Part: MCP2542FD/4FD, MCP2542WFD/4WFD

Type: CAN FD Transceiver

Description: High-speed CAN FD transceiver family supporting CAN 2.0 and CAN FD up to 8 Mbps, featuring very low standby current, wake-up on CAN activity or Wake-up Pattern (WUP), and compliance with ISO 11898-2:2016.

Operating Conditions:

• VIO supply voltage: 1.8V to 5V
• Operating temperature: -40°C to +150°C
• Max communication speed: 8 Mbps

Absolute Maximum Ratings:

• Max VDD supply voltage: 7.0V
• Max VIO supply voltage: 7.0V
• Max DC voltage at CANH and CANL: -58V to +58V
• Max storage temperature: -55°C to +150°C
• Max operating ambient temperature: -40°C to +150°C

Key Specs:

• Max propagation delay: 120 ns
• Loop delay symmetry: -10%/+10% (at 2 Mbps)
• Standby current: 4 μA (typical)
• Wake-up activity filter time: 3.6 μs
• ESD protection on CANH and CANL: up to ±13 kV (IEC61000-4-2)
• Thermal shutdown junction temperature: +175°C (nominal limit)
• VDD Power-on Reset (POR) threshold: 3.0V (typical)
• VIO Power-on Reset (POR) threshold: 1.2V (typical)

Features:

• Supports CAN 2.0 and CAN FD Physical Layer Transceiver Requirements
• Optimized for CAN FD at 2, 5 and 8 Mbps Operation
• Wake-up on CAN activity (MCP2542FD/4FD)
• Wake-up on Pattern (WUP) as specified in ISO 11898-2:2016 (MCP2542WFD/4WFD)
• Implements ISO 11898-2:2016
• Qualified According to AEC-Q100 Rev. G
• VIO Supply Pin to Interface Directly to CAN Controllers and Microcontrollers with 1.8V to 5V I/O
• CAN Bus Pins are Disconnected when Device is Unpowered
• Detection of Ground Fault
• Automatic Thermal Shutdown Protection
• Suitable for 12V and 24V Systems
• High Electrostatic Discharge (ESD) Protection on CANH and CANL

Applications:

• CAN 2.0 and CAN FD networks in automotive, industrial, aerospace, medical and consumer applications.

Package:

• 3x3 DFN
• 2x3 TDFN
• SOIC

• Supports CAN 2.0 and CAN with Flexible Data-Rate (CAN FD) Physical Layer Transceiver Requirements

• Optimized for CAN FD at 2, 5 and 8 Mbps Operation:

• -Maximum propagation delay: 120 ns

Loop delay symmetry: -10%/+10% (2 Mbps)

• MCP2542FD/4FD:
• -Wake-up on CAN activity, 3.6 μs filter time
• MCP2542WFD/4WFD:
• -Wake-up on Pattern (WUP), as specified in ISO 11898-2:2016, 3.6 μs activity filter time
• Implements ISO 11898-2:2016
• Qualified According to AEC-Q100 Rev. G
• Very Low Standby Current (4 μA, typical)
• VIO Supply Pin to Interface Directly to CAN Controllers and Microcontrollers with 1.8V to 5V I/O
• CAN Bus Pins are Disconnected when Device is Unpowered:
• -An unpowered node or brown-out event will not load the CAN bus
• -Device is unpowered if VDD or VIO drop below its POR level
• Detection of Ground Fault:
• -Permanent dominant detection on TXD
• -Permanent dominant detection on bus
• Automatic Thermal Shutdown Protection
• Suitable for 12V and 24V Systems
• Meets or Exceeds Stringent Automotive Design Requirements, Including ' Hardware Requirements for LIN, CAN and FlexRay Interfaces in

Automotive Applications ', Version 1.3, May 2012:

• -Conducted emissions @ 2 Mbps with Common-Mode Choke (CMC)
• -Direct Power Injection (DPI) @ 2 Mbps with CMC
• Meets SAE J2962/2 ' Communication Transceiver Qualification Requirements - CAN ':
• -Radiated emissions @ 2 Mbps without a CMC
• High Electrostatic Discharge (ESD) Protection on CANH and CANL, meeting IEC61000-4-2 up to ±13 kV
• Temperature Ranges:
• -Extended (E): -40°C to +125°C
• -High (H): -40°C to +150°C

CAN 2.0 and CAN FD networks in automotive, industrial, aerospace, medical and consumer applications.

MCP2542FD Pinout

Package: 3x3 DFN

Notes

• Pin numbers extracted from the MCP2542FD column in the 3x3 DFN package variant of Table 1-1.
• MCP2542FD has 9 pins total (including exposed thermal pad).
• MCP2544FD variant includes an additional NC (No Connect) pin at position 5 in its DFN package; MCP2542FD does not have this pin.
• EP (Exposed Thermal Pad) at pin 9 is for thermal management and should be soldered to ground plane.

Note 1: Characterized; not 100% tested.

• 2: Only MCP2542FD and MCP2542WFD have a VIO pin. For the MCP2544FD and MCP2544WFDT, VIO is internally connected to VDD.
• 3: -12V to 12V is ensured by characterization and tested from -2V to 7V.

• VIO ..............................................................................................................................................................................7.0V
• DC Voltage at TXD, RXD, STBY and VSS ............................................................................................ -0.3V to VIO + 0.3V
• DC Voltage at CANH and CANL..................................................................................................................-58V to +58V
• Transient Voltage on CANH and CANL (ISO-7637) (Figure 2-5) .............................................................-150V to +100V
• Differential Bus Input Voltage VDIFF ( I ) (t = 60 days, continuous) ...................................................................-5V to +10V
• Differential Bus Input Voltage VDIFF ( I ) (1000 pulses, t = 0.1 ms, VCANH = +18V).....................................................+17V
• Dominant State Detection VDIFF ( I ) (10000 pulses, t = 1 ms).......................................................................................+9V
• Storage Temperature...............................................................................................................................-55°C to +150°C
• Operating Ambient Temperature .............................................................................................................-40°C to +150°C
• Virtual Junction Temperature, TVJ (IEC 60747-1)....................................................................................-40°C to +190°C
• Soldering Temperature of Leads (10 seconds) .....................................................................................................+300°C
• ESD Protection on CANH and CANL Pins (IEC 61000-4-2) ..................................................................................±13 kV
• ESD Protection on CANH and CANL Pins (IEC 801; Human Body Model).............................................................±8 kV
• ESD Protection on All Other Pins (IEC 801; Human Body Model)...........................................................................±4 kV
• ESD Protection on All Pins (IEC 801; Machine Model) ...........................................................................................±400V
• ESD Protection on All Pins (IEC 801; Charge Device Model).................................................................................±750V

† Notice: Stresses above those listed under 'Maximum ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

It is recommended to connect this pad to VSS to enhance electromagnetic immunity and thermal resistance.

In order to meet the EMC/EMI requirements, a Common-Mode Choke (CMC) may be required for data rates greater than 1 Mbps. Figure 1-3 and Figure 1-4 illustrate examples of typical applications of the devices.

FIGURE 1-3: MCP2544WFDT WITH NC AND SPLIT TERMINATION

FIGURE 1-4: MCP2542FD WITH VIO PIN

• Dimensioning and tolerancing per ASME Y14.5M 1.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-2057-SN Rev F