MAX30102EFD+T
The MAX30102EFD+T is an electronic component. View the full MAX30102EFD+T datasheet below including electrical characteristics, absolute maximum ratings.
Overview
Part: MAX30102, Maxim Integrated
Type: Integrated Pulse Oximetry and Heart-Rate Monitor Module
Description: The MAX30102 is an integrated pulse oximetry and heart-rate monitor module featuring internal LEDs, photodetectors, and an 18-bit ADC, operating from 1.7V to 5.0V supplies with ultra-low power consumption and I2C communication.
Operating Conditions:
- Supply voltage: VDD: 1.7–2.0 V, VLED+: 3.1–5.0 V
- Operating temperature: -40 to +85 °C
- ADC Resolution: 18 bits
- I2C Serial Clock Frequency: 0–400 kHz
Absolute Maximum Ratings:
- Max supply voltage: VDD: +2.2V, VLED+: +6.0V
- Max continuous current: ±20mA (into any terminal)
- Max junction/storage temperature: +90°C (Junction), +105°C (Storage)
Key Specs:
- VDD Power-Supply Voltage: 1.7–2.0 V
- VLED+ LED Supply Voltage: 3.1–5.0 V
- Supply Current (SpO2 and HR mode): 600 μA (typ) to 1200 μA (max) at 50sps
- Supply Current in Shutdown: 0.7 μA (typ)
- ADC Resolution: 18 bits
- IR LED Peak Wavelength: 870–900 nm (typ 880 nm) at ILED = 20mA
- Red LED Peak Wavelength: 650–670 nm (typ 660 nm) at ILED = 20mA
- Temperature Sensor Accuracy: ±1 °C (typ)
- I2C Serial Clock Frequency: 0–400 kHz
Features:
- Heart-Rate Monitor and Pulse Oximeter Sensor in LED Reflective Solution
- Tiny 5.6mm x 3.3mm x 1.55mm 14-Pin Optical Module
- Integrated Cover Glass for Optimal, Robust Performance
- Ultra-Low Power Operation for Mobile Devices
- Programmable Sample Rate and LED Current for Power Savings
- Low-Power Heart-Rate Monitor (< 1mW)
- Ultra-Low Shutdown Current (0.7μA, typ)
- Fast Data Output Capability
- High Sample Rates
- Robust Motion Artifact Resilience
- High SNR
- -40°C to +85°C Operating Temperature Range
Applications:
- Wearable Devices
- Fitness Assistant Devices
- Smartphones
- Tablets
Package:
- 14 OESIP (5.6mm x 3.3mm x 1.55mm)
Features
- Heart-Rate Monitor and Pulse Oximeter Sensor in LED Reflective Solution
- Tiny 5.6mm x 3.3mm x 1.55mm 14-Pin Optical Module · Integrated Cover Glass for Optimal, Robust Performance
- Ultra-Low Power Operation for Mobile Devices
- Programmable Sample Rate and LED Current for Power Savings
- Low-Power Heart-Rate Monitor (< 1mW)
- Ultra-Low Shutdown Current (0.7μA, typ)
- Fast Data Output Capability
- High Sample Rates
- Robust Motion Artifact Resilience
- High SNR
- -40°C to +85°C Operating Temperature Range
Ordering Information appears at end of data sheet.
Applications
- Wearable Devices
- Fitness Assistant Devices
- Smartphones
- Tablets
Pin Configuration
Electrical Characteristics
(V DD = 1.8V, V LED+ = 5.0V, T A = -40°C to +85°C, unless otherwise noted. Typical values are at T A = +25°C) (Note 1)
| PARAMETER | SYMBOL | CONDITIONS | MIN | TYP | MAX | UNITS |
|---|---|---|---|---|---|---|
| POWER SUPPLY | POWER SUPPLY | POWER SUPPLY | POWER SUPPLY | POWER SUPPLY | POWER SUPPLY | POWER SUPPLY |
| Power-Supply Voltage | V DD | Guaranteed by RED and IR count tolerance | 1.7 | 1.8 | 2.0 | V |
| LED Supply Voltage V LED+ to PGND | V LED+ | Guaranteed by PSRR of LED driver | 3.1 | 3.3 | 5.0 | V |
| Supply Current | I DD | SpO 2 and HR mode, PW = 215μs, 50sps | 600 | 1200 | μA | |
| Supply Current | I DD | IR only mode, PW = 215μS, 50sps | 600 | 1200 | 1200 | μA |
| Supply Current in Shutdown | I SHDN | T A = +25°C, MODE = 0x80 | 0.7 | 10 | μA |
│
Absolute Maximum Ratings
-
GND to PGND......................................................-0.3V to +0.3V
-
V LED+ to PGND....................................................-0.3V to +6.0V
-
All Other Pins to GND..........................................-0.3V to +6.0V
-
Output Short-Circuit Current Duration.......................Continuous
-
Continuous Input Current into Any Terminal ....................±20mA
-
ESD, Human Body Model (HBM).......................................2.5kV
-
Latchup Immunity...........................................................±250mA
-
Operating Temperature Range.......................... -40°C to +85°C
-
Junction Temperature........................................................+90°C
-
Soldering Temperature (reflow) ......................................+260°C
-
Storage Temperature Range............................ -40°C to +105°C
Stresses beyond those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Typical Application
Package Information
| PACKAGE TYPE: 14 OESIP | PACKAGE TYPE: 14 OESIP |
|---|---|
| Package Code | F143A5MK+1 |
| Outline Number | 21-1048 |
| Land Pattern Number | 90-0602 |
| THERMAL RESISTANCE, FOUR-LAYER BOARD | THERMAL RESISTANCE, FOUR-LAYER BOARD |
| Junction to Ambient (θ JA ) | 180°C/W |
| Junction to Case (θ JC ) | 150°C/W |
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial .
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages . Note that a '+', '#', or '-' in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| MAX30102 | Analog Devices | — |
| MAX30102EFD | Analog Devices | — |
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