NTP53121G0JT
NFC Forum Type 5 Tag IC with I2C bridgeThe NTP53121G0JT is a nfc forum type 5 tag ic with i2c bridge from NXP Semiconductors. View the full NTP53121G0JT datasheet below including key specifications.
NTP53121G0JT shares its datasheet with NTP53121G0JHK, whose page lists every part number it covers.
Official NTP53121G0JT datasheet (PDF) — the source this page was extracted from.
NTP53121G0JT Key Specifications
| Parameter | Value |
|---|---|
| SRAM | 256 bytes |
| Security | 32-/64-bit password, ECC originality signature |
| Standards | ISO/IEC 15693, NFC Forum Type 5 Tag |
| User EEPROM | 2048 bytes (16384 bits) |
| I2C Interface | Slave standard (100 kHz) and fast (400 kHz) mode |
| Data Retention | 40 years |
| Supply Voltage | 1.62V to 5.5V |
| Standby Current | <6 µA typical |
| Write Endurance | 1,000,000 cycles |
| RF Operating Frequency | 13.56 MHz |
| Hard Power Down Current | <0.25 µA typical |
| Energy Harvesting Output | Up to 30 mW, configurable voltage |
| Read Range (Long-Range Reader) | > 60 cm |
| Operating Temperature (EEPROM Write) | -40 °C to 85 °C |
| Operating Temperature (Read/SRAM/Register) | -40 °C to 105 °C |
NTP53121G0JT Overview
Part: NTP53121G0JHKZ — NXP Semiconductors
Type: NFC Forum-Compliant I2C Bridge / NFC Forum Type 5 Tag IC
Description: 13.56 MHz NFC Forum Type 5 Tag and ISO/IEC 15693 bridge IC with 2048 bytes EEPROM, 256 bytes SRAM, I2C interface, and energy harvesting capability with a 1.62 V to 5.5 V supply range.
Operating Conditions:
- Supply voltage: 1.62 to 5.5 V
- Operating temperature: -40 to 85 °C (for EEPROM write access; -40 to 105 °C for EEPROM read, SRAM, and register access)
- Operating frequency: 13.56 MHz
Absolute Maximum Ratings:
- Max supply voltage: 7.15 V (on pin VCC)
- Max junction/storage temperature: 150 °C (storage temperature)
Key Specs:
- Storage temperature (Tstg): -65 to 150 °C
- Max junction temperature (Tj, EEPROM write operation): 95 °C
- Max junction temperature (Tj, EEPROM read, SRAM and register operation): 115 °C
- Input voltage (Vi, SDA, SCL, ED, HPD pins): -0.5 to 7.15 V
- RF input voltage (VI(RF), on pins LA/LB): -0.5 to 5.2 Vp
- Maximum input current (Ii(max), LA/LB peak): -168 to 168 mA
- Electrostatic discharge voltage (HBM): -2 to 2 kV
- Electrostatic discharge voltage (CDM): -2 to 2 kV
Features:
- ISO/IEC 15693 and NFC Forum Type 5 Tag compliant contactless interface
- 2048 bytes (16384 bits) user EEPROM with 40-year data retention and 1,000,000 cycle write endurance
- 256 bytes SRAM for fast pass-through mode
- I2C slave interface supporting standard (100 kHz) and fast (400 kHz) modes
- Energy harvesting with configurable output voltage supplying up to 30 mW
- 64-bit Unique Identifier (UID)
- Low-power standby current typically <6 μA, hard power-down current typically <0.25 μA
- Configurable event detection (ED) pin, 2 GPIOs, and 2 PWM channels
Applications:
- Dynamic secure pairing
- Sensor data acquisition and commissioning
- Lighting and LED driver configuration
- Smart home and smart metering
- Wearables and hearables
- Industrial and consumer devices
Package:
- XQFN16 (16 pins)
- TSSOP16 (16 pins)
- SO8 (8 pins)
- Wafer
NTP53121G0JT Features
- Reading distance with long-range reader > 60 cm (> 25 inches)
- Zero-power readout of an I 2 C sensor
- Adjustable security levels up to mutual AES authentication (NTP5332 only)
- Flexible split between three open and/or protected memory areas
- Ensured authenticity of product through value chain
- Interoperable data exchange according to NFC Forum standards
- Energy-efficient design with reduced bill of material
- Interoperable and high performance NFC interface
- -ISO/IEC 15693 and NFC Forum Type 5 Tag compliant
- -64-bit Unique IDentifier
- Reliable and robust memory
- -2048 bytes (16384 bits) user EEPROM on top of configuration memory
- -256 bytes (2048 bits) SRAM for frequently changing data and pass-through mode
- -40 years data retention
- -Write endurance of 1 000 000 cycles
- Configurable contact interface
- -I 2 C slave standard (100 kHz) and fast (400 kHz) mode
- -NTP5332 offers a Transparent I 2 C master channel (for example, read sensors without an MCU)
- -One configurable event detection pin
- -Two GPIOs as multiplexed I 2 C lines
- -Two Pulse Width Modulation (PWM) channels as multiplexed GPIOs and/or ED pin
- -1.62 V to 5.5 V supply voltage
- Scalable security for access and data protection
- -Disable NFC interface temporarily
- -Disable I 2 C interface temporarily
- -NFC PRIVACY mode
- -Read-only protection as defined in NFC Forum Type 5 Tag Specification
- -Full, read-only, or no memory access based on 32-bit password from both interfaces
- -Optional 64-bit password protection from NFC perspective
- -128-bit AES authentication as defined in ISO/IEC 15693 for NTP5332
- -ECC-based reprogrammable originality signature
- Multiple fast data transfer mode
- -Pass-through mode with 256 byte SRAM buffer
- -Standardized data transfer mode (PHDC, TNEP)
- Low-power budget application support
- -Energy harvesting with configurable output voltage up to 30 mW
- -Low-power standby current typically <6 μA
- -Hard power down current typically <0.25 μA
- Very robust architecture
- --40 °C to 105 °C for EEPROM read, SRAM and register access
- --40 °C to 85 °C for EEPROM write access
- Extensive product support package
- -Feature specific application notes
- -Development board including software and source code
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2020. All rights reserved.
-Hands-on training
NTP53x2
NTAG 5 link - NFC Forum-compliant I 2 C bridge
NTP53121G0JT Applications
- Use cases
- -Simple dynamic secure pairing
- -Commissioning
- -Parameterization
- -Diagnosis
- -Firmware download
- -Low BoM and low-power data acquisition for sensors
- -Calibration
- -Trimming
- -Authenticity check and data protection
- -Late "in the box" configuration
- -LED driver configuration
- -NFC charging
- Applications
- -Lighting
- -Smart home
- -Hearable and Wearable
- -Consumer
- -Industrial
- -Gaming
- -Smart sensor
- -Smart metering
NTAG 5 link - NFC Forum-compliant I 2 C bridge
NTP53121G0JT Pin Configuration
| Pin | Symbol | Description | When unused |
|---|---|---|---|
| 1 | GND | Ground | connect to GND |
| 2 | GND | Ground | connect to GND |
| 3 | N.C. | not connected | keep floating |
| 4 | N.C. | not connected | keep floating |
| 5 | N.C. | not connected | keep floating |
| 6 | SDA/GPIO1/PWM1 | Multiplexed serial data I 2 C, GPIO1 and PWM1 | keep floating |
| 7 | SCL/GPIO0/PWM0 | Multiplexed serial clock I 2 C, GPIO0 and PWM0 | keep floating |
| 8 | ED/PWM0 | Multiplexed event detection and PWM0 | keep floating |
| 9 | V CC | External power supply | keep floating |
| 10 | HPD | Hard power down | keep floating |
| 11 | GND | Ground | connect to GND |
| 12 | V OUT | Energy harvesting voltage output | keep floating |
| 13 | N.C. | not connected | keep floating |
| 14 | LB | Antenna connection | keep floating |
| 15 | LA | Antenna connection | keep floating |
| 16 | N.C. | not connected | keep floating |
- 1 16
2
15
3
14
4
13
5
12
-
6 11
-
7 10
8
9
aaa-034214
Figure 4. Pin configuration for TSSOP16 package
NTP53121G0JT Package Information
Figure 15. Package outline XQFN16
Figure 15. Package outline XQFN16
NTAG 5 link - NFC Forum-compliant I 2 C bridge
| UNIT | A max. | A 1 | A 2 | A 3 | b p | c | D (1) | E (2) | e | H E | L | L p | Q | v | w | y | (1) Z | θ |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| mm | 1.1 | 0.15 0.05 | 0.95 0.80 | 0.25 | 0.30 0.19 | 0.2 0.1 | 5.1 4.9 | 4.5 4.3 | 0.65 | 6.6 6.2 | 1 | 0.75 0.50 | 0.4 0.3 | 0.2 | 0.13 | 0.1 | 0.40 0.06 | 8 0 o o |
| OUTLINE VERSION | REFERENCES | REFERENCES | REFERENCES | EUROPEAN PROJECTION | ISSUE DATE |
|---|---|---|---|---|---|
| OUTLINE VERSION | IEC | JEDEC | JEITA | ||
| SOT403-1 | MO-153 | 99-12-27 03-02-18 |
Figure 16. Package outline TSSOP16
| UNIT | A max. | A 1 | A 2 | A 3 | b p | c | D (1) | E (2) | e | H E | L | L p | Q | v | w | y | (1) Z | θ |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| mm | 1.75 | 0.25 0.10 | 1.45 1.25 | 0.25 | 0.49 0.36 | 0.25 0.19 | 5.0 4.8 | 4.0 3.8 | 1.27 | 6.2 5.8 | 1.05 | 1.0 0.4 | 0.7 0.6 | 0.25 | 0.25 | 0.1 | 0.7 0.3 | 8 o |
| inches | 0.069 | 0.010 0.004 | 0.057 0.049 | 0.01 | 0.019 0.014 | 0.0100 0.0075 | 0.20 0.19 | 0.16 0.15 | 0.05 | 0.244 0.228 | 0.041 | 0.039 0.016 | 0.028 0.024 | 0.01 | 0.01 | 0.004 | 0.028 0.012 | 0 o |
| OUTLINE VERSION | REFERENCES | REFERENCES | REFERENCES | EUROPEAN PROJECTION | ISSUE DATE |
|---|---|---|---|---|---|
| OUTLINE VERSION | IEC | JEDEC | JEITA | ||
| SOT96-1 | 076E03 | MS-012 | 99-12-27 03-02-18 |
Figure 17. Package outline SO8
Variants on the same datasheet
These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.
| Part Number | Manufacturer | Package |
|---|---|---|
| NTP53121G0FUAV | NXP Semiconductors | Wafer |
| NTP53121G0JHK | NXP Semiconductors | XQFN-16 |
| NTP53121G0JHKZ | NXP Semiconductors | XQFN-16 |
| NTP53121G0JTT | NXP Semiconductors | TSSOP-16 |
| NTP53121G0JTTZ | NXP Semiconductors | TSSOP-16 |
| NTP53121G0JTZ | NXP Semiconductors | SO8 |
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