MCP2544WFD

Part: MCP2542FD/4FD, MCP2542WFD/4WFD family

Type: CAN FD Transceiver

Description: High-speed CAN FD transceiver family supporting up to 8 Mbps communication speed, with variants for wake-up on CAN activity or Wake-Up Pattern (WUP), featuring very low standby current and high ESD protection.

Operating Conditions:

• Supply voltage (VIO): 1.8–5 V
• Supply voltage (VDD): Suitable for 12V and 24V systems (no specific range given)
• Operating temperature: -40 to +150 °C
• Max communication speed: 8 Mbps

Absolute Maximum Ratings:

• Max supply voltage (VDD): 7.0 V
• Max supply voltage (VIO): 7.0 V
• Max junction/storage temperature: +190 °C (Virtual Junction), +150 °C (Storage)

Key Specs:

• Max propagation delay: 120 ns
• Loop delay symmetry: -10%/+10% (at 2 Mbps)
• Standby current: 4 μA (typical)
• Wake-up activity filter time: 3.6 μs
• ESD protection on CANH and CANL: ±13 kV (IEC61000-4-2)
• Digital I/O supply voltage (VIO): 1.8V to 5V
• Qualification: AEC-Q100 Rev. G, Grade 0

Features:

• Supports CAN 2.0 and CAN FD Physical Layer Transceiver Requirements
• Optimized for CAN FD at 2, 5 and 8 Mbps Operation
• Wake-up on CAN activity or Wake-up on Pattern (WUP)
• Very Low Standby Current (4 μA, typical)
• Vio Supply Pin to Interface Directly to CAN Controllers and Microcontrollers with 1.8V to 5V I/O
• CAN Bus Pins are Disconnected when Device is Unpowered
• Automatic Thermal Shutdown Protection
• High Electrostatic Discharge (ESD) Protection on CANH and CANL

Applications:

• CAN 2.0 and CAN FD networks in Automotive
• Industrial
• Aerospace
• Medical
• Consumer

Package:

• 3x3 DFN
• 2x3TDFN
• SOIC

• Supports CAN 2.0 and CAN with Flexible Data Rate (CAN FD) Physical Layer Transceiver Requirements
• Optimized for CAN FD at 2, 5 and 8 Mbps Operation
  • Maximum propagation delay: 120 ns
  • Loop delay symmetry: -10%/+10% (2 Mbps)
• MCP2542FD/4FD:
  • Wake-up on CAN activity, 3.6 μs filter time
• MCP2542WFD/4WFD:
  • Wake-up on Pattern (WUP), as specified in ISO 11898-2:2016, 3.6 μs activity filter time
• Implements ISO 11898-2:2003, ISO 11898-5:2007, and ISO 11898-2:2016
• Qualification: AEC-Q100 Rev. G, Grade 0 (-40°C to +150°C)
• Very Low Standby Current (4 μA, typical)
• Vio Supply Pin to Interface Directly to CAN Controllers and Microcontrollers with 1.8V to 5V I/O
• CAN Bus Pins are Disconnected when Device is Unpowered
  • An unpowered node or brown-out event will not load the CAN bus
  • Device is unpowered if VDD or Vio drop below its POR level
• · Detection of Ground Fault:
  • Permanent Dominant detection on TXD
  • Permanent Dominant detection on bus
• · Automatic Thermal Shutdown Protection
• Suitable for 12V and 24V Systems
• Meets or Exceeds Stringent Automotive Design Requirements Including "Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications", Version 1.3, May 2012
  • Conducted emissions @ 2 Mbps with Common-Mode Choke (CMC)
  • Direct Power Injection (DPI) @ 2 Mbps with CMC
• Meets SAE J2962/2 "Communication Transceiver Qualification Requirements - CAN"
  • Radiated emissions @ 2 Mbps without a CMC
• High Electrostatic Discharge (ESD) Protection on CANH and CANL, meeting IEC61000-4-2 up to ±13 kV
• · Temperature ranges:
  • Extended (E): -40°C to +125°C
  • High (H): -40°C to +150°C

CAN 2.0 and CAN FD networks in Automotive, Industrial, Aerospace, Medical, and Consumer applications.

The description of the pins are listed in Table 1-1.

TABLE 1-1: MCP2542/4FD AND MCP2542/4WFD PIN DESCRIPTIONS

2.1 Terms and Definitions

A number of terms are defined in ISO 11898 that are used to describe the electrical characteristics of a CAN transceiver device. These terms and definitions are summarized in this section.

2.1.1 BUS VOLTAGE

VCANL and VCANH denote the voltages of the bus line wires CANL and CANH relative to the ground of each individual CAN node.

2.1.2 COMMON MODE BUS VOLTAGE RANGE

Boundary voltage levels of VCANL and VCANH with respect to ground, for which proper operation will occur, if up to the maximum number of CAN nodes are connected to the bus.

2.1.3 DIFFERENTIAL INTERNAL CAPACITANCE, CDIFF (OF A CAN NODE)

Capacitance seen between CANL and CANH during the Recessive state when the CAN node is disconnected from the bus (see Figure 2-1).

2.1.4 DIFFERENTIAL INTERNAL RESISTANCE, RDIFF (OF A CAN NODE)

Resistance seen between CANL and CANH during the Recessive state when the CAN node is disconnected from the bus (see Figure 2-1).

2.1.5 DIFFERENTIAL VOLTAGE, VDIFF (OF CAN BUS)

Differential voltage of the two-wire CAN bus, with value equal to VDIFF = VCANH – VCANL.

2.1.6 INTERNAL CAPACITANCE, CIN (OF A CAN NODE)

Capacitance seen between CANL (or CANH) and ground during the Recessive state when the CAN node is disconnected from the bus (see Figure 2-1).

2.1.7 INTERNAL RESISTANCE, RIN (OF A CAN NODE)

Resistance seen between CANL (or CANH) and ground during the Recessive state when the CAN node is disconnected from the bus (see Figure 2-1).

FIGURE 2-1: PHYSICAL LAYER DEFINITIONS

• VIO7.0V
• DC Voltage at TXD, RXD, STBY and VSS0.3V to VIO + 0.3V
• DC Voltage at CANH and CANL58V to +58V
• Transient Voltage on CANH and CANL (ISO-7637) (Figure 2-5)150V to +100V
• Differential Bus Input Voltage VDIFF(I) (t = 60 days, continuous)5V to +10V
• Differential Bus Input Voltage VDIFF(I) (1000 pulses, t = 0.1 ms, VCANH = +18V)+17V
• Dominant State Detection VDIFF(I) (10000 pulses, t = 1 ms)+9V
• Storage temperature55°C to +150°C
• Operating ambient temperature40°C to +150°C
• Virtual Junction Temperature, TVJ (IEC60747-1)40°C to +190°C
• Soldering temperature of leads (10 seconds)+300°C
• ESD protection on CANH and CANL pins (IEC 61000-4-2)±13 kV
• ESD protection on CANH and CANL pins (IEC 801; Human Body Model)±8 kV
• ESD protection on all other pins (IEC 801; Human Body Model)±4 kV
• ESD protection on all pins (IEC 801; Machine Model)±400V
• ESD protection on all pins (IEC 801; Charge Device Model)±750V

† Notice: Stresses above those listed under "Maximum ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

TABLE 2-1: DC CHARACTERISTICS

Note 1: Characterized; not 100% tested.

^2: Only MCP2542FD and MCP2542WFD have a VIO pin. For the MCP2544FD and MCP2544WFD, VIO is internally connected to VDD.

^3: -12V to 12V is ensured by characterization, and tested from -2V to 7V.

TABLE 2-1: DC CHARACTERISTICS (CONTINUED)

Note 1: Characterized; not 100% tested.

^2: Only MCP2542FD and MCP2542WFD have a VIO pin. For the MCP2544FD and MCP2544WFD, VIO is internally connected to VDD.

^3: -12V to 12V is ensured by characterization, and tested from -2V to 7V.

TABLE 2-1: DC CHARACTERISTICS (CONTINUED)

TABLE 2-1: DC CHARACTERISTICS (CONTINUED)

^2: Only MCP2542FD and MCP2542WFD have a VIO pin. For the MCP2544FD and MCP2544WFD, VIO is internally connected to VDD.

^3: -12V to 12V is ensured by characterization, and tested from -2V to 7V.

TABLE 2-2: AC CHARACTERISTICS

• 2: Only MCP2542FD and MCP2542WFD have a VIO pin. For the MCP2544FD and MCP2544WFD, VIO is internally connected to VDD.
• 3: Characterized. Not in ISO 11898 2:2016.

TABLE 2-2: AC CHARACTERISTICS (CONTINUED)

| AC Characteristics | Electrical Characteristics: Unless otherwise indicated, Extended (E):
TAMB = -40°C to +125°C and High (H): TAMB = -40°C to +150°C;
VDD = 4.5V to 5.5V, VIO = 1.7V to 5.5V (Note 2), RL = 60Ω, CL = 100 pF.
Maximum VDIFF(D)(I) = 3V. | |---|---|---|---|---|---|---|---| | Param.
No. | Parameter | Sym. | Min. | Typ. | Max. | Units | Conditions | | 1 | Bit Time | tBIT | 0.125 | — | 69.44 | µs | | | 2 | Nominal Bit Rate | NBR | 14.4 | — | 8000 | kbps | | | 3 | Delay TXD Low to Bus Dominant | tTXD-BUSON | — | 50 | 85 | ns | Note 1 | | 4 | Delay TXD High to Bus Recessive | tTXD-BUSOFF | — | 40 | 85 | ns | Note 1 | | 5 | Delay Bus Dominant to RXD | tBUSON-RXD | — | 70 | 85 | ns | Note 1 |

3: Characterized. Not in ISO 11898 2:2016.

^2: Only MCP2542FD and MCP2542WFD have a VIO pin. For the MCP2544FD and MCP2544WFD, VIO is internally connected to VDD.

TABLE 2-2: AC CHARACTERISTICS (CONTINUED)

• 2: Only MCP2542FD and MCP2542WFD have a VIO pin. For the MCP2544FD and MCP2544WFD, VIO is internally connected to VDD.
• 3: Characterized. Not in ISO 11898 2:2016.

FIGURE 2-3: TEST LOAD CONDITIONS

FIGURE 2-4:

Test Circuit for Electrical Characteristics

FIGURE 2-5: TEST CIRCUIT FOR AUTOMOTIVE TRANSIENTS

Note 1: On MCP2544FD and MCP2544WFD, VIO is connected to VDD.

2: The wave forms of the applied transients shall be in accordance with ISO-7637, Part 1, test pulses 1, 2, 3a and 3b.

It is recommended to connect this pad to VSS to enhance electromagnetic immunity and thermal resistance.

In order to meet the EMC/EMI requirements, a Common Mode Choke (CMC) may be required for data rates greater than 1 Mbps. Figure 1-3 and Figure 1-4 illustrate examples of typical applications of the devices.

FIGURE 1-3: MCP2544WFD WITH NC AND SPLIT TERMINATION

FIGURE 1-4: MCP2542FD WITH Vio PIN