M24C02-DRMF3TG/K

Part: M24C02-A125, STMicroelectronics

Type: Automotive Serial I²C Bus EEPROM

Description: A 2-Kbit (256 bytes) automotive-grade serial EEPROM operating up to 125 °C with a 1 MHz I²C compatible interface and 1.7 V to 5.5 V supply voltage.

Operating Conditions:

• Supply voltage: 1.7 V to 5.5 V
• Operating temperature: -40 °C to 125 °C
• Max I²C clock frequency: 1 MHz

Absolute Maximum Ratings:

• Max supply voltage: null
• Max continuous current: null
• Max junction/storage temperature: null

Key Specs:

• Memory array size: 2 Kbits (256 bytes)
• Page size: 16 bytes
• Byte/Page write time: 4 ms
• Write cycle endurance (25 °C): 4 million cycles
• Write cycle endurance (125 °C): 600 k cycles
• Data retention (25 °C): 100 years
• Data retention (125 °C): 50 years
• ESD Protection (human body model): 4000 V

Features:

• AEC-Q100 qualified
• Compatible with all I2C bus modes (1 MHz, 400 kHz, 100 kHz)
• Additional write lockable page (identification page)
• Schmitt trigger inputs for noise filtering
• RoHS compliant and halogen-free (ECOPACK2)

Applications:

• null

Package:

• TSSOP8 (DW) 169 mil width
• SO8N (MN) 150 mil width
• WFDFPN8 (MF) DFN8 - 2 x 3 mm

• AEC-Q100 qualified
• Compatible with all I2C bus modes
  • 1 MHz
  • 400 kHz
  • 100 kHz
• Memory array
  • 2 Kbits (256 bytes) of EEPROM
  • Page size: 16 bytes
  • Additional write lockable page (identification page)
• Extended temperature and voltage ranges
  • -40 °C to 125 °C; 1.7 V to 5.5 V
• Schmitt trigger inputs for noise filtering
• Short write cycle time
  • Byte write within 4 ms
  • Page write within 4 ms
• Write cycle endurance
  • 4 million write cycles at 25 °C
  • 1.2 million write cycles at 85 °C
  • 600 k write cycles at 125 °C
• Data retention
  • 50 years at 125 °C
  • 100 years at 25 °C
• ESD Protection (human body model)
  • 4000 V
• Packages
  • RoHS compliant and halogen-free (ECOPACK2)

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.

DS10115 - Rev 7 page 26/39

DT_6P_A_TSSOP8_ME_V4

9.1 TSSOP8 package information

This TSSOP is an 8-lead, 3 x 6.4 mm, 0.65 mm pitch, thin shrink small outline package.

e

1 c L E D k 4 L1 E1 A2 b 8 5 A1 A1 A D E1 e Pin 1 identification C Seating plane

Figure 13. TSSOP8 – Outline

1. Drawing is not to scale.

aaa C

Table 13. TSSOP8 - Mechanical data

| Symbol | millimeters | | | inches (1) | | |---|---|---|---|---|---|---| | | Min. | Typ. | Max. | Min. | Typ. | Max. | | A | - | - | 1.200 | - | - | 0.0472 | | A1 | 0.050 | - | 0.150 | 0.0020 | - | 0.0059 | | A2 | 0.800 | 1.000 | 1.050 | 0.0315 | 0.0394 | 0.041

• 1. Values in inches are converted from mm and rounded to four decimal digits.
• 2. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side.
• 3. Dimension E1 does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per side.

DS10115 - Rev 7 page 27/39

Note: The package top may be smaller than the package bottom. Dimensions D and E1 are determinated at the outermost extremes of the plastic body exclusive of the mold flash, tie bar burrs, gate burrs, and interleads flash, but including any mismatch between the top and bottom of the plastic body. The measurement side for the mold flash, protrusions, or gate burrs is the bottom side.

Figure 14. TSSOP8 – Footprint example

1. Dimensions are expressed in millimeters.

DT_6P_TSSOP8_FP_V2

DS10115 - Rev 7 page 28/39

O7_SO8_ME_V2

9.2 SO8N package information

This SO8N is an 8-lead, 4.9 x 6 mm, plastic small outline, 150 mils body width, package.

Figure 15. SO8N - Outline

1. Drawing is not to scale.

Table 14. SO8N - Mechanical data

• 1. Values in inches are converted from mm and rounded to four decimal digits.
• 2. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side
• 3. Dimension E1 does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per side.

Note: The package top may be smaller than the package bottom. Dimensions D and E1 are determinated at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interleads flash, but including any mismatch between the top and bottom of the plastic body. The measurement side for mold flash, protusions, or gate burrs is the bottom side.

DS10115 - Rev 7 page 29/39

Figure 16. SO8N - Footprint example

O7_SO8N_FP_V2

1. Dimensions are expressed in millimeters.

DS10115 - Rev 7 page 30/39

9.3 WFDFPN8 (DFN8) package information

This WFDFPN is a 8-lead, 2 x 3 mm, 0.5 mm pitch very very thin fine pitch dual flat package.

Figure 17. WFDFPN8 (DFN8) – Outline

• 1. Drawing is not to scale.
• 2. Exposed copper is not systematic and can appear partially or totally according to the cross section.

DS10115 - Rev 7 page 31/39

Table 15. WFDFPN8 (DFN8) – Mechanical data

• 1. Values in inches are converted from mm and rounded to four decimal digits.
• 2. Dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip.
• 3. N is the number of terminals, ND is the number of terminals on "D" sides.
• 4. Max package warpage is 0.05 mm.
• 5. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from measuring.

Figure 18. WFDFPN8 (DFN8) – Footprint example

Note: The central pad (the area E2 by D2 in the Figure 17) must be either connected to VSS or left floating (not connected) in the end application.

DS10115 - Rev 7 page 32/39