Skip to main content

LAN9252/ML

LAN9252

The LAN9252/ML is an electronic component from Microchip Technology. LAN9252. View the full LAN9252/ML datasheet below including electrical characteristics, absolute maximum ratings.

Manufacturer

Microchip Technology

Overview

Part: LAN9252 Microchip

Type: 2/3-Port EtherCAT Slave Controller with Integrated Ethernet PHYs

Key Specs:

  • 2/3-port EtherCAT slave controller
  • 3 Fieldbus Memory Management Units (FMMUs)
  • 4 SyncManagers
  • 1.8V to 3.3V variable voltage I/O
  • Integrated 1.2V regulator
  • Integrated high-performance 100Mbps Ethernet transceivers
  • 4K bytes of DPRAM
  • 8/16-Bit Host Bus Interface
  • 25MHz crystal support

Features:

  • Integrated Ethernet PHYs with HP Auto-MDIX
  • Wake on LAN (WoL) support
  • Low power mode
  • Cable diagnostic support
  • Compliant with IEEE 802.3/802.3u (Fast Ethernet)
  • 100BASE-FX support via external fiber transceiver
  • Loop-back modes
  • Automatic polarity detection and correction
  • Distributed clock support
  • Indexed register or multiplexed bus host interface
  • SPI / Quad SPI support
  • Digital I/O Mode
  • 3rd port for flexible network configurations
  • Comprehensive power management features (3 power-down levels, Wake on link status change, Magic packet wakeup, wake on broadcast, wake on perfect DA, Wakeup indicator event signal)
  • Integrated power-on reset circuit
  • Latch-up performance exceeds 150mA per EIA/JESD78, Class II
  • JEDEC Class 3A ESD performance
  • Single 3.3V power supply
  • Multifunction GPIOs

Applications:

  • Motor Motion Control
  • Process/Factory Automation
  • Communication Modules, Interface Cards
  • Sensors
  • Hydraulic & Pneumatic Valve Systems
  • Operator Interfaces

Package:

  • 64-pin QFN
  • 64-pin TQFP-EP

Features

Offset:0008h-0009hSize:16 bits
BitsDescriptionECAT
Type
PDI
Type
---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
15:12RESERVEDRORO
11Fixed FMMU/SyncManager Configuration
0: Variable configuration
1: Fixed configuration
RORO
10EtherCAT Read/Write Command Support
0: Supported
1: Not supported
RORO
9EtherCAT LRW Command Support
0: Supported
1: Not supported
RORO
8Enhanced DC SYNC Activation
0: Not available
1: Available
Note:
This feature refers to the Activation Register and Acti
vation Status Register
RORO
7Separate Handling of FCS Errors
0: Not supported
1: Supported, frame with wrong FCS and additional nibble will be
counted separately in Forwarded RX Counter
RORO
6Enhanced Link Detection MII
0: Not available
1: Available
RORO
5Enhanced Link Detection EBUS
0: Not available
1: Available
RORO
4Low Jitter EBUS
0: Not available, standard jitter
1: Available, jitter minimized
RORO
3Distributed Clocks (width)
0: 32-bit
1: 64-bit
RORO
2Distributed Clock
0: Not available
1: Available
RORO
1RESERVEDRORO
0FMMU Operation
0: Bit oriented
1: Byte oriented
RORO

Note: For EtherCAT Core CSR registers longer than one byte, the LSB has the lowest address and the MSB the highest address.

Applications

  • Motor Motion Control
  • Process/Factory Automation
  • Communication Modules, Interface Cards
  • Sensors
  • Hydraulic & Pneumatic Valve Systems
  • Operator Interfaces

Pin Configuration

Note: When a "#" is used at the end of the signal name, it indicates that the signal is active low. For example, RST# indicates that the reset signal is active low.

The buffer type for each signal is indicated in the "Buffer Type" column of the pin description tables in Section 3.3, "Pin Descriptions". A description of the buffer types is provided in Section 1.2, "Buffer Types".

Table 3-1 details the 64-QFN package pin assignments in table format. As shown, select pin functions may change based on the device's mode of operation. For modes where a specific pin has no function, the table cell will be marked with "-".

Pin
Number
HBI Indexed
Mode Pin Name
HBI Multiplexed
Mode Pin Name
Digital I/O
Mode Pin Name
SPI with GPIO
Mode Pin Name
SPI with MII
Mode Pin Name
1OSCI
2OSCO
3OSCVDD12
4OSCVSS
5VDD33
6VDDCR
7REG_EN
8FXLOSEN
9FXSDA/FXLOSA/FXSDENA
10FXSDB/FXLOSB/FXSDENB
11RST#
12D2AD2SOFSIO2
13D1AD1EOFSO/SIO1
14VDDIO
15D14AD14DIGIO8GPI8/GPO8MII_TXD3/
TX_SHIFT1
16D13AD13DIGIO7GPI7/GPO7MII_TXD2/
TX_SHIFT0
17D0AD0WD_STATESI/SIO0
18SYNC1/LATCH1
19D9AD9LATCH_INSCK
20VDDIO
21D12AD12DIGIO6GPI6/GPO6MII_TXD1
22D11AD11DIGIO5GPI5/GPO5MII_TXD0
23D10AD10DIGIO4GPI4/GPO4MII_TXEN
24VDDCR
25A1ALELOOE_EXT-MII_CLK25
26A3-DIGIO11GPI11/GPO11MII_RXDV
27A4-DIGIO12GPI12/GPO12MII_RXD0
28CSDIGIO13GPI13/GPO13MII_RXD1
29A2ALEHIDIGIO10GPI10/GPO10LINKACTLED2/
MII_LINKPOL
30WR/ENBDIGIO14GPI14/GPO14MII_RXD2
Pin
Number
HBI Indexed
Mode Pin Name
HBI Multiplexed
Mode Pin Name
Digital I/O
Mode Pin Name
SPI with GPIO
Mode Pin Name
SPI with MII
Mode Pin Name
31RD/RD_WRDIGIO15GPI15/GPO15MII_RXD3
32VDDIO
33A0/D15AD15DIGIO9GPI9/GPO9MII_RXER
34SYNC0/LATCH0
35D3AD3WD_TRIGSIO3
36D6AD6DIGIO0GPI0/GPO0MII_RXCLK
37VDDIO
38VDDCR
39D7AD7DIGIO1GPI1/GPO1MII_MDC
40D8AD8DIGIO2GPI2/GPO2MII_MDIO
41TESTMODE
42EESDA/TMS
43EESCL/TCK
44IRQ
45RUNLED/E2PSIZE
46LINKACTLED1/TDI/CHIP_MODE1
47VDDIO
48LINKACTLED0/TDO/CHIP_MODE0
49D4AD4DIGIO3GPI3/GPO3MII_LINK
50D5AD5OUTVALIDSCS#
51VDD33TXRX1
52TXNA
53TXPA
54RXNA
55RXPA
56VDD12TX1
57RBIAS
58VDD33BIAS
59VDD12TX2
60RXPB
61RXNB
62TXPB
63TXNB
64VDD33TXRX2
Exposed
Pad
VSS
TABLE 3-1:64-QFN PACKAGE PIN ASSIGNMENTS (CONTINUED)

Electrical Characteristics

ParameterSymbol
Min
Typ
Max
UnitsNotes
ILVPECL Input Buffer
Low Input LevelVIL-VDD33TXRXxVDD33TXRXx+0.3-1.48VNote 21
High Input LevelVIH-VDD33TXRXx-1.140.3VNote 21
OLVPECL Output Buffer
Low Output LevelVOLVDD33TXRXx-1.62V
High Output LevelVOHVDD33TXRXx-1.025V
Peak-to-Peak Differential
(SFF mode)
VDIFF-SFF1.21.62.0V
Peak-to-Peak Differential
(SFP mode)
VDIFF-SFP0.60.81.0V
Common Mode VoltageVCM1.0VDD33TXRXx-1.3V
Offset VoltageVOFFSET40mVNote 22
Load CapacitanceCLOAD10pF

Absolute Maximum Ratings

  • Supply Voltage (VDD33TXRX1, VDD33TXRX2, VDD33BIAS, VDD33, VDDIO) (Note 1) 0 V to +3.6 V

  • Ethernet Magnetics Supply Voltage -0.5 V to +3.6 V

  • Positive voltage on input signal pins, with respect to ground (Note 2) VDDIO + 2.0 V

  • Negative voltage on input signal pins, with respect to ground (Note 3) -0.5 V

  • Positive voltage on OSCI, with respect to ground.+3.6 V

  • Storage Temperature-55°C to +150°C

  • Junction Temperature+150°C

  • Lead Temperature Range Refer to JEDEC Spec. J-STD-020

  • HBM ESD Performance JEDEC Class 3A

  • Note 1: When powering this device from laboratory or system power supplies, it is important that the absolute maximum ratings not be exceeded or device failure can result. Some power supplies exhibit voltage spikes on their outputs when AC power is switched on or off. In addition, voltage transients on the AC power line may appear on the DC output. If this possibility exists, it is suggested to use a clamp circuit.

  • Note 2: This rating does not apply to the following pins: OSCI, RBIAS

  • Note 3: This rating does not apply to the following pins: RBIAS

*Stresses exceeding those listed in this section could cause permanent damage to the device. This is a stress rating only. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at any condition exceeding those indicated in Section 18.2, "Operating Conditions\\", Section 18.5, "DC Specifications", or any other applicable section of this specification is not implied. Note, device signals are NOT 5 volt tolerant.

Thermal Information

ParameterSymbolValueUnitsComments
Thermal Resistance Junction to AmbientJA23.6°C/WMeasured in still air
Thermal Resistance Junction to Bottom of CaseJT0.1°C/WMeasured in still air
Thermal Resistance Junction to Top of CaseJC1.8°C/WAirflow 1 m/s

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
LAN9252Microchip Technology64-pin QFN
LAN9252TI/PTMicrochip Technology
Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

Get structured datasheet data via API

Get started free