Part: GD32F303xx — GigaDevice Semiconductor Inc.

Type: Arm Cortex-M4 32-bit MCU

Description: 32-bit Arm Cortex-M4 MCU operating at up to 120 MHz, with up to 3 MB Flash memory and 96 KB SRAM.

Operating Conditions:

• Supply voltage: 2.6 to 3.6 V
• Operating temperature: -40 to +105 °C
• Max core frequency: 120 MHz

Absolute Maximum Ratings:

• Max supply voltage: 4.0 V
• Max junction/storage temperature: 125 °C

Key Specs:

• Core frequency: Up to 120 MHz (fHCLK)
• Flash memory: Up to 3072 KB
• SRAM: Up to 96 KB
• ADC resolution: 12-bit
• ADC conversion rate: Up to 2.6 MSPS (fADC=40MHz)
• DAC resolution: 12-bit
• Run mode current: 40 mA (Typ. at 120 MHz, VDD=3.3V, Tj=25°C, all peripherals enabled)
• I/O voltage: 2.6 to 3.6 V

Features:

• Arm Cortex-M4 core
• Up to 120 MHz operation
• Up to 3 MB Flash, 96 KB SRAM
• Multiple communication interfaces (I2C, SPI, USART, CAN, USB, SDIO)
• 12-bit ADC and DAC
• Timers and PWM generation
• Power saving modes

Package:

• LQFP144
• LQFP100
• LQFP64
• LQFP48

GD32F303RGT6 – LQFP64 Pinout

Pin Number	Pin Name	Type	Description
1	PE2	I/O	Port E, Pin 2
2	PE3	I/O	Port E, Pin 3
3	PE4	I/O	Port E, Pin 4
4	PE5	I/O	Port E, Pin 5
5	PE6	I/O	Port E, Pin 6
6	VBAT	P	Battery backup power supply
7	PC13-TAMPER-RTC	I/O	Port C, Pin 13 (Tamper/RTC)
8	PC14-OSC32IN	I/O	Port C, Pin 14 (32 kHz oscillator input)
9	PC15-OSC32OUT	I/O	Port C, Pin 15 (32 kHz oscillator output)
10	PF0	I/O	Port F, Pin 0
11	PF1	I/O	Port F, Pin 1
12	PF2	I/O	Port F, Pin 2
13	PF3	I/O	Port F, Pin 3
14	PF4	I/O	Port F, Pin 4
15	PF5	I/O	Port F, Pin 5
16	VSS_5	P	Ground
17	VDD_5	P	Power supply
18	PF6	I/O	Port F, Pin 6
19	PF7	I/O	Port F, Pin 7
20	PF8	I/O	Port F, Pin 8
21	PF9	I/O	Port F, Pin 9
22	PF10	I/O	Port F, Pin 10
23	OSCIN	I	Main oscillator input
24	OSCOUT	O	Main oscillator output
25	NRST	I	Reset (active low)
26	PC0	I/O	Port C, Pin 0
27	PC1	I/O	Port C, Pin 1
28	PC2	I/O	Port C, Pin 2
29	PC3	I/O	Port C, Pin 3
30	VSS_a	P	Ground
31	VREF-	P	Reference voltage negative
32	VREF+	P	Reference voltage positive
33	VDD_a	P	Analog power supply
34	PA0_WKUP	I/O	Port A, Pin 0 (Wakeup)
35	PA1	I/O	Port A, Pin 1
36	PA2	I/O	Port A, Pin 2
37	PA3	I/O	Port A, Pin 3
38	VSS_6	P	Ground
39	VDD_6	P	Power supply
40	PA4	I/O	Port A, Pin 4
41	PA5	I/O	Port A, Pin 5
42	PA6	I/O	Port A, Pin 6
43	PA7	I/O	Port A, Pin 7
44	PC4	I/O	Port C, Pin 4
45	PC5	I/O	Port C, Pin 5
46	PB0	I/O	Port B, Pin 0
47	PB1	I/O	Port B, Pin 1
48	PB2	I/O	Port B, Pin 2
49	PE7	I/O	Port E, Pin 7
50	PE8	I/O	Port E, Pin 8
51	PE9	I/O	Port E, Pin 9
52	PE10	I/O	Port E, Pin 10
53	PE11	I/O	Port E, Pin 11
54	PE12	I/O	Port E, Pin 12
55	PE13	I/O	Port E, Pin 13
56	PE14	I/O	Port E, Pin 14
57	PE15	I/O	Port E, Pin 15
58	PB10	I/O	Port B, Pin 10
59	PB11	I/O	Port B, Pin 11
60	VSS_7	P	Ground
61	VDD_7	P	Power supply
62	PB12	I/O	Port B, Pin 12
63	PB13	I/O	Port B, Pin 13
64	PB14	I/O	Port B, Pin 14

Notes:

• GD32F303RGT6 is a 64-pin LQFP package variant (Rx suffix).
• Pin numbers extracted from the LQFP64 package diagram (Figure 2-4).
• Multiple VSS (ground) and VDD (power) pins distributed throughout the package for proper power distribution.
• VBAT pin (6) provides battery backup for RTC and tamper detection.
• VREF+/VREF- pins (31, 32) are dedicated analog reference pins.
• NRST (pin 25) is the active-low reset input.
• Oscillator pins: OSCIN (23) and OSCOUT (24) for main clock; PC14/PC15 for 32 kHz RTC oscillator.

Table 4-26. ADC characteristics

Symbol	Parameter	Conditions	Min	Typ	Max	Unit
V DDA (1)	Operating voltage	-	2.6	3.3	3.6	V
V IN (1)	ADC input voltage range	-	0	-	V REF+	V
V REF+ (2)	Positive Reference Voltage	-	2.6	-	V DDA	V
V REF- (2)	Negative Reference Voltage	-	-	V SSA	-	V
f ADC (1)	ADC clock	-	0.1	-	40	MHz
f S (1)	Sampling rate	12-bit	0.007	-	2.86	MSP
f S (1)	Sampling rate	10-bit	0.008	-	3.33	MSP
f S (1)	Sampling rate	8-bit	0.01	-	4	S
f S (1)	Sampling rate	6-bit	0.012	-	5	S
V AIN (1)	Analog input voltage	16 external; 2 internal	0	-	V DDA	V
R AIN (2)	External input impedance	See Equation 1	-	-	32.9	kΩ
R ADC (2)	Input sampling switch resistance	-	-	-	0.55	kΩ
C ADC (2)	Input sampling capacitance	No pin/pad capacitance included	-	-	5.5	pF

Table 4-26. ADC characteristics

Symbol	Parameter	Conditions	Min	Typ	Max	Unit
t CAL (2)	Calibration time	f ADC = 40 MHz	-	3.275	-	μs
t s (2)	Sampling time	f ADC = 40 MHz	0.0375	-	5.99	μs
t CONV (2)	Total conversion time(including sampling time)	12-bit	-	14	-	1/ f ADC
t CONV (2)	Total conversion time(including sampling time)	10-bit	-	12	-	1/ f ADC
t CONV (2)	Total conversion time(including sampling time)	8-bit	-	10	-	1/ f ADC
t CONV (2)	Total conversion time(including sampling time)	6-bit	-	8	-	1/ f ADC
t SU (2)	Startup time	-	-	-	1	μ s

The formula above (Equation 1) is used to determine the maximum external impedance allowed for an error below 1/4 of LSB. Here N = 12 (from 12-bit resolution).

Table 4-27. ADC RAIN max for fADC = 40 MHz

• T s (cycles) t s (μs) (1) R AIN max (kΩ)
• 1.5 0.0375 0.15
• 7.5 0.1875 2.96
• 13.5 0.3375 5.77
• 28.5 0.7125 12.8
• 41.5 1.0375 18.9
• 55.5 1.3875 25.4
• 71.5 1.7875 32.9
• 239.5 5.9875 N/A

Table 4-28. ADC dynamic accuracy at fADC = 14 MHz (1)

Symbol	Parameter	Test conditions	Min	Typ	Max	Unit
ENOB	Effective number of bits	f ADC = 14 MHz	-	10.8	-	bits
SNDR	Signal-to-noise and distortion ratio	V DDA = V REF+ = 3.3 V	-	66.7	-
SNR	Signal-to-noise ratio	Input Frequency = 20	-	67.4	-	dB
THD	Total harmonic distortion	kHz Temperature = 25 °C	-	-76.3	-

Symbol	Parameter	Test conditions	Min	Typ	Max	Unit
ENOB	Effective number of bits	f ADC = 40 MHz	-	10	-	bits
SNDR	Signal-to-noise and distortion ratio	V DDA = V REF+ = 3.3 V	-	62	-
SNR	Signal-to-noise ratio	Input Frequency = 20 kHz	-	62.2	-	dB
THD	Total harmonic distortion	Temperature = 25 °C	-	-68.6	-

Table 4-30. ADC static accuracy at fADC = 14 MHz (1)

Symbol	Parameter	Test conditions	Typ	Max	Unit
Offset	Offset error	f ADC = 14 MHz V DDA = V REF+ = 3.3 V	±1	-	LSB
DNL	Differential linearity error	f ADC = 14 MHz V DDA = V REF+ = 3.3 V	±0.9	-	LSB
INL	Integral linearity error	f ADC = 14 MHz V DDA = V REF+ = 3.3 V	±1	-	LSB

The maximum ratings are the limits to which the device can be subjected without permanently damaging the device. Note that the device is not guaranteed to operate properly at the maximum ratings. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.

Table 4-1. Absolute maximum ratings (1) (4)

Symbol	Parameter	Min	Max	Unit
V DD	External voltagerange (2)	V SS - 0.3	V SS + 3.6	V
V DDA	External analog supply voltage	V SSA - 0.3	V SSA + 3.6	V
V BAT	External battery supply voltage	V SS - 0.3	V SS + 3.6	V
V IN	Input voltageon 5V tolerant pin (3)	V SS - 0.3	V DD + 3.6	V
V IN	Input voltageon other I/O	V SS - 0.3	3.6	V
\	ΔV DDX \		Variations between differentV DD power pins	-
\	V SSX -V SS \		Variations between differentground pins	-
I IO	Maximum current for GPIO pins	-	±25	mA
T A	Operating temperaturerange for grade6 device	-40	+85	° C
T A	Operating temperaturerange for grade7 device	-40	+105	° C
P D	Power dissipationatT A = 85° C ofLQFP144 (5)	-	820	mW
P D	Power dissipationatT A = 85° C ofLQFP100 (5)	-	848	mW
P D	Power dissipationatT A = 85° C ofLQFP64 (5)	-	647	mW
P D	Power dissipationatT A = 85° C ofLQFP48 (5)	-	621	mW
P D	Power dissipationatT A = 105° C of LQFP100 (5)	-	424	mW
P D	Power dissipationatT A = 105° C of LQFP48 (5)	-	311	mW
T STG	Storage temperature range	-65	+150	° C
T J	Maximum junction temperature	-	125	° C

Thermal resistance is used to characterize the thermal performance of the package device, which is represented by the Greek letter 'θ'. For semiconductor devices, thermal resistance represents the steady-state temperature rise of the chip junction due to the heat dissipated on the chip surface.

θJA: Thermal resistance, junction-to-ambient.

θJB: Thermal resistance, junction-to-board.

θJC: Thermal resistance, junction-to-case.

ᴪJB: Thermal characterization parameter, junction-to-board.

ᴪJT: Thermal characterization parameter, junction-to-top center.

Where, TJ = Junction temperature.

TA = Ambient temperature

TB = Board temperature

TC = Case temperature which is monitoring on package surface

PD = Total power dissipation

θJA represents the resistance of the heat flows from the heating junction to ambient air. It is an indicator of package heat dissipation capability. Lower θJA can be considerate as better overall thermal performance. θJA is generally used to estimate junction temperature.

θJB is used to measure the heat flow resistance between the chip surface and the PCB board.

θJC represents the thermal resistance between the chip surface and the package top case. θJC is mainly used to estimate the heat dissipation of the system (using heat sink or other heat dissipation methods outside the device package).

Table 5-5. Package thermal characteristics (1)

Symbol	Condition	Package	Value	Unit
θ JA	Natural convection,2S2P PCB	LQFP144	48.76	° C/W
θ JA	Natural convection,2S2P PCB	LQFP100	47.19	° C/W
θ JA	Natural convection,2S2P PCB	LQFP64	61.8	° C/W
θ JA	Natural convection,2S2P PCB	LQFP48	64.4	° C/W
θ JB	Cold plate,2S2P PCB	LQFP144	35	° C/W
θ JB	Cold plate,2S2P PCB	LQFP100	27.43	° C/W

Table 5-5. Package thermal characteristics (1)

Symbol	Condition	Package	Value	Unit
		LQFP64 LQFP48	42.83 42.32
θ JC		LQFP144	12.03	° C/W
θ JC		LQFP100	8.57	° C/W
θ JC		LQFP64	21.98	° C/W
θ JC		LQFP48	22.47	° C/W
ᴪ JB	convection,2S2P PCB	LQFP144	35.32	° C/W
ᴪ JB	convection,2S2P PCB	LQFP100	31.42	° C/W
ᴪ JB	convection,2S2P PCB	LQFP64	43.05	° C/W
ᴪ JB	convection,2S2P PCB	LQFP48	42.42	° C/W
ᴪ JT	convection,2S2P PCB	LQFP144	1.86	° C/W
ᴪ JT	convection,2S2P PCB	LQFP100	1	° C/W
ᴪ JT	convection,2S2P PCB	LQFP64	1.58	° C/W
ᴪ JT	convection,2S2P PCB	LQFP48	1.74	° C/W

Figure 5-1. LQFP144 package outline

Table 5-1. LQFP144 package dimensions

Symbol	Min	Typ	Max
A	-	-	1.60
A1	0.05	-	0.15
A2	1.35	1.40	1.45
A3	0.59	0.64	0.69
b	0.18	-	0.26
b1	0.17	0.20	0.23
c	0.13	-	0.17
c1	0.12	0.13	0.14
D	21.80	22.00	22.20
D1	19.90	20.00	20.10
E	21.80	22.00	22.20
E1	19.90	20.00	20.10
e	-	0.50	-
L	0.45	-	0.75
L1	-	1.00	-
θ	0°	-	7°

(Original dimensions are in millimeters)

Table 5-1. LQFP144 package dimensions

Figure 5-2. LQFP144 recommended footprint

(Original dimensions are in millimeters)

Ordering code	Package	Temperature operating range
GD32F303ZKT6	LQFP144	Industrial -40 °C to +85 °C
GD32F303ZIT6	LQFP144	Industrial -40 °C to +85 °C
GD32F303ZGT6	LQFP144	Industrial -40 °C to +85 °C
GD32F303ZET6	LQFP144	Industrial -40 °C to +85 °C
GD32F303ZCT6	LQFP144	Industrial -40 °C to +85 °C
GD32F303VKT6	LQFP100	Industrial -40 °C to +85 °C
GD32F303VIT6	LQFP100	Industrial -40 °C to +85 °C
GD32F303VGT6	LQFP100	Industrial -40 °C to +85 °C
GD32F303VET6	LQFP100	Industrial -40 °C to +85 °C
GD32F303VET7	LQFP100	Industrial -40 °C to +105 °C
GD32F303VCT6	LQFP100	Industrial -40 °C to +85 °C
GD32F303VBT6	LQFP100	Industrial -40 °C to +85 °C
GD32F303RKT6	LQFP64	Industrial -40 °C to +85 °C
GD32F303RIT6	LQFP64	Industrial -40 °C to +85 °C
GD32F303RGT6	LQFP64	Industrial -40 °C to +85 °C
GD32F303RET6	LQFP64	Industrial -40 °C to +85 °C
GD32F303RCT6	LQFP64	Industrial -40 °C to +85 °C
GD32F303RBT6	LQFP64	Industrial -40 °C to +85 °C
GD32F303CGT6	LQFP48	Industrial -40 °C to +85 °C
GD32F303CET6	LQFP48	Industrial -40 °C to +85 °C
GD32F303CCT6	LQFP48	Industrial -40 °C to +85 °C
GD32F303CCT7	LQFP48	Industrial -40 °C to +105 °C
GD32F303CBT6	LQFP48	Industrial -40 °C to +85 °C
GD32F303CBT7	LQFP48	Industrial -40 °C to +105 °C
GD32F303ZKT5	LQFP144	Commercial -20°C to +85°C
GD32F303ZIT5	LQFP144	Commercial -20°C to +85°C
GD32F303ZGT5	LQFP144	Commercial -20°C to +85°C
GD32F303ZET5	LQFP144	Commercial -20°C to +85°C
GD32F303ZCT5	LQFP144	Commercial -20°C to +85°C
GD32F303VKT5	LQFP100	Commercial -20°C to +85°C
GD32F303VIT5	LQFP100	Commercial -20°C to +85°C
GD32F303VGT5	LQFP100	Commercial -20°C to +85°C
GD32F303VET5	LQFP100	Commercial -20°C to +85°C
GD32F303VCT5	LQFP100	Commercial -20°C to +85°C
GD32F303RKT5	LQFP64	Commercial -20°C to +85°C
GD32F303RIT5	LQFP64	Commercial -20°C to +85°C
GD32F303RGT5	LQFP64	Commercial -20°C to +85°C
GD32F303RET5	LQFP64	Commercial -20°C to +85°C
GD32F303RCT5	LQFP64	Commercial -20°C to +85°C
GD32F303CGT5	LQFP48	Commercial -20°C to +85°C
GD32F303CET5	LQFP48	Commercial -20°C to +85°C
GD32F303CCT5	LQFP48	Commercial -20°C to +85°C