INA228-Q1
PACKAGE OPTION ADDENDUM
Manufacturer
Texas Instruments
Overview
Part: INA228, Texas Instruments
Type: 85-V, 20-Bit, Ultra-Precise Power/Energy/Charge Monitor
Key Specs:
- ADC Resolution: 20-bit
- Common-Mode Range: –0.3 V to +85 V
- Supply Voltage: 2.7 V to 5.5 V
- Current Monitoring Offset Voltage: ±1 μV (maximum)
- Current Monitoring Gain Error: ±0.05% (maximum)
- Power Monitoring Accuracy: 0.5% full scale (maximum, –40°C to +125°C)
- I2C Interface Speed: 2.94-MHz
- Operational Current: 640 μA (typical)
Features:
- High-resolution, 20-bit delta-sigma ADC
- Reports current, bus voltage, temperature, power, energy, and charge accumulation
- Programmable resistor temperature compensation
- Programmable conversion time and averaging
- 16 pin-selectable I2C addresses
Applications:
- DC/DC converters and power inverters
- Industrial battery packs
- Power-over-ethernet (PoE)
- Telecom equipment
- Enterprise servers
Package:
- VSSOP (10): 3.00 mm × 3.00 mm
Features
- High-resolution, 20-bit delta-sigma ADC
- Current monitoring accuracy:
- Offset voltage: ±1 μV (maximum)
- Offset drift: ±0.01 μV/°C (maximum)
- Gain error: ±0.05% (maximum)
- Gain error drift: ±20 ppm/°C (maximum)
- Common mode rejection: 154 dB (minimum)
- Power monitoring accuracy:
- 0.5% full scale, –40°C to +125°C (maximum)
- Energy and charge accuracy:
- 1.0% full scale (maximum)
- Fast alert response: 75 μs
- Wide common-mode range: –0.3 V to +85 V
- Bus voltage sense input: 0 V to 85 V
- Shunt full-scale differential range: ±163.84 mV / ±40.96 mV
- Input bias current: 2.5 nA (maximum)
- Temperature sensor: ±1°C (maximum at 25°C)
- Programmable resistor temperature compensation
- Programmable conversion time and averaging
- 2.94-MHz high-speed I2C interface with 16 pinselectable addresses
- Operates from a 2.7-V to 5.5-V supply:
- Operational current: 640 μA (typical)
- Shutdown current: 5 μA (maximum)
Applications
Pin Configuration
Figure 5-1. DGS Package 10-Pin VSSOP Top View
| Table 5-1. Pin Functions |
|---|
| -------------------------- |
| PIN | |
|---|---|
| NO. | NAME |
| 1 | A1 |
| 2 | A0 |
| 3 | ALERT |
| 4 | SDA |
| 5 | SCL |
| 6 | VS |
| 7 | GND |
| 8 | VBUS |
| 9 | IN– |
| 10 | IN+ |
Electrical Characteristics
at TA = 25 °C, VS = 3.3 V, VSENSE = VIN+ – VIN– = 0 V, VCM = VIN– = 48 V (unless otherwise noted)
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| INPUT | ||||||
| VCM | Common-mode input range | TA = –40°C to +125°C | –0.3 | 85 | V | |
| VVBUS | Bus voltage input range | 0 | 85 | V | ||
| CMRR | Common-mode rejection | –0.3 V < VCM < 85 V, TA = –40°C to +125°C | 154 | 170 | dB | |
| TA = –40°C to +125°C, ADCRANGE = 0 | –163.84 | 163.84 | mV | |||
| VDIFF | Shunt voltage input range | TA = –40°C to +125°C, ADCRANGE = 1 | –40.96 | 40.96 | mV | |
| VCM = 48 V, TCT > 280 μs | ±0.3 | ±1 | μV | |||
| Vos | Shunt offset voltage | VCM = 0 V, TCT > 280 μs | ±0.3 | ±1 | μV | |
| dVos/dT | Shunt offset voltage drift | TA = –40°C to +125°C | ±2 | ±10 | nV/°C | |
| PSRR | Shunt offset voltage vs power supply | VS = 2.7 V to 5.5 V, TA = –40°C to +125°C | ±0.05 | ±0.5 | μV/V | |
| Vos_bus | VBUS offset voltage | VBUS = 20 mV | ±1 | ±2.5 | mV | |
| dVos/dT | VBUS offset voltage drift | TA = –40°C to +125°C | ±4 | ±20 | μV/°C | |
| PSRR | VBUS offset voltage vs power supply | VS = 2.7 V to 5.5 V | ±0.25 | mV/V | ||
| IB | Input bias current | Either input, IN+ or IN–, VCM = 85 V | 0.1 | 2.5 | nA | |
| ZVBUS | VBUS pin input impedance | Active mode | 0.8 | 1 | 1.2 | MΩ |
| IVBUS | VBUS pin leakage current | Shutdown mode, VBUS = 85 V | 10 | nA | ||
| RDIFF | Input differential impedance | Active mode, VIN+ – VIN– < 164 mV | 92 | kΩ | ||
| DC ACCURACY | ||||||
| GSERR | Shunt voltage gain error | VCM = 24 V | ±0.01 | ±0.05 | % | |
| GS_DRFT | Shunt voltage gain error drift | ±20 | ppm/°C | |||
| GBERR | VBUS voltage gain error | ±0.01 | ±0.05 | % | ||
| GB_DRFT | VBUS voltage gain error drift | ±20 | ppm/°C | |||
| PTME | Power total measurement error (TME) | TA = –40°C to +125°C, at full scale | ±0.5 | % | ||
| ETME | Energy and charge TME | at full scale power | ±1 | % | ||
| ADC resolution | 20 | Bits | ||||
| Shunt voltage, ADCRANGE = 0 | 312.5 | nV | ||||
| Shunt voltage, ADCRANGE = 1 | 78.125 | nV | ||||
| 1 LSB step size | Bus voltage | 195.3125 | μV | |||
| Temperature | 7.8125 | m°C | ||||
| Conversion time field = 0h | 50 | |||||
| Conversion time field = 1h | 84 | |||||
| Conversion time field = 2h | 150 | |||||
| Conversion time field = 3h | 280 | |||||
| TCT | ADC conversion-time(1) | Conversion time field = 4h | 540 | μs | ||
| Conversion time field = 5h | 1052 | |||||
| Conversion time field = 6h | 2074 | |||||
| Conversion time field = 7h | 4120 | |||||
| INL | Integral Non-Linearity | ±2 | m% | |||
| DNL | Differential Non-Linearity | 0.2 | LSB | |||
| CLOCK SOURCE | ||||||
| Internal oscillator frequency | 1 | MHz | ||||
| FOSC | ||||||
| FOSC_TOL | Internal oscillator frequency tolerance | TA = 25°C | ±0.5 | % |
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| VS | Supply voltage | 6 | V | |
| Differential (VIN+) – (VIN–) | –40 | 40 | V | |
| VIN+, VIN– (2) | Common-mode | –0.3 | 85 | V |
| VVBUS | –0.3 | 85 | V | |
| VALERT | ALERT | –0.3 | VS + 0.3 | V |
| VIO | SDA, SCL | –0.3 | 6 | V |
| IIN | Input current into any pin | 5 | mA | |
| IOUT | Digital output current | 10 | mA | |
| TJ | Junction temperature | 150 | °C | |
| Tstg | Storage temperature | –65 | 150 | °C |
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively.
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN | NOM MAX | UNIT | ||
|---|---|---|---|---|
| VCM | Common-mode input range | –0.3 | 85 | V |
| VS | Operating supply range | 2.7 | 5.5 | V |
| TA | Ambient temperature | –40 | 125 | °C |
6.4 Thermal Information
| INA228 | ||
|---|---|---|
| THERMAL METRIC(1) | DGS (VSSOP) | |
| 10 PINS | ||
| RθJA | Junction-to-ambient thermal resistance | 177.6 |
| RθJC(top) | Junction-to-case (top) thermal resistance | 66.4 |
| RθJB | Junction-to-board thermal resistance | 99.5 |
| ΨJT | Junction-to-top characterization parameter | 9.7 |
| YJB | Junction-to-board characterization parameter | 97.6 |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
Product Folder Links: INA228
Thermal Information
| INA228 | ||
|---|---|---|
| THERMAL METRIC(1) | DGS (VSSOP) | |
| 10 PINS | ||
| RθJA | Junction-to-ambient thermal resistance | 177.6 |
| RθJC(top) | Junction-to-case (top) thermal resistance | 66.4 |
| RθJB | Junction-to-board thermal resistance | 99.5 |
| ΨJT | Junction-to-top characterization parameter | 9.7 |
| YJB | Junction-to-board characterization parameter | 97.6 |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
Product Folder Links: INA228
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| INA228 | Texas Instruments | — |
| INA228-Q1.HTML | Texas Instruments | — |
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