacturer
Microchip Technology
Category
Flash Microcontroller
Overview
Part: PIC16F1827 — Microchip Technology
Type: Flash Microcontroller
Description: High-performance RISC CPU operating up to 32 MHz, with up to 16 KB Flash, 1024 bytes SRAM, 10-bit ADC, and multiple communication interfaces, featuring eXtreme Low-Power (XLP) technology.
Operating Conditions:
- Supply voltage: 1.8–5.5 V
- Max clock speed: 32 MHz
Key Specs:
- Program Memory: Up to 16 Kbytes Flash
- Data EEPROM: 256 bytes
- Data SRAM: Up to 1024 bytes
- ADC Resolution: 10-bit (up to 12 channels)
- I/O Pins: Up to 17 (1 input only)
- I/O Current Sink/Source: 25 mA/25 mA
- Sleep mode current (PIC16LF variants): 20 nA @ 1.8V, typical
- Operating Current (PIC16LF variants): 48 μA/MHz @ 1.8V, typical
Features:
- High-Performance RISC CPU with 49 instructions
- Flexible Oscillator Structure with 32 MHz internal oscillator and PLL
- Fail-Safe Clock Monitor
- Self-Programmable under Software Control
- Power-on Reset (POR), Power-up Timer (PWRT), Oscillator Start-up Timer (OST)
- Programmable Brown-out Reset (BOR)
- Extended Watchdog Timer (WDT)
- In-Circuit Serial Programming™ (ICSP™) and In-Circuit Debug (ICD)
- Two Analog Comparators
- Fixed Voltage Reference (FVR) and 5-bit rail-to-rail resistive DAC
- Multiple Timers (Timer0, Enhanced Timer1, Timer2-types)
- Two Capture, Compare, PWM (CCP) Modules
- Two Enhanced CCP (ECCP) Modules
- Up to Two Master Synchronous Serial Port (MSSP) with SPI and I2C
- Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART)
- mTouch™ Sensing Oscillator Module (up to 12 input channels)
- Data Signal Modulator Module
- SR Latch
Package:
- PDIP
- SOIC
- TSSOP
- QFN
- UQFN
- SSOP
Features
- 1.8V-5.5V Operation - PIC16F1825/9
- 1.8V-3.6V Operation - PIC16LF1825/9
- Self-Programmable under Software Control
- Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)
- Programmable Brown-out Reset (BOR)
- Extended Watchdog Timer (WDT)
- In-Circuit Serial Programming™ (ICSP™) via two pins
- In-Circuit Debug (ICD) via Two Pins
- Enhanced Low-Voltage Programming (LVP)
- Programmable Code Protection
- Power-Saving Sleep mode
Applications
Since the PxA and PxB outputs are multiplexed with the PORT data latches, the associated TRIS bits must be cleared to configure PxA and PxB as outputs.
Pin Configuration
The Alternate Pin Function Control 0 (APFCON0) and Alternate Pin Function Control 1 (APFCON1) registers are used to steer specific peripheral input and output functions between different pins. The APFCON0 and APFCON1 registers are shown in Register 12-1 and Register 12-2. For this device family, the following functions can be moved between different pins.
- RX/DT/TX/CK
- SDO1
- SS (Slave Select)
- T1G
- P1B/P1C/P1D/P2B
- CCP1/P1A/CCP2
These bits have no effect on the values of any TRIS register. PORT and TRIS overrides will be routed to the correct pin. The unselected pin will be unaffected.
Electrical Characteristics
| PIC16LF1825/9 | PIC16LF1825/9 | PIC16LF1825/9 | Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended | Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended | Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended | Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended | Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended |
|---|---|---|---|---|---|---|---|
| PIC16F1825/9 | PIC16F1825/9 | PIC16F1825/9 | Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended | Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended | Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended | Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended | Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended |
| Param. No. | Sym. | Characteristic | Min. | Typ† | Max. | Units | Conditions |
| D001 | VDD | Supply Voltage (VDDMIN, VDDMAX) | Supply Voltage (VDDMIN, VDDMAX) | Supply Voltage (VDDMIN, VDDMAX) | Supply Voltage (VDDMIN, VDDMAX) | Supply Voltage (VDDMIN, VDDMAX) | Supply Voltage (VDDMIN, VDDMAX) |
| D001 | VDD | PIC16LF1825/9 | 1.8 2.5 | - - | 3.6 3.6 | V V | FOSC 16 MHz: FOSC 32 MHz ( Note 2 ) |
| D001 | PIC16F1825/9 | 1.8 2.5 | - - | 5.5 5.5 | V V | FOSC 16 MHz: FOSC 32 MHz ( Note 2 ) | |
| D002* | VDR | RAM Data Retention Voltage (1) | RAM Data Retention Voltage (1) | RAM Data Retention Voltage (1) | RAM Data Retention Voltage (1) | RAM Data Retention Voltage (1) | RAM Data Retention Voltage (1) |
| D002* | VDR | PIC16LF1825/9 | 1.5 | - | - | V | Device in Sleep mode |
| D002* | PIC16F1825/9 | 1.7 | - | - | V | Device in Sleep mode | |
| VPOR* | Power-on Reset Release Voltage | - | 1.6 | - | V | ||
| D002B* | VPORR* | Power-on Reset Rearm Voltage | Power-on Reset Rearm Voltage | Power-on Reset Rearm Voltage | Power-on Reset Rearm Voltage | Power-on Reset Rearm Voltage | Power-on Reset Rearm Voltage |
| PIC16LF1825/9 | - | 0.8 | - | V | Device in Sleep mode | ||
| PIC16F1825/9 | - | 1.5 | - | V | Device in Sleep mode | ||
| D003 | VADFVR | Fixed Voltage Reference Voltage for ADC | -8 | - | 6 | % | 1.024V, VDD 2.5V 2.048V, VDD 2.5V 4.096V, VDD 4.75V |
| D003A | VCDAFVR | Fixed Voltage Reference Voltage for Comparator and DAC | -11 | - | 7 | % | 1.024V, VDD 2.5V 2.048V, VDD 2.5V 4.096V, VDD 4.75V |
| D003C* | TCVFVR | Temperature Coefficient, Fixed Voltage Reference | - | -130 | - | ppm/°C | |
| D003D* | VFVR/ VIN | Line Regulation, Fixed Voltage Reference | - | 0.270 | - | %/V | |
| D004* | SVDD | VDD Rise Rate to ensure internal Power-on Reset signal | 0.05 | - | - | V/ms | See Section 7.1 'Power-on Reset (POR)' for details. |
- Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
- 2: PLL required for 32 MHz operation.
Absolute Maximum Ratings
| Ambient temperature under bias.......................................................................................................-40°C | to +125°C |
|---|---|
| Storage temperature ........................................................................................................................ | -65°C to +150°C |
| Voltage on VDD with respect to VSS, PIC16F1825/9 .......................................................................... | -0.3V to +6.5V |
| Voltage on VDD with respect to VSS, PIC16LF1825/9 ........................................................................ | -0.3V to +4.0V |
| Voltage on MCLR with respect to Vss ................................................................................................. -0.3V | to +9.0V |
| Voltage on all other pins with respect to VSS ............................................................................ -0.3V to (VDD | + 0.3V) |
| Total power dissipation (1) ...............................................................................................................................800mW | |
| Maximum current out of VSS pin, -40°C TA +85°C for industrial................................................................. | 85 mA |
| Maximum current out of VSS pin, -40°C TA +125°C for extended .............................................................. | 35 mA |
| Maximum current into VDD pin, -40°C TA +85°C for industrial.................................................................... | 80 mA |
| Maximum current into VDD pin, -40°C TA +125°C for extended ................................................................. | 30 mA |
| Clamp current, IK (VPIN < 0 or VPIN > VDD) | 20 mA |
| Maximum output current sunk by any I/O pin....................................................................................................25 | mA |
| Maximum output current sourced by any I/O pin...............................................................................................25 | mA |
Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD - IOH} + {(VDD - VOH) x IOH} + (VOl x IOL).
† NOTICE: Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability.
Thermal Information
| Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C | Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C | Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C | Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C | Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C | Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C |
|---|---|---|---|---|---|
| Param No. | Sym. | Characteristic | Typ. | Units | Conditions |
| TH01 | JA | Thermal Resistance Junction to Ambient | 70.0 | C/W | 14-pin PDIP package |
| TH01 | JA | Thermal Resistance Junction to Ambient | 95.3 | C/W | 14-pin SOIC package |
| TH01 | JA | Thermal Resistance Junction to Ambient | 100 | C/W | 14-pin TSSOP package |
| TH01 | JA | Thermal Resistance Junction to Ambient | 45.7 | C/W | 16-pin QFN (4x4) package |
| TH01 | JA | Thermal Resistance Junction to Ambient | 31.8 | C/W | 16-pin UQFN (4x4) package |
| TH01 | JA | Thermal Resistance Junction to Ambient | 62.2 | C/W | 20-pin PDIP package |
| TH01 | JA | Thermal Resistance Junction to Ambient | 77.7 | C/W | 20-pin SOIC package |
| TH01 | JA | Thermal Resistance Junction to Ambient | 87.3 | C/W | 20-pin SSOP package |
| TH01 | JA | Thermal Resistance Junction to Ambient | 43.0 | C/W | 20-pin QFN (4x4) package |
| TH01 | JA | Thermal Resistance Junction to Ambient | 32.8 | C/W | 20-pin UQFN (4x4) package |
| TH02 | JC | Thermal Resistance Junction to Case | 32.8 | C/W | 14-pin PDIP package |
| TH02 | JC | Thermal Resistance Junction to Case | 31.0 | C/W | 14-pin SOIC package |
| TH02 | JC | Thermal Resistance Junction to Case | 24.4 | C/W | 14-pin TSSOP package |
| TH02 | JC | Thermal Resistance Junction to Case | 6.3 | C/W | 16-pin QFN (4x4) package |
| TH02 | JC | Thermal Resistance Junction to Case | 24.4 | C/W | 16-pin UQFN (4x4) package |
| TH02 | JC | Thermal Resistance Junction to Case | 27.5 | C/W | 20-pin PDIP package |
| TH02 | JC | Thermal Resistance Junction to Case | 23.1 | C/W | 20-pin SOIC package |
| TH02 | JC | Thermal Resistance Junction to Case | 31.1 | C/W | 20-pin SSOP package |
| TH02 | JC | Thermal Resistance Junction to Case | 5.3 | C/W | 20-pin QFN (4x4) package |
| TH02 | JC | Thermal Resistance Junction to Case | 27.4 | C/W | 20-pin UQFN (4x4) package |
| TH03 | TJMAX | Maximum Junction Temperature | 150 | C | |
| TH04 | PD | Power Dissipation | - | W | PD = PINTERNAL + PI/O |
| TH05 | PINTERNAL | Internal Power Dissipation | - | W | PINTERNAL = IDD x VDD (1) |
| TH06 | PI/O | I/O Power Dissipation | - | W | PI/O = (IOL * VOL) + (IOH * (VDD - VOH)) |
| TH07 | PDER | Derated Power | - | W | PDER = PDMAX (TJ - TA)/ JA (2) |
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature, TJ = Junction Temperature.
Package Information
| MILLIMETERS | MILLIMETERS | MILLIMETERS | ||
|---|---|---|---|---|
| Dimension Limits | Dimension Limits | MIN | NOM | MAX |
| Contact Pitch | E | 0.65 BSC | ||
| Optional Center Pad Width | X2 | 2.70 | ||
| Optional Center Pad Length | Y2 | 2.70 | ||
| Contact Pad Spacing | C1 | 4.00 | ||
| Contact Pad Spacing | C2 | 4.00 | ||
| Contact Pad Width (X16) | X1 | 0.35 | ||
| Contact Pad Length (X16) | Y1 | 0.80 |
- Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2257A
Related Variants
The following components are covered by the same datasheet.
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|---|---|---|
| PIC16 | Microchip Technology | — |
| PIC16F | Microchip Technology | — |
| PIC16F1823 | Microchip Technology | — |
| PIC16F1824 | Microchip Technology | — |
| PIC16F1825 | Microchip Technology | — |
| PIC16F1825/9 | Microchip Technology | — |
| PIC16F1827 | Microchip Technology | — |
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