MAX30102EFD
Pulse Oximetry and Heart-Rate Monitor ModuleThe MAX30102EFD is a pulse oximetry and heart-rate monitor module from Analog Devices. View the full MAX30102EFD datasheet below including electrical characteristics, absolute maximum ratings.
Manufacturer
Analog Devices
Category
Pulse Oximetry and Heart-Rate Monitor Module
Overview
Part: MAX30102, Maxim Integrated
Type: Integrated Pulse Oximetry and Heart-Rate Monitor Module
Description: The MAX30102 is an integrated pulse oximetry and heart-rate monitor module featuring internal LEDs, photodetectors, and an 18-bit ADC, operating from 1.7V to 5.0V supplies with ultra-low power consumption and I2C communication.
Operating Conditions:
- Supply voltage: VDD: 1.7–2.0 V, VLED+: 3.1–5.0 V
- Operating temperature: -40 to +85 °C
- ADC Resolution: 18 bits
- I2C Serial Clock Frequency: 0–400 kHz
Absolute Maximum Ratings:
- Max supply voltage: VDD: +2.2V, VLED+: +6.0V
- Max continuous current: ±20mA (into any terminal)
- Max junction/storage temperature: +90°C (Junction), +105°C (Storage)
Key Specs:
- VDD Power-Supply Voltage: 1.7–2.0 V
- VLED+ LED Supply Voltage: 3.1–5.0 V
- Supply Current (SpO2 and HR mode): 600 μA (typ) to 1200 μA (max) at 50sps
- Supply Current in Shutdown: 0.7 μA (typ)
- ADC Resolution: 18 bits
- IR LED Peak Wavelength: 870–900 nm (typ 880 nm) at ILED = 20mA
- Red LED Peak Wavelength: 650–670 nm (typ 660 nm) at ILED = 20mA
- Temperature Sensor Accuracy: ±1 °C (typ)
- I2C Serial Clock Frequency: 0–400 kHz
Features:
- Heart-Rate Monitor and Pulse Oximeter Sensor in LED Reflective Solution
- Tiny 5.6mm x 3.3mm x 1.55mm 14-Pin Optical Module
- Integrated Cover Glass for Optimal, Robust Performance
- Ultra-Low Power Operation for Mobile Devices
- Programmable Sample Rate and LED Current for Power Savings
- Low-Power Heart-Rate Monitor (< 1mW)
- Ultra-Low Shutdown Current (0.7μA, typ)
- Fast Data Output Capability
- High Sample Rates
- Robust Motion Artifact Resilience
- High SNR
- -40°C to +85°C Operating Temperature Range
Applications:
- Wearable Devices
- Fitness Assistant Devices
- Smartphones
- Tablets
Package:
- 14 OESIP (5.6mm x 3.3mm x 1.55mm)
Features
- Heart-Rate Monitor and Pulse Oximeter Sensor in LED Reflective Solution
- Tiny 5.6mm x 3.3mm x 1.55mm 14-Pin Optical Module · Integrated Cover Glass for Optimal, Robust Performance
- Ultra-Low Power Operation for Mobile Devices
- Programmable Sample Rate and LED Current for Power Savings
- Low-Power Heart-Rate Monitor (< 1mW)
- Ultra-Low Shutdown Current (0.7μA, typ)
- Fast Data Output Capability
- High Sample Rates
- Robust Motion Artifact Resilience
- High SNR
- -40°C to +85°C Operating Temperature Range
Ordering Information appears at end of data sheet.
Applications
- Wearable Devices
- Fitness Assistant Devices
- Smartphones
- Tablets
Pin Configuration
Electrical Characteristics
(V DD = 1.8V, V LED+ = 5.0V, T A = -40°C to +85°C, unless otherwise noted. Typical values are at T A = +25°C) (Note 1)
| PARAMETER | SYMBOL | CONDITIONS | MIN | TYP | MAX | UNITS |
|---|---|---|---|---|---|---|
| POWER SUPPLY | POWER SUPPLY | POWER SUPPLY | POWER SUPPLY | POWER SUPPLY | POWER SUPPLY | POWER SUPPLY |
| Power-Supply Voltage | V DD | Guaranteed by RED and IR count tolerance | 1.7 | 1.8 | 2.0 | V |
| LED Supply Voltage V LED+ to PGND | V LED+ | Guaranteed by PSRR of LED driver | 3.1 | 3.3 | 5.0 | V |
| Supply Current | I DD | SpO 2 and HR mode, PW = 215μs, 50sps | 600 | 1200 | μA | |
| Supply Current | I DD | IR only mode, PW = 215μS, 50sps | 600 | 1200 | 1200 | μA |
| Supply Current in Shutdown | I SHDN | T A = +25°C, MODE = 0x80 | 0.7 | 10 | μA |
│
Absolute Maximum Ratings
- GND to PGND......................................................-0.3V to +0.3V
- V LED+ to PGND....................................................-0.3V to +6.0V
- All Other Pins to GND..........................................-0.3V to +6.0V
- Output Short-Circuit Current Duration.......................Continuous
- Continuous Input Current into Any Terminal ....................±20mA
- ESD, Human Body Model (HBM).......................................2.5kV
- Latchup Immunity...........................................................±250mA
Typical Application
Package Information
| PACKAGE TYPE: 14 OESIP | PACKAGE TYPE: 14 OESIP |
|---|---|
| Package Code | F143A5MK+1 |
| Outline Number | 21-1048 |
| Land Pattern Number | 90-0602 |
| THERMAL RESISTANCE, FOUR-LAYER BOARD | THERMAL RESISTANCE, FOUR-LAYER BOARD |
| Junction to Ambient (θ JA ) | 180°C/W |
| Junction to Case (θ JC ) | 150°C/W |
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial .
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages . Note that a '+', '#', or '-' in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| MAX30102 | Analog Devices | — |
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