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MAX30102EFD

Pulse Oximetry and Heart-Rate Monitor Module

The MAX30102EFD is a pulse oximetry and heart-rate monitor module from Analog Devices. View the full MAX30102EFD datasheet below including electrical characteristics, absolute maximum ratings.

Manufacturer

Analog Devices

Category

Pulse Oximetry and Heart-Rate Monitor Module

Overview

Part: MAX30102, Maxim Integrated

Type: Integrated Pulse Oximetry and Heart-Rate Monitor Module

Description: The MAX30102 is an integrated pulse oximetry and heart-rate monitor module featuring internal LEDs, photodetectors, and an 18-bit ADC, operating from 1.7V to 5.0V supplies with ultra-low power consumption and I2C communication.

Operating Conditions:

  • Supply voltage: VDD: 1.7–2.0 V, VLED+: 3.1–5.0 V
  • Operating temperature: -40 to +85 °C
  • ADC Resolution: 18 bits
  • I2C Serial Clock Frequency: 0–400 kHz

Absolute Maximum Ratings:

  • Max supply voltage: VDD: +2.2V, VLED+: +6.0V
  • Max continuous current: ±20mA (into any terminal)
  • Max junction/storage temperature: +90°C (Junction), +105°C (Storage)

Key Specs:

  • VDD Power-Supply Voltage: 1.7–2.0 V
  • VLED+ LED Supply Voltage: 3.1–5.0 V
  • Supply Current (SpO2 and HR mode): 600 μA (typ) to 1200 μA (max) at 50sps
  • Supply Current in Shutdown: 0.7 μA (typ)
  • ADC Resolution: 18 bits
  • IR LED Peak Wavelength: 870–900 nm (typ 880 nm) at ILED = 20mA
  • Red LED Peak Wavelength: 650–670 nm (typ 660 nm) at ILED = 20mA
  • Temperature Sensor Accuracy: ±1 °C (typ)
  • I2C Serial Clock Frequency: 0–400 kHz

Features:

  • Heart-Rate Monitor and Pulse Oximeter Sensor in LED Reflective Solution
  • Tiny 5.6mm x 3.3mm x 1.55mm 14-Pin Optical Module
  • Integrated Cover Glass for Optimal, Robust Performance
  • Ultra-Low Power Operation for Mobile Devices
  • Programmable Sample Rate and LED Current for Power Savings
  • Low-Power Heart-Rate Monitor (< 1mW)
  • Ultra-Low Shutdown Current (0.7μA, typ)
  • Fast Data Output Capability
  • High Sample Rates
  • Robust Motion Artifact Resilience
  • High SNR
  • -40°C to +85°C Operating Temperature Range

Applications:

  • Wearable Devices
  • Fitness Assistant Devices
  • Smartphones
  • Tablets

Package:

  • 14 OESIP (5.6mm x 3.3mm x 1.55mm)

Features

  • Heart-Rate Monitor and Pulse Oximeter Sensor in LED Reflective Solution
  • Tiny 5.6mm x 3.3mm x 1.55mm 14-Pin Optical Module · Integrated Cover Glass for Optimal, Robust Performance
  • Ultra-Low Power Operation for Mobile Devices
  • Programmable Sample Rate and LED Current for Power Savings
  • Low-Power Heart-Rate Monitor (< 1mW)
  • Ultra-Low Shutdown Current (0.7μA, typ)
  • Fast Data Output Capability
  • High Sample Rates
  • Robust Motion Artifact Resilience
  • High SNR
  • -40°C to +85°C Operating Temperature Range

Ordering Information appears at end of data sheet.

Applications

  • Wearable Devices
  • Fitness Assistant Devices
  • Smartphones
  • Tablets

Pin Configuration

Electrical Characteristics

(V DD = 1.8V, V LED+ = 5.0V, T A = -40°C to +85°C, unless otherwise noted. Typical values are at T A = +25°C) (Note 1)

PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
POWER SUPPLYPOWER SUPPLYPOWER SUPPLYPOWER SUPPLYPOWER SUPPLYPOWER SUPPLYPOWER SUPPLY
Power-Supply VoltageV DDGuaranteed by RED and IR count tolerance1.71.82.0V
LED Supply Voltage V LED+ to PGNDV LED+Guaranteed by PSRR of LED driver3.13.35.0V
Supply CurrentI DDSpO 2 and HR mode, PW = 215μs, 50sps6001200μA
Supply CurrentI DDIR only mode, PW = 215μS, 50sps60012001200μA
Supply Current in ShutdownI SHDNT A = +25°C, MODE = 0x800.710μA

Absolute Maximum Ratings

  • GND to PGND......................................................-0.3V to +0.3V
  • V LED+ to PGND....................................................-0.3V to +6.0V
  • All Other Pins to GND..........................................-0.3V to +6.0V
  • Output Short-Circuit Current Duration.......................Continuous
  • Continuous Input Current into Any Terminal ....................±20mA
  • ESD, Human Body Model (HBM).......................................2.5kV
  • Latchup Immunity...........................................................±250mA

Typical Application

Package Information

PACKAGE TYPE: 14 OESIPPACKAGE TYPE: 14 OESIP
Package CodeF143A5MK+1
Outline Number21-1048
Land Pattern Number90-0602
THERMAL RESISTANCE, FOUR-LAYER BOARDTHERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θ JA )180°C/W
Junction to Case (θ JC )150°C/W

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial .

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages . Note that a '+', '#', or '-' in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
MAX30102Analog Devices
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