MSP430X2XX

Part: MSP430G2x13, MSP430G2x53 — Texas Instruments

Type: Ultra-Low-Power Mixed Signal Microcontroller

Description: The MSP430G2x13 and MSP430G2x53 series are ultra-low-power mixed signal microcontrollers featuring a 16-bit RISC CPU, 1.8 V to 3.6 V supply, up to 16 KB Flash, 512 B RAM, and integrated peripherals including 16-bit timers, USCI, and an optional 10-bit ADC.

Operating Conditions:

• Supply voltage: 1.8 V to 3.6 V
• Active Mode: 230 μA at 1 MHz, 2.2 V
• Standby Mode: 0.5 μA
• Off Mode (RAM Retention): 0.1 μA

Absolute Maximum Ratings:

Key Specs:

• CPU Architecture: 16-bit RISC
• Instruction Cycle Time: 62.5 ns
• Internal Frequencies: Up to 16 MHz
• Wake-Up From Standby: Less Than 1 μs
• Flash Memory: Up to 16 KB (MSP430G2553/G2513)
• RAM: Up to 512 B (MSP430G2553/G2453/G2513/G2413)
• I/O Pins: Up to 24 capacitive-touch enabled
• ADC: 10-bit, 200-ksps (MSP430G2x53 family members only)

Features:

• Five Power-Saving Modes (AM, LPM0, LPM1, LPM2, LPM3, LPM4)
• Basic Clock Module Configurations (Internal DCO, LF Oscillator, 32-kHz Crystal, External Digital Clock)
• Two 16-Bit Timer_A with Three Capture/Compare Registers
• Universal Serial Communication Interface (USCI) supporting Enhanced UART (LIN), IrDA, Synchronous SPI, I2C
• On-Chip Comparator for Analog Signal Compare Function or Slope A/D Conversion
• Brownout Detector
• Serial Onboard Programming with Security Fuse
• On-Chip Emulation Logic with Spy-Bi-Wire Interface

Applications:

• Low-cost sensor systems that capture analog signals
• Convert analog signals to digital values
• Process data for display or transmission to a host system
• Portable measurement applications

Package:

• TSSOP: 20 Pin, 28 Pin
• PDIP: 20 Pin
• QFN: 32 Pin

• ·
• Low Supply-Voltage Range: 1.8 V to 3.6 V
• Ultra-Low Power Consumption
• -Active Mode: 230 μA at 1 MHz, 2.2 V
• -Standby Mode: 0.5 μA
• -Off Mode (RAM Retention): 0.1 μA
• Five Power-Saving Modes
• Ultra-Fast Wake-Up From Standby Mode in Less Than 1 μs
• 16-Bit RISC Architecture, 62.5-ns Instruction Cycle Time
• Basic Clock Module Configurations
• -Internal Frequencies up to 16 MHz With Four Calibrated Frequency
• -Internal Very-Low-Power Low-Frequency (LF) Oscillator
• -32-kHz Crystal
• -External Digital Clock Source
• Two 16-Bit Timer_A With Three Capture/Compare Registers
• Up to 24 Capacitive-Touch Enabled I/O Pins

• PIN NAME (P1.x) FUNCTION CONTROL BITS AND SIGNALS (1)
• PIN NAME (P1.x) FUNCTION P1DIR.x P1SEL.x P1SEL2.x ADC10AE.x INCH.x=1 (2) CAPD.y
• P1.0/ TA0CLK/ ACLK/ A0 (2) / CA0/ Pin Osc P1.1/ 0 P1.x (I/O) I: 0; O: 1 0 0 0 0
• 0 TA0.TACLK 0 1 0 0 0
• 0 ACLK 1 1 0 0 0
• 0 A0 X X X 1 (y = 0) 0
• 0 CA0 X X X 0 1 (y = 0)
• 0 Capacitive sensing X 0 1 0 0
• TA0.0/ A1 (2) / CA1/ Pin Osc P1.2/ TA0.1/ 1 P1.x (I/O) I: 0; O: 1 0 0 0 0
• 1 TA0.0 1 1 0 0 0
• 1 TA0.CCI0A 0 1 0 0 0
• UCA0RXD/ 1 UCA0RXD from USCI 1 1 0 0
• UCA0SOMI/ 1 UCA0SOMI from USCI 1 1 0 0
• 1 A1 X X X 1 (y = 1) 0
• 1 CA1 X X X 0 1 (y = 1)
• 1 Capacitive sensing X 0 1 0 0
• 1 P1.x (I/O) I: 0; O: 1 0 0 0 0
• 1 TA0.1 1 1 0 0 0
• 1 TA0.CCI1A 0 1 0 0 0
• UCA0TXD/ UCA0SIMO/ 1 UCA0TXD from USCI 1 1 0 0
• 1 UCA0SIMO from USCI 1 1 0 0
• A2 (2) / 1 A2 X X X 1 (y = 2) 0
• CA2/ 1 CA2 X X X 0 1 (y = 2)
• Pin Osc 1 Capacitive sensing X 0 1 0 0

Typical values are specified at VCC = 3.3 V and TA = 25°C (unless otherwise noted)

Note: Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum VCC of 2.2 V.

Figure 1. Safe Operating Area