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ICS307M-02

Serially Programmable Clock Source

The ICS307M-02 is a serially programmable clock source from Integrated Device Technology. View the full ICS307M-02 datasheet below including electrical characteristics, absolute maximum ratings.

Manufacturer

Integrated Device Technology

Category

Serially Programmable Clock Source

Overview

Part: ICS307-01/-02 — Integrated Device Technology Type: Serially Programmable Clock Source Description: Versatile serially programmable clock source generating frequencies from 6 to 200 MHz with a second configurable output, featuring a 3-wire serial interface and power-down tri-state mode.

Operating Conditions:

  • Supply voltage: 3 to 5.5 V
  • Operating temperature: 0 to +70 °C
  • Input crystal frequency: 5–27 MHz
  • Output frequency range: 6–200 MHz

Absolute Maximum Ratings:

  • Max supply voltage: 7 V
  • Max junction/storage temperature: +150 °C

Key Specs:

  • Operating Supply Current (Typ, 5V): 26 mA (20 MHz crystal, No load, 100 MHz out)
  • Operating Supply Current (Typ, 3.3V): 13 mA (100 MHz out)
  • Input Frequency (Crystal): 5 to 27 MHz
  • Input Frequency (Clock): 2 to 50 MHz
  • Output Frequency: 6 to 200 MHz
  • Output High Voltage (VOH): 2.4 V (IOH = -25 mA)
  • Output Low Voltage (VOL): 0.4 V (IOL = 25 mA)
  • One Sigma Clock Period Jitter (Typ): 50 ps

Features:

  • Packaged in 16-pin (150 mil wide) SOIC
  • Highly accurate frequency generation
  • Serially programmable via 3-wire interface
  • Eliminates need for custom quartz
  • Input crystal frequency of 5 - 27 MHz
  • Output clock frequencies up to 200 MHz
  • Power down tri-state mode
  • Very low jitter
  • Operating voltage of 3.3 V or 5 V
  • 25 mA drive capability at TTL levels

Package:

  • 16-pin SOIC

Features

This product is intended for clock generation. It has low output jitter (variation in the output period), but input to output skew and jitter are not defined nor guaranteed. For applications which require defined input to output skew, use the ICS527-01.

Pin Configuration

  • 12 DATA

  • 1 X1/ICLK

  • 11 CLK1

  • 2 NC

  • 10 NC

  • 3 VDD

  • 9 STROBE

  • 4 NC

  • 5 GND

  • 6 CLK2

  • NC 15

  • 7 NC

  • 8 SCLK

  • NC 14

  • PDTS 13

  • 16 X2

16 pin (150 mil) SOIC

Electrical Characteristics

VDD=3.3 V ±5% , Ambient temperature 0 to +70 ° C, unless stated otherwise

ParameterSymbolConditionsMin.Typ.Max.Units
Operating VoltageVDD3.05.5V
Input High VoltageV IHX1/ICLK only(VDD/2)+1VDD/2V
Input Low VoltageV ILX1/ICLK onlyVDD/2(VDD/2)-1V
Input High VoltageV IH2V
Input Low VoltageV ILPDTS on ICS307-010.4V
Input Low VoltageAll other inputs, ICS307-01/020.8V
Output High VoltageV OHI OH = -25 mA2.4V
Output Low VoltageV OLI OL = 25 mA0.4V
Output High Voltage, CMOS levelV OHI OH = -4 mAVDD-0.4V
Operating Supply CurrentIDD20 MHz crystal No load, 100 MHz out26mA
Operating Supply Current100 MHz out, 3.3 V13mA
ParameterSymbolConditionsMin.Typ.Max.Units
Short Circuit CurrentCLK outputs±70mA
Input CapacitanceC IN4pF
On-Chip Pull-up ResistorR PUPin 13270k Ω

Absolute Maximum Ratings

Stresses above the ratings listed below can cause permanent damage to the ICS307-01/-02. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range.

ItemRating
Supply Voltage, VDD7 V
All Inputs and Outputs-0.5 V to VDD+0.5 V
Ambient Operating Temperature0 to +70 ° C
Ambient Operating Temperature, Industrial-40 to +85 ° C
Storage Temperature-65 to +150 ° C
Soldering Temperature260 ° C

Thermal Information

ParameterSymbolConditionsMin.Typ.Max.Units
Thermal Resistance Junction to Ambientθ JAStill air120° C/W
Thermal Resistance Junction to Ambientθ JA1 m/s air flow115° C/W
Thermal Resistance Junction to Ambientθ JA3 m/s air flow105° C/W
Thermal Resistance Junction to Caseθ JC58° C/W

Package Information

Package dimensions are kept current with JEDEC Publication No. 95

MillimetersMillimetersInchesInches
SymbolMinMaxMinMax
A1.351.75.0532.0688
A10.100.25.0040.0098
B0.330.51.013.020
C0.190.25.0075.0098
D9.8010.00.3859.3937
E3.804.00.1497.1574
e1.27 BASIC1.27 BASIC0.050 BASIC0.050 BASIC
H5.806.20.2284.2440
h0.250.50.010.020
L0.401.27.016.050
α0 °8 °0 °8 °

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
ICS307Integrated Device Technology
ICS307-01Integrated Device Technology
ICS307-01/02Integrated Device Technology
ICS307-02Integrated Device Technology
ICS307-02LZTIntegrated Device Technology16-pin SOIC
ICS307M-01Integrated Device Technology
ICS307M-01IIntegrated Device Technology
ICS307M-02IIntegrated Device Technology
ICS307M-02LFIntegrated Device Technology
Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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