Part: MCP2542FD/4FD, MCP2542WFD/4WFD Family

Type: CAN FD Transceiver

Key Specs:

• Maximum propagation delay: 120 ns
• Loop delay symmetry: -10%/+10% (2 Mbps)
• Standby current: 4 μA (typical)
• VIO supply voltage range: 1.8V to 5V
• Communication speed: up to 8 Mbps
• ESD protection on CANH and CANL: up to ±13 kV (IEC61000-4-2)
• Extended temperature range: -40°C to +125°C
• High temperature range: -40°C to +150°C

Features:

• Supports CAN 2.0 and CAN FD Physical Layer Transceiver Requirements
• Optimized for CAN FD at 2, 5 and 8 Mbps Operation
• MCP2542FD/4FD: Wake-up on CAN activity, 3.6 μs filter time
• MCP2542WFD/4WFD: Wake-up on Pattern (WUP) as specified in ISO 11898-2:2016, 3.6 μs activity filter time
• Implements ISO 11898-2:2016
• Qualified According to AEC-Q100 Rev. G
• VIO Supply Pin to Interface Directly to CAN Controllers and Microcontrollers
• CAN Bus Pins are Disconnected when Device is Unpowered
• Detection of Ground Fault
• Automatic Thermal Shutdown Protection
• Suitable for 12V and 24V Systems
• Meets or Exceeds Stringent Automotive Design Requirements ("Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications", Version 1.3, May 2012)
• Meets SAE J2962/2 "Communication Transceiver Qualification Requirements - CAN"
• High Electrostatic Discharge (ESD) Protection on CANH and CANL
• Permanent dominant detection on TXD
• Permanent dominant detection on bus
• Power-on Reset (POR) and Undervoltage Detection on VDD and VIO

Applications:

• CAN 2.0 and CAN FD networks in automotive
• Industrial
• Aerospace
• Medical
• Consumer applications

Package:

• 3x3 DFN*: Includes Exposed Thermal Pad (EP)
• 8-Lead SOIC
• 2x3 TDFN*: Includes Exposed Thermal Pad (EP)

• Supports CAN 2.0 and CAN with Flexible Data-Rate (CAN FD) Physical Layer Transceiver Requirements
• Optimized for CAN FD at 2, 5 and 8 Mbps Operation:
• Maximum propagation delay: 120 ns
• Loop delay symmetry: -10%/+10% (2 Mbps)
• MCP2542FD/4FD:
  • Wake-up on CAN activity, 3.6 μs filter time
• MCP2542WFD/4WFD:
• Wake-up on Pattern (WUP), as specified in
• ISO 11898-2:2016, 3.6 μs activity filter time • Implements ISO 11898-2:2016
• Qualified According to AEC-Q100 Rev. G
• Very Low Standby Current (4 μA, typical)
• VIO Supply Pin to Interface Directly to CAN Controllers and Microcontrollers with 1.8V to 5V I/O
• CAN Bus Pins are Disconnected when Device is Unpowered:
  • An unpowered node or brown-out event will not load the CAN bus
  • Device is unpowered if VDD or VIO drop below its POR level
• Detection of Ground Fault:
• Permanent dominant detection on TXD
• Permanent dominant detection on bus
• Automatic Thermal Shutdown Protection
• Suitable for 12V and 24V Systems
• Meets or Exceeds Stringent Automotive Design Requirements, Including "Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications", Version 1.3, May 2012:
  • Conducted emissions @ 2 Mbps with Common-Mode Choke (CMC)
  • Direct Power Injection (DPI) @ 2 Mbps with CMC
• Meets SAE J2962/2 "Communication Transceiver Qualification Requirements - CAN":
  • Radiated emissions @ 2 Mbps without a CMC
• High Electrostatic Discharge (ESD) Protection on CANH and CANL, meeting IEC61000-4-2 up to ±13 kV
• Temperature Ranges:
  • Extended (E): -40°C to +125°C
  • High (H): -40°C to +150°C

Description

The MCP2542FD/4FD and MCP2542WFD/4WFD CAN transceiver family is designed for high-speed CAN FD applications of up to 8 Mbps communication speed. The maximum propagation delay was improved to support longer bus length.

The device meets the automotive requirements for CAN FD bit rates exceeding 2 Mbps, low quiescent current, Electromagnetic Compatibility (EMC) and Electrostatic Discharge (ESD).

CAN 2.0 and CAN FD networks in automotive, industrial, aerospace, medical and consumer applications.

MCP2542FD Pinout

Package: 3x3 DFN

Notes

• TXD: Connected to internal pull-up resistor (nominal 33 kΩ) to VIO. Driven Low for Dominant state, High for Recessive state.
• RXD: CMOS-compatible output supplied by VIO. High when CAN bus is Recessive, Low in Dominant state.
• VIO: Digital I/O supply for TXD, RXD, and STBY pins. Supports 1.8V to 5V operation.
• STBY: Internal MOS pull-up resistor to VIO. Selects Normal (Low) or Standby (High) mode.
• EP (Exposed Thermal Pad): Recommended to connect to VSS for improved electromagnetic immunity and thermal performance.
• CANL/CANH: Differential CAN bus pins; internally disconnected from bus when device is unpowered.

Note 1: Characterized; not 100% tested.

2: Only MCP2542FD and MCP2542WFD have a VIO pin. For the MCP2544FD and MCP2544WFDT, VIO is internally connected to VDD.

• VIO7.0V
• DC Voltage at TXD, RXD, STBY and VSS -0.3V to VIO + 0.3V
• DC Voltage at CANH and CANL -58V to +58V
• Transient Voltage on CANH and CANL (ISO-7637) (Figure 2-5) -150V to +100V
• Differential Bus Input Voltage VDIFF(I) (t = 60 days, continuous) -5V to +10V
• Differential Bus Input Voltage VDIFF(I) (1000 pulses, t = 0.1 ms, VCANH = +18V) +17V
• Dominant State Detection VDIFF(I) (10000 pulses, t = 1 ms)+9V
• Storage Temperature-55°C to +150°C
• Operating Ambient Temperature -40°C to +150°C
• Virtual Junction Temperature, TVJ (IEC 60747-1)-40°C to +190°C
• Soldering Temperature of Leads (10 seconds) +300°C
• ESD Protection on CANH and CANL Pins (IEC 61000-4-2) ±13 kV
• ESD Protection on CANH and CANL Pins (IEC 801; Human Body Model) ±8 kV
• ESD Protection on All Other Pins (IEC 801; Human Body Model)±4 kV
• ESD Protection on All Pins (IEC 801; Machine Model) ±400V
• ESD Protection on All Pins (IEC 801; Charge Device Model)±750V

† Notice: Stresses above those listed under "Maximum ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

It is recommended to connect this pad to VSS to enhance electromagnetic immunity and thermal resistance.