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LAN9252/ML

The LAN9252/ML is an electronic component from Microchip Technology. View the full LAN9252/ML datasheet below including absolute maximum ratings.

Manufacturer

Microchip Technology

Package

QFN-44

Overview

Part: LAN9252 — Microchip Type: 2/3-Port EtherCAT Slave Controller with Integrated Ethernet PHYs Description: A 2/3-port EtherCAT slave controller with dual integrated 100Mbps Ethernet PHYs, supporting 3 FMMUs, 4 SyncManagers, 4K bytes of DPRAM, and an 8/16-bit host bus interface.

Operating Conditions:

  • Supply voltage: 3.3V (single supply)
  • Operating temperature: Commercial, Industrial, and Extended Industrial ranges
  • Host I/O voltage: 1.8V to 3.3V variable

Absolute Maximum Ratings:

Key Specs:

  • Ethernet speed: 100Mbps (100BASE-TX)
  • EtherCAT FMMUs: 3
  • EtherCAT SyncManagers: 4
  • DPRAM size: 4K bytes
  • Host bus interface: 8/16-bit (Indexed register or multiplexed bus)
  • SPI/Quad SPI clock rate: Up to 80 MHz
  • Integrated regulator output: 1.2V
  • Crystal frequency: 25MHz

Features:

  • Integrated high-performance 100Mbps Ethernet transceivers
  • Compliant with IEEE 802.3/802.3u (Fast Ethernet)
  • HP Auto-MDIX
  • Distributed clock support
  • SPI / Quad SPI support
  • Digital I/O Mode for 16 digital signals
  • Comprehensive power management features (3 power-down levels, Wake on LAN)
  • Integrated power-on reset circuit
  • Multifunction GPIOs
  • 1.8V to 3.3V variable voltage I/O

Applications:

  • Motor Motion Control
  • Process/Factory Automation
  • Communication Modules, Interface Cards
  • Sensors
  • Hydraulic & Pneumatic Valve Systems
  • Operator Interfaces

Package:

  • 64-pin QFN
  • 64-pin TQFPEP

Features

Offset:

0008h-0009h

Size:

16 bits

BitsDescriptionECAT TypePDI TypeDefault
15:12RESERVEDRORO0h
11Fixed FMMU/SyncManager Configuration 0: Variable configuration 1: Fixed configurationRORO0b
10EtherCAT Read/Write Command Support 0: Supported 1: Not supportedRORO0b
9EtherCAT LRW Command Support 0: Supported 1: Not supportedRORO0b
8Enhanced DC SYNC Activation 0: Not available 1: Available Note: This feature refers to the Activation Register and Acti- vation Status RegisterRORO1b
7Separate Handling of FCS Errors 0: Not supported 1: Supported, frame with wrong FCS and additional nibble will be counted separately in Forwarded RX CounterRORO1b
6Enhanced Link Detection MII 0: Not available 1: AvailableRORO1b
5Enhanced Link Detection EBUS 0: Not available 1: AvailableRORO0b
4Low Jitter EBUS 0: Not available, standard jitter 1: Available, jitter minimizedRORO0b
3Distributed Clocks (width) 0: 32-bit 1: 64-bitRORO1b
2Distributed Clock 0: Not available 1: AvailableRORO1b
1RESERVEDRORO0b
0FMMU Operation 0: Bit oriented 1: Byte orientedRORO0b

Note: For EtherCAT Core CSR registers longer than one byte, the LSB has the lowest address and the MSB the highest address.

Applications

  • Motor Motion Control
  • Process/Factory Automation
  • Communication Modules, Interface Cards
  • Sensors
  • Hydraulic & Pneumatic Valve Systems
  • Operator Interfaces

Pin Configuration

Note: When a ' # ' is used at the end of the signal name, it indicates that the signal is active low. For example, RST# indicates that the reset signal is active low.

The buffer type for each signal is indicated in the 'Buffer Type' column of the pin description tables in Section 3.3, "Pin Descriptions". A description of the buffer types is provided in Section 1.2, "Buffer Types".

Table 3-1 details the 64-QFN package pin assignments in table format. As shown, select pin functions may change based on the device's mode of operation. For modes where a specific pin has no function, the table cell will be marked with '-'.

TABLE 3-1: 64-QFN PACKAGE PIN ASSIGNMENTS

Pin NumberHBI Indexed Mode Pin NameHBI Multiplexed Mode Pin NameDigital I/O Mode Pin NameSPI with GPIO Mode Pin NameSPI with MII Mode Pin Name
1OSCIOSCIOSCIOSCIOSCI
2OSCOOSCOOSCOOSCOOSCO
3OSCVDD12OSCVDD12OSCVDD12OSCVDD12OSCVDD12
4OSCVSSOSCVSSOSCVSSOSCVSSOSCVSS
5VDD33VDD33VDD33VDD33VDD33
6VDDCRVDDCRVDDCRVDDCRVDDCR
7REG_ENREG_ENREG_ENREG_ENREG_EN
8FXLOSENFXLOSENFXLOSENFXLOSENFXLOSEN
9FXSDA/FXLOSA/FXSDENAFXSDA/FXLOSA/FXSDENAFXSDA/FXLOSA/FXSDENAFXSDA/FXLOSA/FXSDENAFXSDA/FXLOSA/FXSDENA
10FXSDB/FXLOSB/FXSDENBFXSDB/FXLOSB/FXSDENBFXSDB/FXLOSB/FXSDENBFXSDB/FXLOSB/FXSDENBFXSDB/FXLOSB/FXSDENB
11RST#RST#RST#RST#RST#
12D2AD2SOFSIO2SIO2
13D1AD1EOFSO/SIO1SO/SIO1
14VDDIOVDDIOVDDIOVDDIOVDDIO
15D14AD14DIGIO8GPI8/GPO8MII_TXD3/ TX_SHIFT1
16D13AD13DIGIO7GPI7/GPO7MII_TXD2/ TX_SHIFT0
17D0AD0WD_STATESI/SIO0SI/SIO0
18SYNC1/LATCH1SYNC1/LATCH1SYNC1/LATCH1SYNC1/LATCH1SYNC1/LATCH1
19D9AD9LATCH_INSCKSCK
20VDDIOVDDIOVDDIOVDDIOVDDIO
21D12AD12DIGIO6GPI6/GPO6MII_TXD1
22D11AD11DIGIO5GPI5/GPO5MII_TXD0
23D10AD10DIGIO4GPI4/GPO4MII_TXEN
24VDDCRVDDCRVDDCRVDDCRVDDCR
25A1ALELOOE_EXT-MII_CLK25
26A3-DIGIO11GPI11/GPO11MII_RXDV
27A4-DIGIO12GPI12/GPO12MII_RXD0
28CSCSDIGIO13GPI13/GPO13MII_RXD1
29A2ALEHIDIGIO10GPI10/GPO10LINKACTLED2/ MII_LINKPOL
30WR/ENBWR/ENBDIGIO14GPI14/GPO14MII_RXD2

TABLE 3-1: 64-QFN PACKAGE PIN ASSIGNMENTS (CONTINUED)

Pin NumberHBI Indexed Mode Pin NameHBI Multiplexed Mode Pin NameDigital I/O Mode Pin NameSPI with GPIO Mode Pin NameSPI with MII Mode Pin Name
31RD/RD_WRRD/RD_WRDIGIO15GPI15/GPO15MII_RXD3
32VDDIO
33A0/D15AD15DIGIO9GPI9/GPO9MII_RXER
34SYNC0/LATCH0
35D3AD3WD_TRIGSIO3SIO3
36D6AD6DIGIO0GPI0/GPO0MII_RXCLK
37VDDIO
38VDDCR
39D7AD7DIGIO1GPI1/GPO1MII_MDC
40D8AD8DIGIO2GPI2/GPO2MII_MDIO
41TESTMODE
42EESDA/TMS
43EESCL/TCK
44IRQ
45RUNLED/E2PSIZE
46LINKACTLED1/TDI/CHIP_MODE1LINKACTLED1/TDI/CHIP_MODE1LINKACTLED1/TDI/CHIP_MODE1LINKACTLED1/TDI/CHIP_MODE1LINKACTLED1/TDI/CHIP_MODE1
47VDDIOVDDIOVDDIOVDDIOVDDIO
48LINKACTLED0/TDO/CHIP_MODE0LINKACTLED0/TDO/CHIP_MODE0LINKACTLED0/TDO/CHIP_MODE0LINKACTLED0/TDO/CHIP_MODE0LINKACTLED0/TDO/CHIP_MODE0
49D4AD4DIGIO3GPI3/GPO3MII_LINK
50D5AD5OUTVALIDSCS#SCS#
51VDD33TXRX1
52TXNA
53TXPA
54RXNA
55RXPA
56VDD12TX1
57RBIAS
58VDD33BIAS
59VDD12TX2
60RXPB
61RXNB
62TXPB
63TXNB
64VDD33TXRX2
Exposed PadVSS

Absolute Maximum Ratings

Supply Voltage (VDD12TX1, VDD12TX2, OSCVDD12, VDDCR) (Note 1) . . . . . . . . . .. . . . . . . . . . . . . . 0 V to +1.5 V
Supply Voltage (VDD33TXRX1, VDD33TXRX2, VDD33BIAS, VDD33, VDDIO) (Note 1) . .. . . . . . . . . . . 0 V to +3.6 V
Ethernet Magnetics Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . -0.5 V to +3.6 V
Positive voltage on input signal pins, with respect to ground (Note 2) . . . . . . . . . . . . . .. . . . . . . . . . . . VDDIO + 2.0 V
Negative voltage on input signal pins, with respect to ground (Note 3) . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . -0.5 V
Positive voltage on OSCI, with respect to ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . .+3.6 V
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . .-55 o C to +150 o C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . .+150 o C
Lead Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to JEDEC Spec. J-STD-020
HBM ESD Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . JEDEC Class 3A

Note 1: When powering this device from laboratory or system power supplies, it is important that the absolute maximum ratings not be exceeded or device failure can result. Some power supplies exhibit voltage spikes on their outputs when AC power is switched on or off. In addition, voltage transients on the AC power line may appear on the DC output. If this possibility exists, it is suggested to use a clamp circuit.

Note 2: This rating does not apply to the following pins: OSCI, RBIAS

Note 3: This rating does not apply to the following pins: RBIAS

Stresses exceeding those listed in this section could cause permanent damage to the device. This is a stress rating only. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at any condition exceeding those indicated in Section 18.2, "Operating Conditions*", Section 18.5, "DC Specifications", or any other applicable section of this specification is not implied. Note, device signals are NOT 5 volt tolerant.

Thermal Information

TABLE 18-1: 64-PIN QFN PACKAGE THERMAL PARAMETERS

ParameterSymbolValueUnitsComments
Thermal Resistance Junction to AmbientJA23.6°C/WMeasured in still air
Thermal Resistance Junction to Bottom of CaseJT0.1°C/WMeasured in still air
Thermal Resistance Junction to Top of CaseJC1.8°C/WAirflow 1 m/s

TABLE 18-2: 64-PIN TQFP-EP PACKAGE THERMAL PARAMETERS

ParameterSymbolValueUnitsComments
Thermal Resistance Junction to AmbientJA29°C/WMeasured in still air
Thermal Resistance Junction to Bottom of CaseJT0.3°C/WMeasured in still air
Thermal Resistance Junction to Top of CaseJC12.8°C/WAirflow 1 m/s

Note: Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESD51.

TABLE 18-3: MAXIMUM POWER DISSIPATION

  • Mode Maximum Power (mW)
  • Internal Regulator Disabled, 2.5 V Ethernet Magnetics 568
  • Internal Regulator Disabled, 3.3 V Ethernet Magnetics 640
  • Internal Regulator Enabled, 2.5 V Ethernet Magnetics 749
  • Internal Regulator Enabled, 3.3 V Ethernet Magnetics 821

Package Information

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
LAN9252Microchip Technology64-pin QFN
LAN9252TI/PTMicrochip Technology
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