MCP73831

MCP73831/2

Manufacturer

microchip

Overview

Part: MCP73831/2

Type: Single-Cell, Fully Integrated Li-Ion, Li-Polymer Charge Management Controller

Key Specs:

  • Voltage Regulation Accuracy: ± 0.75%
  • Programmable Charge Current: 15 mA to 500 mA
  • Operating Temperature Range: -40°C to +85°C
  • Supply Voltage (VDD): 3.75V to 6V
  • UVLO Start Threshold: 3.3V to 3.6V

Features:

  • Linear Charge Management Controller: Integrated Pass Transistor, Integrated Current Sense, Reverse Discharge Protection
  • High-Accuracy Preset Voltage Regulation
  • Four Voltage Regulation Options: 4.20V, 4.35V, 4.40V, 4.50V
  • Selectable Preconditioning: 10%, 20%, 40%, or Disable
  • Selectable End-of-Charge Control: 5%, 7.5%, 10%, or 20%
  • Charge Status Output: Tri-State for MCP73831, Open-Drain for MCP73832
  • Automatic Power-Down
  • Thermal Regulation
  • Constant-current/constant-voltage charge algorithm
  • Adheres to USB power bus specifications

Applications:

  • Lithium-Ion/Lithium-Polymer Battery Chargers
  • Personal Data Assistants
  • Cellular Telephones
  • Digital Cameras
  • MP3 Players
  • Bluetooth Headsets
  • USB Chargers

Package:

  • 8-Lead, 2 mm x 3 mm DFN
  • 5-Lead, SOT-23

Features

  • · Linear Charge Management Controller:
    • Integrated Pass Transistor
    • Integrated Current Sense
    • Reverse Discharge Protection
  • High-Accuracy Preset Voltage Regulation: ± 0.75%
  • · Four Voltage Regulation Options:
    • 4.20V, 4.35V, 4.40V, 4.50V
  • Programmable Charge Current: 15 mA to 500 mA
  • · Selectable Preconditioning:
    • 10%, 20%, 40%, or Disable
  • Selectable End-of-Charge Control:
    • 5%, 7.5%, 10%, or 20%
  • · Charge Status Output
    • Tri-State Output MCP73831
    • Open-Drain Output MCP73832
  • · Automatic Power-Down
  • · Thermal Regulation
  • Temperature Range: -40°C to +85°C
  • · Packaging:
    • 8-Lead, 2 mm x 3 mm DFN
    • 5-Lead, SOT-23

Applications

  • · Lithium-Ion/Lithium-Polymer Battery Chargers
  • · Personal Data Assistants
  • · Cellular Telephones
  • · Digital Cameras
  • MP3 Players
  • · Bluetooth Headsets
  • USB Chargers

Pin Configuration

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLES

| | Pin No. | |-----|----------|--------|----------------------------------------------------| | DFN | SOT-23-5 | Symbol | Function | | 1 | 4 | VDD | Battery Management Input Supply | | 2 | — | VDD | Battery Management Input Supply | | 3 | 3 | VBAT | Battery Charge Control Output | | 4 | — | VBAT | Battery Charge Control Output | | 5 | 1 | STAT | Charge Status Output | | 6 | 2 | VSS | Battery Management 0V Reference | | 7 | — | NC | No Connection | | 8 | 5 | PROG | Current Regulation Set and Charge Control Enable | | 9 | — | EP | Exposed Thermal Pad (EP); must be connected to VSS |

Electrical Characteristics

Absolute Maximum Ratings†

VDD7.0V
All Inputs and Outputs w.r.t. VSS
0.3 to (VDD+0.3)V
Maximum Junction Temperature, TJ
Internally Limited
Storage temperature65°C to +150°C
ESD protection on all pins:
Human Body Model (1.5 k in Series with 100 pF)4 kV
Machine Model (200 pF, No Series Resistance)400V

† Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Absolute Maximum Ratings

VDD7.0V
All Inputs and Outputs w.r.t. VSS
0.3 to (VDD+0.3)V
Maximum Junction Temperature, TJ
Internally Limited
Storage temperature65°C to +150°C
ESD protection on all pins:
Human Body Model (1.5 k in Series with 100 pF)4 kV
Machine Model (200 pF, No Series Resistance)400V

† Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Thermal Information

An internal electrical connection exists between the Exposed Thermal Pad (EP) and the VSS pin. They must be connected to the same potential on the Printed Circuit Board (PCB).

For better thermal performance, it is recommended to add vias from the land area of EP to a copper layer on the other side of the PCB.

Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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