LMV324

Part: LMV321, LMV358, LMV324 — Texas Instruments

Type: Low-Voltage Rail-to-Rail Output Operational Amplifier

Description: Single, dual, and quad low-voltage (2.7 V to 5.5 V) operational amplifiers with rail-to-rail output swing, designed for cost-effective applications requiring low-voltage operation and space saving.

Operating Conditions:

• Supply voltage: 2.7–5.5 V
• Operating temperature: -40 to +125 °C

Absolute Maximum Ratings:

• Max supply voltage: 5.5 V
• Max junction/storage temperature: 150 °C

Key Specs:

• Input offset voltage (VCC+ = 2.7 V): 1.7 mV (typ), 7 mV (max)
• Supply current (LMV321, typical): 130 μA
• ESD protection (Human-Body Model): 2000 V
• ESD protection (Charged-Device Model): 1000 V

Features:

• 2.7-V and 5-V performance
• -40°C to +125°C operation
• No crossover distortion
• Low supply current
• Rail-to-rail output swing
• ESD protection exceeds JESD 22

Applications:

• Desktop PCs
• HVAC: heating, ventilating, and air conditioning
• Motor control: AC induction
• Net-books
• Portable media players
• Power: telecom DC/DC module: digital
• Professional audio mixers
• Refrigerators
• Washing machines: high-end and low-end

Package:

• LMV321: DBV (SOT-23, 5), DCK (SC-70, 5)
• LMV358: D (SOIC, 8), DDU (VSSOP, 8), DGK (VSSOP, 8), PW (TSSOP, 8)
• LMV324: D (SOIC, 14), PW (TSSOP, 14)

• For an upgraded version - refer to LMV321A, LMV358A, and LMV324A
• 2.7-V and 5-V performance
• -40°C to +125°C operation
• No crossover distortion
• Low supply current
• -LMV321: 130 μA (typical)
• -LMV358: 210 μA (typical)
• -LMV324: 410 μA (typical)
• Rail-to-rail output swing
• ESD protection exceeds JESD 22
• -2000-V human-body model
• -1000-V charged-device model

• Desktop PCs
• HVAC: heating, ventilating, and air conditioning
• Motor control: AC induction
• Net-books
• Portable media players
• Power: telecom DC/DC module: digital
• Professional audio mixers
• Refrigerators
• Washing machines: high-end and low-end

LMV358, LMV321, LMV324, LMV324S

SLOS263Y - AUGUST 1999 - REVISED AUGUST 2023

Figure 5-1. D, DDU, DGK, and PW Packages, 8-Pin SOIC, VSSOP, and TSSOP (Top View)

Table 5-1. Pin Functions: LMV358

• (1) I = input, O = output
• (1) I = input, O = output

Figure 5-2. DBV and DCK Packages, 5-Pin SOT-23 and SC-70 (Top View)

Table 5-2. Pin Functions: LMV321

1

• OUT

14

• 4OUT

2

• 1IN -

• 13 4IN -

3

• 1IN+

12

• 4IN+

• 4 VCC+

11

• GND

• 5

• 2IN+

10

• 3IN+

• 6

• 2IN -

• 9 3IN -

7

• 2OUT

8

• 3OUT

Not to scale

Figure 5-3. D and PW Packages, 14-Pin SOIC and TSSOP (Top View)

VCC+ = 2.7 V, TA = 25°C (unless otherwise noted)

VCC+ = 2.7 V, TA = 25°C (unless otherwise noted)

over operating free-air temperature range (unless otherwise noted) (1)

Some applications require differential signals. Figure 8-1 shows a simple circuit to convert a single-ended input of 0.5 to 2 V into differential output of ±1.5 V on a single 2.7-V supply. The output range is intentionally limited to maximize linearity. The circuit is composed of two amplifiers. One amplifier acts as a buffer and creates a voltage, VOUT+. The second amplifier inverts the input and adds a reference voltage to generate VOUT-. Both VOUT+ and VOUT- range from 0.5 to 2 V. The difference, VDIFF, is the difference between VOUT+ and VOUT-. The LMV358 was used to build this circuit.

Figure 8-1. Schematic for Single-Ended Input to Differential Output Conversion

Figure 8-1. Schematic for Single-Ended Input to Differential Output Conversion

SMALL OUTLINE PACKAGE

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.

SMALL OUTLINE PACKAGE

NOTES: (continued)

1. Publication IPC-7351 may have alternate designs.
2. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

PW0008A

1. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
2. Board assembly site may have different recommendations for stencil design.

SMALL OUTLINE PACKAGE