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ESP32-PICO-D4

System-in-Package (SiP) Module

The ESP32-PICO-D4 is a system-in-package (sip) module from Espressif Systems. View the full ESP32-PICO-D4 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

Manufacturer

Espressif Systems

Category

System-in-Package (SiP) Module

Package

System-in-Package (SiP) module, 7.000x7.000x0.940 mm (nominal)

Lifecycle

Active

Key Specifications

ParameterValue
Data Rate150Mbps
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
Frequency2.4GHz ~ 2.5GHz
Memory Size4MB Flash
ModulationCCK, DSSS, OFDM
ModulationCCK, DSSS, OFDM
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 85°C
Package / Case48-SMD Module
Power - Output20.5dBm
Power - Output20.5dBm
Protocol802.11b/g/n, Bluetooth v4.2 +EDR, Class 1, 2 and 3
RF Family/StandardBluetooth, WiFi
RF Family/StandardBluetooth, WiFi
Sensitivity-98.4dBm
Sensitivity-98.4dBm
Serial InterfacesGPIO, I2C, I2S, PWM, SDIO, SPI, UART
Serial InterfacesGPIO, I2C, I2S, PWM, SDIO, SPI, UART
Utilized IC / PartESP32
Utilized IC / PartESP32
Supply Voltage2.7V ~ 3.6V

Overview

Part: ESP32-PICO-D4 — Espressif Inc.

Type: System-in-Package (SiP) Module

Description: System-in-Package (SiP) module based on ESP32, offering Wi-Fi (802.11 b/g/n) and Bluetooth V4.2 BR/EDR and LE, with integrated 4 MB SPI flash and 40 MHz crystal oscillator.

Operating Conditions:

  • Supply voltage: 3.0 V ~ 3.6 V
  • Operating temperature: -40 to 85 °C
  • Minimum current delivered by power supply: 0.5 A

Absolute Maximum Ratings:

  • Max supply voltage: 3.6 V
  • Max cumulative IO output current: 1100 mA
  • Max storage temperature: 150 °C

Key Specs:

  • Pin capacitance: 2 pF (Typ)
  • High-level input current: 50 nA (Max)
  • Low-level input current: 50 nA (Max)
  • High-level source current (VDD3P3_CPU/RTC power domain): 40 mA (Typ, VDD = 3.3 V, VOH >= 2.64 V)
  • Low-level sink current: 28 mA (Typ, VDD = 3.3 V, VOL = 0.495 V)
  • Resistance of internal pull-up resistor: 45 kΩ (Typ)
  • Resistance of internal pull-down resistor: 45 kΩ (Typ)
  • Wi-Fi operating frequency range: 2412–2484 MHz

Features:

  • Integrated 4-MB SPI flash
  • Integrated 40 MHz crystal oscillator
  • Wi-Fi 802.11 b/g/n (up to 150 Mbps)
  • Bluetooth V4.2 BR/EDR and Bluetooth LE specification
  • Dual Xtensa® 32-bit LX6 microprocessors
  • 520 KB on-chip SRAM, 448 KB ROM
  • ADC, DAC, touch sensor, SD/SDIO/MMC Host Controller, SPI, SDIO/SPI Slave Controller, EMAC, motor PWM, LED PWM, UART, I2C, I2S, infrared remote controller, GPIO, pulse counter
  • Hall sensor

Applications:

  • Wearable electronics
  • Medical equipment
  • Sensors
  • IoT products

Package:

  • (7.000±0.100) mm × (7.000±0.100) mm × (0.940±0.100) mm

Pin Configuration

The ESP32-PICO-D4 module has 48 pins. See pin definitions in Table 2.

Table 2: Pin Description

NameNo.TypeFunction
VDDA1PAnalog power supply (2.3 V ~ 3.6 V)
LNA_IN2I/ORF input and output
VDDA3P33PAnalog power supply (2.3 V ~ 3.6 V)
VDDA3P34PAnalog power supply (2.3 V ~ 3.6 V)
SENSOR_VP5IGPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_CAPP6IGPIO37, ADC1_CH1, RTC_GPIO1
SENSOR_CAPN7IGPIO38, ADC1_CH2, RTC_GPIO2
SENSOR_VN8IGPIO39, ADC1_CH3, RTC_GPIO3

Table 2: Pin Description

NameNo.TypeFunction
EN9IHigh: On; enables the module Low: Off; the module powers off Note: Do not leave this pin floating.
IO3410IADC1_CH6, RTC_GPIO4
IO3511IADC1_CH7, RTC_GPIO5
IO3212I/O32K_XP (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9
IO3313I/O32K_XN (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8
IO2514I/OGPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO2615I/OGPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO2716I/OGPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
IO1417I/OADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2
IO1218I/OADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3
VDD3P3_RTC19PInput power supply for RTC IO (3.0 V ~ 3.6 V)
IO1320I/OADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER
IO1521I/OADC2_CH3, TOUCH3, RTC_GPIO13, MTDO, HSPICS0, HS2_CMD, SD_CMD, EMAC_RXD3
IO222I/OADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0
IO023I/OADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
IO424I/OADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER
IO1625I/OGPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
VDD_SDIO26POutput power supply. See note 1 under the table.
IO1727I/OGPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
SD228I/OGPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
SD329I/OGPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
CMD30I/OGPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS
CLK31I/OGPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
SD032I/OGPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
SD133I/OGPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
IO534I/OGPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO1835I/OGPIO18, VSPICLK, HS1_DATA7
IO2336I/OGPIO23, VSPID, HS1_STROBE
VDD3P3_CPU37PInput power supply for CPU IO (1.8 V ~ 3.6 V)
IO1938I/OGPIO19, VSPIQ, U0CTS, EMAC_TXD0
IO2239I/OGPIO22, VSPIWP, U0RTS, EMAC_TXD1
U0RXD40I/OGPIO3, U0RXD, CLK_OUT2
NameNo.TypeFunction
U0TXD41I/OGPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO2142I/OGPIO21, VSPIHD, EMAC_TX_EN
VDDA43PAnalog power supply (2.3 V ~ 3.6 V)
XTAL_N_NC44-NC
XTAL_P_NC45-NC
VDDA46PAnalog power supply (2.3 V ~ 3.6 V)
CAP2_NC47-NC
CAP1_NC48-NC

Electrical Characteristics

Table 6: DC Characteristics (3.3 V, 25 °C)

SymbolParameterParameterMinTypMaxUnit
C INPin capacitancePin capacitance-2-pF
V IHHigh-level input voltageHigh-level input voltage0.75×VDD 1-VDD 1 +0.3V
V ILLow-level input voltageLow-level input voltage-0.3-0.25×VDD 1V
I IHHigh-level input currentHigh-level input current--50nA
I ILLow-level input currentLow-level input current--50nA
V OHHigh-level output voltageHigh-level output voltage0.8×VDD 1--V
V OLLow-level output voltageLow-level output voltage--0.1×VDD 1V
I OHHigh-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum)VDD3P3_CPU power domain 1 , 2-40-mA
I OHHigh-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum)VDD3P3_RTC power domain 1 , 2-40-mA
I OHHigh-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum)VDD_SDIO power domain 1 , 3-20-mA
SymbolParameterMinTypMaxUnit
I OLLow-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum)-28-mA
R PUResistance of internal pull-up resistor-45-k Ω
R PDResistance of internal pull-down resistor-45-k Ω
V IL _ nRSTLow-level input voltage of CHIP_PU to power off the chip--0.6V

Absolute Maximum Ratings

Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions.

Table 4: Absolute Maximum Ratings

SymbolParameterMinMaxUnit
VDD33Power supply voltage-0.33.6V
I output 1Cumulative IO output current-1100mA
T storeStorage temperature-40150°C

Recommended Operating Conditions

Table 5: Recommended Operating Conditions

SymbolParameterMinTypicalMaxUnit
VDD33Power supply voltage33.33.6V
I VDDCurrent delivered by external power supply0.5--A
TOperating temperature-40-85°C

Package Information

Figure 7: ESP32-PICO-D4 Package

Ordering Information

MPNPackageTemperature RangePacking
ESP32-PICO-D4System-in-Package (SiP) module, 7.000x7.000x0.940 mm (nominal)-40 °C ~ 85 °Cnull

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
ESP32Espressif SystemsESP32-WROOM-32E (18.0 x 25.5 x 3.1 mm)
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