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PIC16F1824

Flash Microcontroller

The PIC16F1824 is a flash microcontroller from Microchip Technology. View the full PIC16F1824 datasheet below including electrical characteristics, absolute maximum ratings.

Manufacturer

Microchip Technology

Category

Flash Microcontroller

Overview

Part: PIC16F1827 — Microchip Technology

Type: Flash Microcontroller

Description: High-performance RISC CPU operating up to 32 MHz, with up to 16 KB Flash, 1024 bytes SRAM, 10-bit ADC, and multiple communication interfaces, featuring eXtreme Low-Power (XLP) technology.

Operating Conditions:

  • Supply voltage: 1.8–5.5 V
  • Max clock speed: 32 MHz

Key Specs:

  • Program Memory: Up to 16 Kbytes Flash
  • Data EEPROM: 256 bytes
  • Data SRAM: Up to 1024 bytes
  • ADC Resolution: 10-bit (up to 12 channels)
  • I/O Pins: Up to 17 (1 input only)
  • I/O Current Sink/Source: 25 mA/25 mA
  • Sleep mode current (PIC16LF variants): 20 nA @ 1.8V, typical
  • Operating Current (PIC16LF variants): 48 μA/MHz @ 1.8V, typical

Features:

  • High-Performance RISC CPU with 49 instructions
  • Flexible Oscillator Structure with 32 MHz internal oscillator and PLL
  • Fail-Safe Clock Monitor
  • Self-Programmable under Software Control
  • Power-on Reset (POR), Power-up Timer (PWRT), Oscillator Start-up Timer (OST)
  • Programmable Brown-out Reset (BOR)
  • Extended Watchdog Timer (WDT)
  • In-Circuit Serial Programming™ (ICSP™) and In-Circuit Debug (ICD)
  • Two Analog Comparators
  • Fixed Voltage Reference (FVR) and 5-bit rail-to-rail resistive DAC
  • Multiple Timers (Timer0, Enhanced Timer1, Timer2-types)
  • Two Capture, Compare, PWM (CCP) Modules
  • Two Enhanced CCP (ECCP) Modules
  • Up to Two Master Synchronous Serial Port (MSSP) with SPI and I2C
  • Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART)
  • mTouch™ Sensing Oscillator Module (up to 12 input channels)
  • Data Signal Modulator Module
  • SR Latch

Package:

  • PDIP
  • SOIC
  • TSSOP
  • QFN
  • UQFN
  • SSOP

Features

  • 1.8V-5.5V Operation - PIC16F1825/9
  • 1.8V-3.6V Operation - PIC16LF1825/9
  • Self-Programmable under Software Control
  • Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)
  • Programmable Brown-out Reset (BOR)
  • Extended Watchdog Timer (WDT)
  • In-Circuit Serial Programming™ (ICSP™) via two pins
  • In-Circuit Debug (ICD) via Two Pins
  • Enhanced Low-Voltage Programming (LVP)
  • Programmable Code Protection
  • Power-Saving Sleep mode

Applications

Since the PxA and PxB outputs are multiplexed with the PORT data latches, the associated TRIS bits must be cleared to configure PxA and PxB as outputs.

Pin Configuration

The Alternate Pin Function Control 0 (APFCON0) and Alternate Pin Function Control 1 (APFCON1) registers are used to steer specific peripheral input and output functions between different pins. The APFCON0 and APFCON1 registers are shown in Register 12-1 and Register 12-2. For this device family, the following functions can be moved between different pins.

  • RX/DT/TX/CK
  • SDO1
  • SS (Slave Select)
  • T1G
  • P1B/P1C/P1D/P2B
  • CCP1/P1A/CCP2

These bits have no effect on the values of any TRIS register. PORT and TRIS overrides will be routed to the correct pin. The unselected pin will be unaffected.

Electrical Characteristics

PIC16LF1825/9PIC16LF1825/9PIC16LF1825/9Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extendedStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extendedStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extendedStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extendedStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended
PIC16F1825/9PIC16F1825/9PIC16F1825/9Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extendedStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extendedStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extendedStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extendedStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended
Param. No.Sym.CharacteristicMin.Typ†Max.UnitsConditions
D001VDDSupply Voltage (VDDMIN, VDDMAX)Supply Voltage (VDDMIN, VDDMAX)Supply Voltage (VDDMIN, VDDMAX)Supply Voltage (VDDMIN, VDDMAX)Supply Voltage (VDDMIN, VDDMAX)Supply Voltage (VDDMIN, VDDMAX)
D001VDDPIC16LF1825/91.8 2.5- -3.6 3.6V VFOSC 16 MHz: FOSC 32 MHz ( Note 2 )
D001PIC16F1825/91.8 2.5- -5.5 5.5V VFOSC 16 MHz: FOSC 32 MHz ( Note 2 )
D002*VDRRAM Data Retention Voltage (1)RAM Data Retention Voltage (1)RAM Data Retention Voltage (1)RAM Data Retention Voltage (1)RAM Data Retention Voltage (1)RAM Data Retention Voltage (1)
D002*VDRPIC16LF1825/91.5--VDevice in Sleep mode
D002*PIC16F1825/91.7--VDevice in Sleep mode
VPOR*Power-on Reset Release Voltage-1.6-V
D002B*VPORR*Power-on Reset Rearm VoltagePower-on Reset Rearm VoltagePower-on Reset Rearm VoltagePower-on Reset Rearm VoltagePower-on Reset Rearm VoltagePower-on Reset Rearm Voltage
PIC16LF1825/9-0.8-VDevice in Sleep mode
PIC16F1825/9-1.5-VDevice in Sleep mode
D003VADFVRFixed Voltage Reference Voltage for ADC-8-6%1.024V, VDD 2.5V 2.048V, VDD 2.5V 4.096V, VDD 4.75V
D003AVCDAFVRFixed Voltage Reference Voltage for Comparator and DAC-11-7%1.024V, VDD 2.5V 2.048V, VDD 2.5V 4.096V, VDD 4.75V
D003C*TCVFVRTemperature Coefficient, Fixed Voltage Reference--130-ppm/°C
D003D*VFVR/ VINLine Regulation, Fixed Voltage Reference-0.270-%/V
D004*SVDDVDD Rise Rate to ensure internal Power-on Reset signal0.05--V/msSee Section 7.1 'Power-on Reset (POR)' for details.
  • Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
  • 2: PLL required for 32 MHz operation.

Absolute Maximum Ratings

Ambient temperature under bias.......................................................................................................-40°Cto +125°C
Storage temperature ........................................................................................................................-65°C to +150°C
Voltage on VDD with respect to VSS, PIC16F1825/9 ..........................................................................-0.3V to +6.5V
Voltage on VDD with respect to VSS, PIC16LF1825/9 ........................................................................-0.3V to +4.0V
Voltage on MCLR with respect to Vss ................................................................................................. -0.3Vto +9.0V
Voltage on all other pins with respect to VSS ............................................................................ -0.3V to (VDD+ 0.3V)
Total power dissipation (1) ...............................................................................................................................800mW
Maximum current out of VSS pin, -40°C TA +85°C for industrial.................................................................85 mA
Maximum current out of VSS pin, -40°C TA +125°C for extended ..............................................................35 mA
Maximum current into VDD pin, -40°C TA +85°C for industrial....................................................................80 mA
Maximum current into VDD pin, -40°C TA +125°C for extended .................................................................30 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD)20 mA
Maximum output current sunk by any I/O pin....................................................................................................25mA
Maximum output current sourced by any I/O pin...............................................................................................25mA

Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD - IOH} + {(VDD - VOH) x IOH} + (VOl x IOL).

† NOTICE: Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability.

Thermal Information

Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°CStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°CStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°CStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°CStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°CStandard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C
Param No.Sym.CharacteristicTyp.UnitsConditions
TH01JAThermal Resistance Junction to Ambient70.0C/W14-pin PDIP package
TH01JAThermal Resistance Junction to Ambient95.3C/W14-pin SOIC package
TH01JAThermal Resistance Junction to Ambient100C/W14-pin TSSOP package
TH01JAThermal Resistance Junction to Ambient45.7C/W16-pin QFN (4x4) package
TH01JAThermal Resistance Junction to Ambient31.8C/W16-pin UQFN (4x4) package
TH01JAThermal Resistance Junction to Ambient62.2C/W20-pin PDIP package
TH01JAThermal Resistance Junction to Ambient77.7C/W20-pin SOIC package
TH01JAThermal Resistance Junction to Ambient87.3C/W20-pin SSOP package
TH01JAThermal Resistance Junction to Ambient43.0C/W20-pin QFN (4x4) package
TH01JAThermal Resistance Junction to Ambient32.8C/W20-pin UQFN (4x4) package
TH02JCThermal Resistance Junction to Case32.8C/W14-pin PDIP package
TH02JCThermal Resistance Junction to Case31.0C/W14-pin SOIC package
TH02JCThermal Resistance Junction to Case24.4C/W14-pin TSSOP package
TH02JCThermal Resistance Junction to Case6.3C/W16-pin QFN (4x4) package
TH02JCThermal Resistance Junction to Case24.4C/W16-pin UQFN (4x4) package
TH02JCThermal Resistance Junction to Case27.5C/W20-pin PDIP package
TH02JCThermal Resistance Junction to Case23.1C/W20-pin SOIC package
TH02JCThermal Resistance Junction to Case31.1C/W20-pin SSOP package
TH02JCThermal Resistance Junction to Case5.3C/W20-pin QFN (4x4) package
TH02JCThermal Resistance Junction to Case27.4C/W20-pin UQFN (4x4) package
TH03TJMAXMaximum Junction Temperature150C
TH04PDPower Dissipation-WPD = PINTERNAL + PI/O
TH05PINTERNALInternal Power Dissipation-WPINTERNAL = IDD x VDD (1)
TH06PI/OI/O Power Dissipation-WPI/O = (IOL * VOL) + (IOH * (VDD - VOH))
TH07PDERDerated Power-WPDER = PDMAX (TJ - TA)/ JA (2)

Note 1: IDD is current to run the chip alone without driving any load on the output pins.

2: TA = Ambient Temperature, TJ = Junction Temperature.

Package Information

MILLIMETERSMILLIMETERSMILLIMETERS
Dimension LimitsDimension LimitsMINNOMMAX
Contact PitchE0.65 BSC
Optional Center Pad WidthX22.70
Optional Center Pad LengthY22.70
Contact Pad SpacingC14.00
Contact Pad SpacingC24.00
Contact Pad Width (X16)X10.35
Contact Pad Length (X16)Y10.80
  1. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-2257A

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