LMK04828BISQ/NOPB
LMK0482x Ultra Low-Noise JESD204B Compliant Clock Jitter Cleaner with Dual Loop PLLs
Overview
Part: LMK0482x
Type: Ultra Low-Noise JESD204B Compliant Clock Jitter Cleaner with Dual Loop PLLs
Key Specs:
- RMS Jitter (12 kHz to 20 MHz): 88 fs
- Noise Floor at 245.76 MHz: –162.5 dBc/Hz
- Normalized [1 Hz] PLL Noise Floor: -227 dBc/Hz
- Maximum Clock Output Frequency: 3.1 GHz
- RMS Jitter (100 Hz to 20 MHz): 91 fs
- Operation Voltage: 3.15-V to 3.45-V
- Industrial Temperature Range: –40 to 85°C
- Supported PCB Temperature (Measured at Thermal Pad): 105°C
Features:
- JEDEC JESD204B Support
- Up to 14 Differential Device Clocks from PLL2
- Up to 7 SYSREF Clocks
- LVPECL, LVDS, HSDS, LCPECL JESD204B support
- Programmable Outputs from PLL2
- Precision Digital Delay, Dynamically Adjustable
- 25 ps Step Analog Delay
- Multi-mode: Dual PLL, single PLL, and Clock Distribution
- Ultra-Low RMS Jitter
- Up to 1 Buffered VCXO/Crystal Output from PLL1
- Dual Loop PLLatinum™ PLL Architecture
- Up to 3 Redundant Input Clocks (PLL1)
- Automatic and Manual Switch-Over Modes (PLL1)
- Hitless Switching and LOS ability (PLL1)
- Integrated Low-Noise Crystal Oscillator Circuit (PLL1)
- Holdover mode when Input Clocks are Lost (PLL1)
Applications:
- Wireless Infrastructure
- Networking, SONET/SDH, DSLAM
- Test and Measurement
- Data Converter Clocking
- Medical / Video / Military / Aerospace
Package:
- 64-Pin QFN: 9.0 mm x 9.0 mm x 0.8 mm
Features
Tools & Software
-
Ultra-Low RMS Jitter Data Converter Clocking
-
91 fs RMS Jitter (100 Hz to 20 MHz) Medical / Video / Military / Aerospace
-
The LMK0482x family is the industry's highest – Maximum Clock Output Frequency 3.1 GHz performance clock conditioner with JEDEC
Programmable Outputs from PLL2 The 14 clock outputs from PLL2 can be configured to • Up to 1 Buffered VCXO/Crystal Output from PLL1 drive seven JESD204B converters or other logic – LVPECL, LVDS, 2xLVCMOS Programmable devices using device and SYSREF clocks. SYSREF can be provided using both DC and AC coupling. Not • Dual Loop PLLatinum™ PLL Architecture limited to JESD204B applications, each of the 14 • PLL1 outputs can be individually configured as high – Up to 3 Redundant Input Clocks performance outputs for traditional clocking systems.
– Automatic and Manual Switch-Over Modes The high performance combined with features like the – Hitless Switching and LOS ability to trade off between power or performance, dual VCOs, dynamic digital delay, holdover, and – Integrated Low-Noise Crystal Oscillator Circuit glitchless analog delay make the LMK0482x family – Holdover mode when Input Clocks are Lost ideal for providing flexible high performance clocking
Applications
Tools & Software
-
Ultra-Low RMS Jitter Data Converter Clocking
-
91 fs RMS Jitter (100 Hz to 20 MHz) Medical / Video / Military / Aerospace
-
The LMK0482x family is the industry's highest – Maximum Clock Output Frequency 3.1 GHz performance clock conditioner with JEDEC
Programmable Outputs from PLL2 The 14 clock outputs from PLL2 can be configured to • Up to 1 Buffered VCXO/Crystal Output from PLL1 drive seven JESD204B converters or other logic – LVPECL, LVDS, 2xLVCMOS Programmable devices using device and SYSREF clocks. SYSREF can be provided using both DC and AC coupling. Not • Dual Loop PLLatinum™ PLL Architecture limited to JESD204B applications, each of the 14 • PLL1 outputs can be individually configured as high – Up to 3 Redundant Input Clocks performance outputs for traditional clocking systems.
– Automatic and Manual Switch-Over Modes The high performance combined with features like the – Hitless Switching and LOS ability to trade off between power or performance, dual VCOs, dynamic digital delay, holdover, and – Integrated Low-Noise Crystal Oscillator Circuit glitchless analog delay make the LMK0482x family – Holdover mode when Input Clocks are Lost ideal for providing flexible high performance clocking
Pin Configuration
Pin Functions
- NO.
- 1, 2
- 3, 4
- 5
- 6
- 7, 8, 9
- 10
- 11
- 12
- 13, 14
- 15, 16
- 17
- 18
- 19
(1) See Pin Connection Recommendations for recommended connections.
Electrical Characteristics
(3.15 V < VCC < 3.45 V, –40 °C < TA < 85 °C and TPCB ≤ 105 °C. Typical values at VCC = 3.3 V, TA = 25 °C, at the Recommended Operating Conditions and are not assured.)
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| CURRENT CONSUMPTION | ||||||
| ICC_PD | Power Down Supply Current | 1 | 3 | mA | ||
| ICC_CLKS | Supply Current(1) | 14 HSDS 8 mA clocks enabled PLL1 and PLL2 locked. | 565 | 665 | mA | |
| CLKin0/0*, CLKin1/1*, and CLKin2/2* INPUT CLOCK SPECIFICATIONS |
(2) In order to meet the jitter performance listed in the subsequent sections of this data sheet, the minimum recommended slew rate for all input clocks is 0.5 V/ns. This is especially true for single-ended clocks. Phase noise performance will begin to degrade as the clock input slew rate is reduced. However, the device will function at slew rates down to the minimum listed. When compared to single-ended clocks, differential clocks (LVDS, LVPECL) will be less susceptible to degradation in phase noise performance at lower slew rates due to their common mode noise rejection. However, it is also recommended to use the highest possible slew rate for differential clocks to achieve optimal phase noise performance at the device outputs.
- (3) See Differential Voltage Measurement Terminology for definition of VID and VOD voltages.
- (4) Assured by characterization. ATE tested at 2949.12 MHz.
(3.15 V < VCC < 3.45 V, –40 °C < TA < 85 °C and TPCB ≤ 105 °C. Typical values at VCC = 3.3 V, TA = 25 °C, at the Recommended Operating Conditions and are not assured.)
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| VFBCLKin/Fin | Single Ended Clock Input Voltage | AC coupled CLKinX_TYPE = 0 (Bipolar) | 0.25 | 2.0 | Vpp | |
| SLEWFBCLKin/Fin | Slew Rate on CLKin (2) | AC coupled; 20% to 80%; (CLKinX_TYPE = 0) | 0.15 | 0.5 | V/ns | |
| PLL1 SPECIFICATIONS | ||||||
| fPD1 | PLL1 Phase Detector Frequency PLL1 Charge | VCPout1 = VCC/2, PLL1_CP_GAIN = 0 VCPout1 = VCC/2, PLL1_CP_GAIN = 1 VCPout1 = VCC/2, PLL1_CP_GAIN = 2 | 50 150 250 | 40 | MHz | |
| ICPout1SOURCE | Pump Source Current (5) PLL1 Charge | … VCPout1 = VCC/2, PLL1_CP_GAIN = 14 VCPout1 = VCC/2, PLL1_CP_GAIN = 15 VCPout1=VCC/2, PLL1_CP_GAIN = 0 VCPout1=VCC/2, PLL1_CP_GAIN = 1 VCPout1=VCC/2, PLL1_CP_GAIN = 2 | … 1450 1550 –50 –150 –250 | μA | ||
| ICPout1SINK | Pump Sink Current (5) | … VCPout1=VCC/2, PLL1_CP_GAIN = 14 VCPout1=VCC/2, PLL1_CP_GAIN = 15 | … –1450 –1550 | μA | ||
| ICPout1%MIS | Charge Pump Sink / Source Mismatch | VCPout1 = VCC/2, T = 25 °C | 1% | 10% | ||
| ICPout1VTUNE | Magnitude of Charge Pump Current Variation vs. Charge Pump Voltage | 0.5 V < VCPout1 < VCC - 0.5 V TA = 25 °C | 4% | |||
| ICPout1%TEMP | Charge Pump Current vs. Temperature Variation | 4% | ||||
| ICPout1 TRI | Charge Pump TRI-STATE Leakage Current PLL 1/f Noise at 10 kHz offset. | 0.5 V < VCPout < VCC - 0.5 V PLL1_CP_GAIN = 350 μA | –117 | 5 | nA | |
| PN10kHz | Normalized to 1 GHz Output Frequency | PLL1_CP_GAIN = 1550 μA | –118 | dBc/Hz | ||
| PN1Hz | Normalized Phase Noise Contribution | PLL1_CP_GAIN = 350 μA PLL1_CP_GAIN = 1550 μA | –221.5 –223 | dBc/Hz | ||
| PLL2 REFERENCE INPUT (OSCin) SPECIFICATIONS | ||||||
| fOSCin | PLL2 Reference Input (6) | 500 | MHz | |||
| SLEWOSCin | PLL2 Reference Clock minimum slew rate on OSCin (2) | 20% to 80% | 0.15 | 0.5 | V/ns | |
| VOSCin | Input Voltage for OSCin or OSCin* | AC coupled; Single-ended (Unused pin AC coupled to GND) | 0.2 | 2.4 | Vpp | |
| VIDOSCin | Differential voltage swing | 0.2 | 1.55 | V | ||
| V SSOSCin | Figure 8 | AC coupled | 0.4 | 3.1 | Vpp | |
| VOSCin-offset | DC offset voltage between OSCin/OSCin* (OSCinX* - OSCinX) | Each pin AC coupled | 20 | mV | ||
| fdoubler_max | Doubler input frequency (7) | (8); EN_PLL2_REF_2X = 1 OSCin Duty Cycle 40% to 60% | 155 | MHz |
(6) FOSCin maximum frequency assured by characterization. Production tested at 122.88 MHz.
(7) Assured by characterization. ATE tested at 122.88 MHz.
(8) The EN_PLL2_REF_2X bit enables/disables a frequency doubler mode for the PLL2 OSCin path.
(3.15 V < VCC < 3.45 V, –40 °C < TA < 85 °C and TPCB ≤ 105 °C. Typical values at VCC = 3.3 V, TA = 25 °C, at the Recommended Operating Conditions and are not assured.)
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| CRYSTAL OSCILLATOR MODE SPECIFICATIONS | ||||||
| FXTAL | Crystal Frequency Range | Fundamental mode crystal ESR = 200 Ω (10 to 30 MHz) ESR = 125 Ω (30 to 40 MHz) | 10 | 40 | MHz | |
| CIN | Input Capacitance of OSCin port PLL2 PHASE DETECTOR and CHARGE PUMP SPECIFICATIONS | –40 to 85 °C | 1 | pF | ||
| fPD2 | Phase Detector Frequency (7) | VCPout2=VCC/2, PLL2_CP_GAIN = 0 | 100 | 155 | MHz | |
| PLL2 Charge Pump Source Current | VCPout2=VCC/2, PLL2_CP_GAIN = 1 | 400 | μA | |||
| ICPoutSOURCE | (5) PLL2 Charge Pump Sink Current (5) | VCPout2=VCC/2, PLL2_CP_GAIN = 2 VCPout2=VCC/2, PLL2_CP_GAIN = 3 VCPout2=VCC/2, PLL2_CP_GAIN = 0 VCPout2=VCC/2, PLL2_CP_GAIN = 1 | 1600 3200 –100 –400 | |||
| ICPoutSINK | VCPout2=VCC/2, PLL2_CP_GAIN = 2 VCPout2=VCC/2, PLL2_CP_GAIN = 3 | –1600 –3200 | μA | |||
| ICPout2%MIS | Charge Pump Sink/Source Mismatch | VCPout2=VCC/2, TA = 25 °C | 1% | 10% | ||
| ICPout2VTUNE | Magnitude of Charge Pump Current vs. Charge Pump Voltage Variation | 0.5 V < VCPout2 < VCC - 0.5 V TA = 25 °C | 4% | |||
| ICPout2%TEMP | Charge Pump Current vs. Temperature Variation | 4% | ||||
| ICPout2TRI | Charge Pump Leakage | 0.5 V < VCPout2 < VCC - 0.5 V | 10 | nA | ||
| PN10kHz | PLL 1/f Noise at 10 kHz offset (9) Normalized to 1 GHz Output Frequency | PLL2_CP_GAIN = 400 μA PLL2_CP_GAIN = 3200 μA | –118 –121 | dBc/Hz | ||
| PN1Hz | Normalized Phase Noise Contribution (10) | PLL2_CP_GAIN = 400 μA PLL2_CP_GAIN = 3200 μA | –222.5 –227 | dBc/Hz |
(10) A specification modeling PLL in-band phase noise. The normalized phase noise contribution of the PLL, LPLL_flat(f), is defined as: PN1HZ=LPLL_flat(f) - 20log(N) - 10log(fPDX). LPLL_flat(f) is the single side band phase noise measured at an offset frequency, f, in a 1 Hz bandwidth and fPDX is the phase detector frequency of the synthesizer. LPLL_flat(f) contributes to the total noise, L(f).
(3.15 V < VCC < 3.45 V, –40 °C < TA < 85 °C and TPCB ≤ 105 °C. Typical values at VCC = 3.3 V, TA = 25 °C, at the Recommended Operating Conditions and are not assured.)
| PARAMETER | TEST CONDITIONS | MIN TYP | MAX | UNIT | |
|---|---|---|---|---|---|
| INTERNAL VCO SPECIFICATIONS | |||||
| fVCO | LMK04821 VCO Tuning Range | VCO0 | 1930 | 2075 | MHz |
| VCO1(11) | 2920 | 3080 | MHz | ||
| VCO0 | 1840 | 1970 | MHz | ||
| LMK04826 VCO Tuning Range | VCO1 | 2440 | 2505 | MHz | |
| LMK04828 VCO Tuning Range | VCO0 | 2370 | 2630 | MHz | |
| VCO1 | 2920 | 3080 | MHz | ||
| LMK04821 Fine Tuning Sensitivity | LMK04821 VCO0 | 12 to 20 | MHz/V | ||
| LMK04821 VCO1 | 15 to 24 | MHz/V | |||
| LMK04826 Fine Tuning Sensitivity | LMK04826 VCO0 | 11 to 19 | MHz/V | ||
| KVCO | LMK04826 VCO1 | 8 to 11 | MHz/V | ||
| LMK04828 Fine Tuning Sensitivity | LMK04828 VCO0 at 2457.6 MHz | 17 to 27 | MHz/V | ||
| LMK04828 VCO1 at 2949.12 MHz | 17 to 23 | MHz/V | |||
| ΔTCL | Allowable Temperature Drift for Continuous Lock (12) | After programming for lock, no changes to output configuration are permitted to assure continuous lock | 125 | °C |
(12) Maximum Allowable Temperature Drift for Continuous Lock is how far the temperature can drift in either direction from the value it was at the time that the 0x168 register was last programmed with PLL2_FCAL_DIS = 0, and still have the part stay in lock. The action of programming the 0x168 register, even to the same value, activates a frequency calibration routine. This implies the part will work over the entire frequency range, but if the temperature drifts more than the maximum allowable drift for continuous lock, then it will be necessary to reload the appropriate register to ensure it stays in lock. Regardless of what temperature the part was initially programmed at, the temperature can never drift outside the frequency range of –40 °C to 85 °C without violating specifications.
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| VCC | Supply voltage (2) | –0.3 | 3.6 | V |
| VIN | Input voltage | –0.3 | (VCC + 0.3) | V |
| TL | Lead temperature (solder 4 seconds) | 260 | °C | |
| TJ | Junction temperature | 150 | °C | |
| IIN | Differential input current (CLKinX/X*, OSCin/OSCin*, FBCLKin/FBCLKin*, Fin/Fin*) | ± 5 | mA | |
| MSL | Moisture sensitivity level | 3 | ||
| Tstg | Storage temperature | –65 | 150 | °C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Never to exceed 3.6 V.
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN | TYP | MAX | UNIT | ||
|---|---|---|---|---|---|
| TJ | Junction Temperature | 125 | °C | ||
| TA | Ambient Temperature | -40 | 25 | 85 | °C |
| TPCB | PCB Temperature (measured at thermal pad) | 105 | °C | ||
| VCC | Supply Voltage | 3.15 | 3.3 | 3.45 | V |
Thermal Information
| THERMAL METRIC(1) | LMK0482x | UNIT | |
|---|---|---|---|
| NKD (WQFN) | |||
| 64 PINS | |||
| RθJA | Junction-to-ambient thermal resistance(2) | 24.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance(3) | 6.1 | °C/W |
| RθJB | Junction-to-board thermal resistance(4) | 3.5 | °C/W |
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as specified in JESD51-7, in an environment described in JESD51-2a.
Copyright © 2013–2015, Texas Instruments Incorporated Submit Documentation Feedback 9
(3) The junction-to-case(top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8.
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| LMK04828 | — | — |
| LMK04828-EP | — | — |
| LMK04828B | — | — |
| LMK04828B/26B | — | — |
| LMK04828BISQ | — | — |
| LMK04828BISQE/NOPB | — | — |
| LMK04828BISQX | — | — |
| LMK04828BISQX/NOPB | — | — |
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