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MSP430

The MSP430 is an electronic component from Texas Instruments. View the full MSP430 datasheet below including absolute maximum ratings.

Manufacturer

Texas Instruments

Overview

Part: MSP430G2x13, MSP430G2x53 — Texas Instruments

Type: Ultra-Low-Power Mixed Signal Microcontroller

Description: The MSP430G2x13 and MSP430G2x53 series are ultra-low-power mixed signal microcontrollers featuring a 16-bit RISC CPU, 1.8 V to 3.6 V supply, up to 16 KB Flash, 512 B RAM, and integrated peripherals including 16-bit timers, USCI, and an optional 10-bit ADC.

Operating Conditions:

  • Supply voltage: 1.8 V to 3.6 V
  • Active Mode: 230 μA at 1 MHz, 2.2 V
  • Standby Mode: 0.5 μA
  • Off Mode (RAM Retention): 0.1 μA

Absolute Maximum Ratings:

Key Specs:

  • CPU Architecture: 16-bit RISC
  • Instruction Cycle Time: 62.5 ns
  • Internal Frequencies: Up to 16 MHz
  • Wake-Up From Standby: Less Than 1 μs
  • Flash Memory: Up to 16 KB (MSP430G2553/G2513)
  • RAM: Up to 512 B (MSP430G2553/G2453/G2513/G2413)
  • I/O Pins: Up to 24 capacitive-touch enabled
  • ADC: 10-bit, 200-ksps (MSP430G2x53 family members only)

Features:

  • Five Power-Saving Modes (AM, LPM0, LPM1, LPM2, LPM3, LPM4)
  • Basic Clock Module Configurations (Internal DCO, LF Oscillator, 32-kHz Crystal, External Digital Clock)
  • Two 16-Bit Timer_A with Three Capture/Compare Registers
  • Universal Serial Communication Interface (USCI) supporting Enhanced UART (LIN), IrDA, Synchronous SPI, I2C
  • On-Chip Comparator for Analog Signal Compare Function or Slope A/D Conversion
  • Brownout Detector
  • Serial Onboard Programming with Security Fuse
  • On-Chip Emulation Logic with Spy-Bi-Wire Interface

Applications:

  • Low-cost sensor systems that capture analog signals
  • Convert analog signals to digital values
  • Process data for display or transmission to a host system
  • Portable measurement applications

Package:

  • TSSOP: 20 Pin, 28 Pin
  • PDIP: 20 Pin
  • QFN: 32 Pin

Features

  • ·
  • Low Supply-Voltage Range: 1.8 V to 3.6 V
  • Ultra-Low Power Consumption
  • -Active Mode: 230 μA at 1 MHz, 2.2 V
  • -Standby Mode: 0.5 μA
  • -Off Mode (RAM Retention): 0.1 μA
  • Five Power-Saving Modes
  • Ultra-Fast Wake-Up From Standby Mode in Less Than 1 μs
  • 16-Bit RISC Architecture, 62.5-ns Instruction Cycle Time
  • Basic Clock Module Configurations
  • -Internal Frequencies up to 16 MHz With Four Calibrated Frequency
  • -Internal Very-Low-Power Low-Frequency (LF) Oscillator
  • -32-kHz Crystal
  • -External Digital Clock Source
  • Two 16-Bit Timer_A With Three Capture/Compare Registers
  • Up to 24 Capacitive-Touch Enabled I/O Pins

Pin Configuration

  • PIN NAME (P1.x) FUNCTION CONTROL BITS AND SIGNALS (1)
  • PIN NAME (P1.x) FUNCTION P1DIR.x P1SEL.x P1SEL2.x ADC10AE.x INCH.x=1 (2) CAPD.y
  • P1.0/ TA0CLK/ ACLK/ A0 (2) / CA0/ Pin Osc P1.1/ 0 P1.x (I/O) I: 0; O: 1 0 0 0 0
  • 0 TA0.TACLK 0 1 0 0 0
  • 0 ACLK 1 1 0 0 0
  • 0 A0 X X X 1 (y = 0) 0
  • 0 CA0 X X X 0 1 (y = 0)
  • 0 Capacitive sensing X 0 1 0 0
  • TA0.0/ A1 (2) / CA1/ Pin Osc P1.2/ TA0.1/ 1 P1.x (I/O) I: 0; O: 1 0 0 0 0
  • 1 TA0.0 1 1 0 0 0
  • 1 TA0.CCI0A 0 1 0 0 0
  • UCA0RXD/ 1 UCA0RXD from USCI 1 1 0 0
  • UCA0SOMI/ 1 UCA0SOMI from USCI 1 1 0 0
  • 1 A1 X X X 1 (y = 1) 0
  • 1 CA1 X X X 0 1 (y = 1)
  • 1 Capacitive sensing X 0 1 0 0
  • 1 P1.x (I/O) I: 0; O: 1 0 0 0 0
  • 1 TA0.1 1 1 0 0 0
  • 1 TA0.CCI1A 0 1 0 0 0
  • UCA0TXD/ UCA0SIMO/ 1 UCA0TXD from USCI 1 1 0 0
  • 1 UCA0SIMO from USCI 1 1 0 0
  • A2 (2) / 1 A2 X X X 1 (y = 2) 0
  • CA2/ 1 CA2 X X X 0 1 (y = 2)
  • Pin Osc 1 Capacitive sensing X 0 1 0 0

Absolute Maximum Ratings

Voltage applied at V CC to V SS-0.3 V to 4.1 V
Voltage applied to any pin (2)-0.3 V to V CC + 0.3 V
Diode current at any device pin±2 mA
Storage temperature range, T stg (3)Unprogrammed device-55°C to 150°C
Storage temperature range, T stg (3)Programmed device-55°C to 150°C

Recommended Operating Conditions

Typical values are specified at VCC = 3.3 V and TA = 25°C (unless otherwise noted)

MINNOMMAXUNIT
V CCSupplyDuring program execution1.83.6V
V CCvoltageDuring flash programming or erase2.23.6V
V SSSupply voltageSupply voltage0V
T AOperating free-air temperatureI version-4085°C
f SYSTEMProcessor frequency (maximum MCLK frequency) (1)(2)V CC = 1.8 V, Duty cycle = 50% ± 10%dc6
V CC = 2.7 V, Duty cycle = 50% ± 10%
V CC = 3.3 V, Duty cycle = 50% ± 10%
dc
dc
12
16
MHz

Note: Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum VCC of 2.2 V.

Figure 1. Safe Operating Area

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
MSP430G2Texas Instruments
MSP430G2113Texas Instruments
MSP430G2453Texas Instruments
MSP430G2453-Q1Texas Instruments
MSP430G2553Texas Instruments
MSP430G2553-Q1Texas Instruments32-QFN
MSP430G2X12Texas Instruments
MSP430G2X13Texas Instruments
MSP430G2X52Texas Instruments
MSP430G2X53Texas Instruments
MSP430X2XXTexas Instruments
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