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LPC1768FBD100

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ARM Cortex-M3 Microcontroller

The LPC1768FBD100 is a arm cortex-m3 microcontroller from NXP Semiconductors. constant. View the full LPC1768FBD100 datasheet below including key specifications.

Official LPC1768FBD100 datasheet (PDF) — the source this page was extracted from.

Manufacturer

NXP Semiconductors

Package

LQFP100, TFBGA100, WLCSP100

LPC1768FBD100 Key Specifications

ParameterValue
CPUARM Cortex-M3 with Memory Protection Unit (8 regions) and NVIC, up to 100 MHz
Memory512 kB flash (ISP/IAP), 64 kB SRAM (32 kB CPU-local plus two 16 kB blocks)
ADC12-bit, 8 channels, up to 200 kHz conversion rate
DAC10-bit with dedicated timer and DMA support
GPIOup to 70 pins (100-pin package)
Internal RC oscillator4 MHz, trimmed to 1% accuracy
RTCseparate battery supply, operates down to 2.1 V battery voltage, 20 bytes backup registers
DMA8-channel general purpose DMA controller

LPC1768FBD100 Overview

Part: LPC1768FBD100 — NXP Semiconductors

Type: ARM Cortex-M3 Microcontroller

Description: 32-bit ARM Cortex-M3 MCU running at up to 100 MHz with 512 kB flash and 64 kB SRAM, with Ethernet, USB Device/Host/OTG, 2 CAN channels and a 12-bit ADC, in a 100-pin LQFP package.

Operating Conditions:

  • Supply voltage: 2.4–3.6 V (single 3.3 V supply)
  • Operating temperature: -40 to 85 °C
  • Max CPU frequency: 100 MHz (LPC1768)
  • On-chip crystal oscillator range: 1–25 MHz

Key Specs:

  • CPU: ARM Cortex-M3 with Memory Protection Unit (8 regions) and NVIC, up to 100 MHz
  • Memory: 512 kB flash (ISP/IAP), 64 kB SRAM (32 kB CPU-local plus two 16 kB blocks)
  • ADC: 12-bit, 8 channels, up to 200 kHz conversion rate
  • DAC: 10-bit with dedicated timer and DMA support
  • GPIO: up to 70 pins (100-pin package)
  • Internal RC oscillator: 4 MHz, trimmed to 1% accuracy
  • RTC: separate battery supply, operates down to 2.1 V battery voltage, 20 bytes backup registers
  • DMA: 8-channel general purpose DMA controller

Features:

  • Ethernet MAC with RMII interface and dedicated DMA
  • USB 2.0 full-speed Device/Host/OTG with on-chip PHY
  • 4 UARTs (one with modem control and RS-485 support), 2 CAN channels, 2 SSP controllers, SPI, 3 I2C interfaces (one supporting Fast mode plus at 1 Mbit/s)
  • I2S interface (2 inputs plus 2 outputs)
  • Motor control PWM, quadrature encoder interface, 4 general purpose timers, 6-output PWM
  • Four reduced power modes: Sleep, Deep-sleep, Power-down, Deep power-down
  • Brownout detect and on-chip power-on reset
  • Main PLL plus a dedicated USB PLL
  • JTAG, Serial Wire Debug and Serial Wire Trace, with emulation trace module
  • Watchdog timer, repetitive interrupt timer, system tick timer

Applications:

  • eMetering
  • Lighting
  • Industrial networking
  • Alarm systems
  • White goods
  • Motor control

Package:

  • LQFP100 (14 × 14 × 1.4 mm, SOT407-1)

LPC1768FBD100 Features

Refer to Section 1.4.1 for details of features on specific part numbers.

  • ARM Cortex-M3 processor, running at frequencies of up to 120 MHz on high speed versions (LPC1769 and LPC1759), up to 100 MHz on other versions. A Memory Protection Unit (MPU) supporting eight regions is included.

  • ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).

  • Up to 512 kB on-chip flash program memory with In-System Programming (ISP) and In-Application Programming (IAP) capabilities. The combination of an enhanced flash memory accelerator and location of the flash memory on the CPU local code/data bus provides high code performance from flash.

  • Up to 64 kB on-chip SRAM includes:

  • -Up to 32 kB of SRAM on the CPU with local code/data bus for high-performance CPU access.

  • -Up to two 16 kB SRAM blocks with separate access paths for higher throughput. These SRAM blocks may be used for Ethernet, USB, and DMA memory, as well as for general purpose instruction and data storage.

  • Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer matrix that can be used with the SSP, I 2 S, UART, the Analog-to-Digital and Digital-to-Analog converter peripherals, timer match signals, GPIO, and for memory-to-memory transfers.

  • Multilayer AHB matrix interconnect provides a separate bus for each AHB master. AHB masters include the CPU, General Purpose DMA controller, Ethernet MAC, and the USB interface. This interconnect provides communication with no arbitration delays unless two masters attempt to access the same slave at the same time.

  • Split APB bus allows for higher throughput with fewer stalls between the CPU and DMA. A single level of write buffering allows the CPU to continue without waiting for completion of APB writes if the APB was not already busy.

  • Serial interfaces:

  • -Ethernet MAC with RMII interface and dedicated DMA controller.

  • -USB 2.0 full-speed controller that can be configured for either device, Host, or OTG operation with an on-chip PHY for device and Host functions and a dedicated DMA controller.

  • -Four UARTs with fractional baud rate generation, internal FIFO, IrDA, and DMA support. One UART has modem control I/O and RS-485/EIA-485 support.

  • -Two-channel CAN controller.

  • -Two SSP controllers with FIFO and multi-protocol capabilities. The SSP interfaces can be used with the GPDMA controller.

  • -SPI controller with synchronous, serial, full duplex communication and programmable data length. SPI is included as a legacy peripheral and can be used instead of SSP0.

  • -Three enhanced I 2 C-bus interfaces, one with an open-drain output supporting the full I 2 C specification and Fast mode plus with data rates of 1Mbit/s, two with standard port pins. Enhancements include multiple address recognition and monitor mode.

  • -I 2 S (Inter-IC Sound) interface for digital audio input or output, with fractional rate control. The I 2 S interface can be used with the GPDMA. The I 2 S interface supports 3-wire data transmit and receive or 4-wire combined transmit and receive connections, as well as master clock output.

LPC1768FBD100 Applications

  • eMetering
  • Lighting
  • Industrial networking
  • Alarm systems
  • White goods
  • Motor control

LPC1768FBD100 Pin Configuration

Table 6 shows pins that are associated with System Control block functions.

Table 6. Pin summary

Pin namePin directionPin description
EINT0InputExternal Interrupt Input 0 - An active low/high level or falling/rising edge general purpose interrupt input. This pin may be used to wake up the processor from Sleep, Deep-sleep, or Power-down modes.
EINT1InputExternal Interrupt Input 1 - See the EINT0 description above.
EINT2InputExternal Interrupt Input 2 - See the EINT0 description above.
EINT3InputExternal Interrupt Input 3 - See the EINT0 description above.
RESETInputExternal Reset input - A LOW on this pin resets the chip, causing I/O ports and peripherals to take on their default states, and the processor to begin execution at address 0x0000 0000.

Rev. 4. 1 - 19 December 2016

User manual

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
LPC1751FBD80NXP SemiconductorsLQFP-80
LPC1752FBD80NXP SemiconductorsLQFP-80
LPC1754FBD80NXP SemiconductorsLQFP-80
LPC1756FBD80NXP SemiconductorsLQFP-80
LPC1758FBD80NXP SemiconductorsLQFP-80
LPC1759FBD80NXP SemiconductorsLQFP-80
LPC1763FBD100NXP SemiconductorsLQFP-100
LPC1764FBD100NXP SemiconductorsLQFP-100
LPC1765FBD100NXP SemiconductorsLQFP-100
LPC1766FBD100NXP SemiconductorsLQFP-100
LPC1767FBD100NXP SemiconductorsLQFP-100
LPC1768NXP Semiconductors—
LPC1768/65NXP Semiconductors—
LPC1768FET100NXP SemiconductorsTFBGA100
LPC1768UKNXP SemiconductorsWLCSP100
LPC1769FBD100NXP SemiconductorsLQFP-100

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Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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