INA228-Q1.HTML

PACKAGE OPTION ADDENDUM

Manufacturer

Texas Instruments

Overview

Part: INA228, Texas Instruments

Type: 85-V, 20-Bit, Ultra-Precise Power/Energy/Charge Monitor

Key Specs:

  • ADC Resolution: 20-bit
  • Common-Mode Range: –0.3 V to +85 V
  • Supply Voltage: 2.7 V to 5.5 V
  • Current Monitoring Offset Voltage: ±1 μV (maximum)
  • Current Monitoring Gain Error: ±0.05% (maximum)
  • Power Monitoring Accuracy: 0.5% full scale (maximum, –40°C to +125°C)
  • I2C Interface Speed: 2.94-MHz
  • Operational Current: 640 μA (typical)

Features:

  • High-resolution, 20-bit delta-sigma ADC
  • Reports current, bus voltage, temperature, power, energy, and charge accumulation
  • Programmable resistor temperature compensation
  • Programmable conversion time and averaging
  • 16 pin-selectable I2C addresses

Applications:

  • DC/DC converters and power inverters
  • Industrial battery packs
  • Power-over-ethernet (PoE)
  • Telecom equipment
  • Enterprise servers

Package:

  • VSSOP (10): 3.00 mm × 3.00 mm

Features

  • High-resolution, 20-bit delta-sigma ADC
  • Current monitoring accuracy:
    • Offset voltage: ±1 μV (maximum)
    • Offset drift: ±0.01 μV/°C (maximum)
    • Gain error: ±0.05% (maximum)
    • Gain error drift: ±20 ppm/°C (maximum)
    • Common mode rejection: 154 dB (minimum)
  • Power monitoring accuracy:
    • 0.5% full scale, –40°C to +125°C (maximum)
  • Energy and charge accuracy:
    • 1.0% full scale (maximum)
  • Fast alert response: 75 μs
  • Wide common-mode range: –0.3 V to +85 V
  • Bus voltage sense input: 0 V to 85 V
  • Shunt full-scale differential range: ±163.84 mV / ±40.96 mV
  • Input bias current: 2.5 nA (maximum)
  • Temperature sensor: ±1°C (maximum at 25°C)
  • Programmable resistor temperature compensation
  • Programmable conversion time and averaging
  • 2.94-MHz high-speed I2C interface with 16 pinselectable addresses
  • Operates from a 2.7-V to 5.5-V supply:
    • Operational current: 640 μA (typical)
    • Shutdown current: 5 μA (maximum)

Applications

Pin Configuration

Figure 5-1. DGS Package 10-Pin VSSOP Top View

Table 5-1. Pin Functions
--------------------------
PIN
NO.NAME
1A1
2A0
3ALERT
4SDA
5SCL
6VS
7GND
8VBUS
9IN–
10IN+

Electrical Characteristics

at TA = 25 °C, VS = 3.3 V, VSENSE = VIN+ – VIN– = 0 V, VCM = VIN– = 48 V (unless otherwise noted)

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
INPUT
VCMCommon-mode input rangeTA = –40°C to +125°C–0.385V
VVBUSBus voltage input range085V
CMRRCommon-mode rejection–0.3 V < VCM < 85 V, TA = –40°C to +125°C154170dB
TA = –40°C to +125°C, ADCRANGE = 0–163.84163.84mV
VDIFFShunt voltage input rangeTA = –40°C to +125°C, ADCRANGE = 1–40.9640.96mV
VCM = 48 V, TCT > 280 μs±0.3±1μV
VosShunt offset voltageVCM = 0 V, TCT > 280 μs±0.3±1μV
dVos/dTShunt offset voltage driftTA = –40°C to +125°C±2±10nV/°C
PSRRShunt offset voltage vs power supplyVS = 2.7 V to 5.5 V, TA = –40°C to +125°C±0.05±0.5μV/V
Vos_busVBUS offset voltageVBUS = 20 mV±1±2.5mV
dVos/dTVBUS offset voltage driftTA = –40°C to +125°C±4±20μV/°C
PSRRVBUS offset voltage vs power supplyVS = 2.7 V to 5.5 V±0.25mV/V
IBInput bias currentEither input, IN+ or IN–, VCM = 85 V0.12.5nA
ZVBUSVBUS pin input impedanceActive mode0.811.2
IVBUSVBUS pin leakage currentShutdown mode, VBUS = 85 V10nA
RDIFFInput differential impedanceActive mode, VIN+ – VIN– < 164 mV92
DC ACCURACY
GSERRShunt voltage gain errorVCM = 24 V±0.01±0.05%
GS_DRFTShunt voltage gain error drift±20ppm/°C
GBERRVBUS voltage gain error±0.01±0.05%
GB_DRFTVBUS voltage gain error drift±20ppm/°C
PTMEPower total measurement error (TME)TA = –40°C to +125°C, at full scale±0.5%
ETMEEnergy and charge TMEat full scale power±1%
ADC resolution20Bits
Shunt voltage, ADCRANGE = 0312.5nV
Shunt voltage, ADCRANGE = 178.125nV
1 LSB step sizeBus voltage195.3125μV
Temperature7.8125m°C
Conversion time field = 0h50
Conversion time field = 1h84
Conversion time field = 2h150
Conversion time field = 3h280
TCTADC conversion-time(1)Conversion time field = 4h540μs
Conversion time field = 5h1052
Conversion time field = 6h2074
Conversion time field = 7h4120
INLIntegral Non-Linearity±2m%
DNLDifferential Non-Linearity0.2LSB
CLOCK SOURCE
Internal oscillator frequency1MHz
FOSC
FOSC_TOLInternal oscillator frequency toleranceTA = 25°C±0.5%

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MINMAXUNIT
VSSupply voltage6V
Differential (VIN+) – (VIN–)–4040V
VIN+, VIN– (2)Common-mode–0.385V
VVBUS–0.385V
VALERTALERT–0.3VS + 0.3V
VIOSDA, SCL–0.36V
IINInput current into any pin5mA
IOUTDigital output current10mA
TJJunction temperature150°C
TstgStorage temperature–65150°C

(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively.

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MINNOM
MAX
UNIT
VCMCommon-mode input range–0.385V
VSOperating supply range2.75.5V
TAAmbient temperature–40125°C

6.4 Thermal Information

INA228
THERMAL METRIC(1)DGS (VSSOP)
10 PINS
RθJAJunction-to-ambient thermal resistance177.6
RθJC(top)Junction-to-case (top) thermal resistance66.4
RθJBJunction-to-board thermal resistance99.5
ΨJTJunction-to-top characterization parameter9.7
YJBJunction-to-board characterization parameter97.6
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

Product Folder Links: INA228

Thermal Information

INA228
THERMAL METRIC(1)DGS (VSSOP)
10 PINS
RθJAJunction-to-ambient thermal resistance177.6
RθJC(top)Junction-to-case (top) thermal resistance66.4
RθJBJunction-to-board thermal resistance99.5
ΨJTJunction-to-top characterization parameter9.7
YJBJunction-to-board characterization parameter97.6
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

Product Folder Links: INA228

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
INA228Texas Instruments
INA228-Q1Texas Instruments
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