ESP32-PICO-D4
System-in-Package (SiP) ModuleThe ESP32-PICO-D4 is a system-in-package (sip) module from Espressif Systems. View the full ESP32-PICO-D4 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
Manufacturer
Espressif Systems
Category
System-in-Package (SiP) Module
Package
System-in-Package (SiP) module, 7.000x7.000x0.940 mm (nominal)
Lifecycle
Active
Key Specifications
| Parameter | Value |
|---|---|
| Data Rate | 150Mbps |
| DigiKey Programmable | Not Verified |
| DigiKey Programmable | Not Verified |
| Frequency | 2.4GHz ~ 2.5GHz |
| Memory Size | 4MB Flash |
| Modulation | CCK, DSSS, OFDM |
| Modulation | CCK, DSSS, OFDM |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C |
| Package / Case | 48-SMD Module |
| Power - Output | 20.5dBm |
| Power - Output | 20.5dBm |
| Protocol | 802.11b/g/n, Bluetooth v4.2 +EDR, Class 1, 2 and 3 |
| RF Family/Standard | Bluetooth, WiFi |
| RF Family/Standard | Bluetooth, WiFi |
| Sensitivity | -98.4dBm |
| Sensitivity | -98.4dBm |
| Serial Interfaces | GPIO, I2C, I2S, PWM, SDIO, SPI, UART |
| Serial Interfaces | GPIO, I2C, I2S, PWM, SDIO, SPI, UART |
| Utilized IC / Part | ESP32 |
| Utilized IC / Part | ESP32 |
| Supply Voltage | 2.7V ~ 3.6V |
Overview
Part: ESP32-PICO-D4 — Espressif Inc.
Type: System-in-Package (SiP) Module
Description: System-in-Package (SiP) module based on ESP32, offering Wi-Fi (802.11 b/g/n) and Bluetooth V4.2 BR/EDR and LE, with integrated 4 MB SPI flash and 40 MHz crystal oscillator.
Operating Conditions:
- Supply voltage: 3.0 V ~ 3.6 V
- Operating temperature: -40 to 85 °C
- Minimum current delivered by power supply: 0.5 A
Absolute Maximum Ratings:
- Max supply voltage: 3.6 V
- Max cumulative IO output current: 1100 mA
- Max storage temperature: 150 °C
Key Specs:
- Pin capacitance: 2 pF (Typ)
- High-level input current: 50 nA (Max)
- Low-level input current: 50 nA (Max)
- High-level source current (VDD3P3_CPU/RTC power domain): 40 mA (Typ, VDD = 3.3 V, VOH >= 2.64 V)
- Low-level sink current: 28 mA (Typ, VDD = 3.3 V, VOL = 0.495 V)
- Resistance of internal pull-up resistor: 45 kΩ (Typ)
- Resistance of internal pull-down resistor: 45 kΩ (Typ)
- Wi-Fi operating frequency range: 2412–2484 MHz
Features:
- Integrated 4-MB SPI flash
- Integrated 40 MHz crystal oscillator
- Wi-Fi 802.11 b/g/n (up to 150 Mbps)
- Bluetooth V4.2 BR/EDR and Bluetooth LE specification
- Dual Xtensa® 32-bit LX6 microprocessors
- 520 KB on-chip SRAM, 448 KB ROM
- ADC, DAC, touch sensor, SD/SDIO/MMC Host Controller, SPI, SDIO/SPI Slave Controller, EMAC, motor PWM, LED PWM, UART, I2C, I2S, infrared remote controller, GPIO, pulse counter
- Hall sensor
Applications:
- Wearable electronics
- Medical equipment
- Sensors
- IoT products
Package:
- (7.000±0.100) mm × (7.000±0.100) mm × (0.940±0.100) mm
Pin Configuration
The ESP32-PICO-D4 module has 48 pins. See pin definitions in Table 2.
Table 2: Pin Description
| Name | No. | Type | Function |
|---|---|---|---|
| VDDA | 1 | P | Analog power supply (2.3 V ~ 3.6 V) |
| LNA_IN | 2 | I/O | RF input and output |
| VDDA3P3 | 3 | P | Analog power supply (2.3 V ~ 3.6 V) |
| VDDA3P3 | 4 | P | Analog power supply (2.3 V ~ 3.6 V) |
| SENSOR_VP | 5 | I | GPIO36, ADC1_CH0, RTC_GPIO0 |
| SENSOR_CAPP | 6 | I | GPIO37, ADC1_CH1, RTC_GPIO1 |
| SENSOR_CAPN | 7 | I | GPIO38, ADC1_CH2, RTC_GPIO2 |
| SENSOR_VN | 8 | I | GPIO39, ADC1_CH3, RTC_GPIO3 |
Table 2: Pin Description
| Name | No. | Type | Function |
|---|---|---|---|
| EN | 9 | I | High: On; enables the module Low: Off; the module powers off Note: Do not leave this pin floating. |
| IO34 | 10 | I | ADC1_CH6, RTC_GPIO4 |
| IO35 | 11 | I | ADC1_CH7, RTC_GPIO5 |
| IO32 | 12 | I/O | 32K_XP (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 |
| IO33 | 13 | I/O | 32K_XN (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8 |
| IO25 | 14 | I/O | GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 |
| IO26 | 15 | I/O | GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 |
| IO27 | 16 | I/O | GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV |
| IO14 | 17 | I/O | ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 |
| IO12 | 18 | I/O | ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 |
| VDD3P3_RTC | 19 | P | Input power supply for RTC IO (3.0 V ~ 3.6 V) |
| IO13 | 20 | I/O | ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER |
| IO15 | 21 | I/O | ADC2_CH3, TOUCH3, RTC_GPIO13, MTDO, HSPICS0, HS2_CMD, SD_CMD, EMAC_RXD3 |
| IO2 | 22 | I/O | ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 |
| IO0 | 23 | I/O | ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK |
| IO4 | 24 | I/O | ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER |
| IO16 | 25 | I/O | GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT |
| VDD_SDIO | 26 | P | Output power supply. See note 1 under the table. |
| IO17 | 27 | I/O | GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180 |
| SD2 | 28 | I/O | GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD |
| SD3 | 29 | I/O | GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD |
| CMD | 30 | I/O | GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS |
| CLK | 31 | I/O | GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS |
| SD0 | 32 | I/O | GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS |
| SD1 | 33 | I/O | GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS |
| IO5 | 34 | I/O | GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK |
| IO18 | 35 | I/O | GPIO18, VSPICLK, HS1_DATA7 |
| IO23 | 36 | I/O | GPIO23, VSPID, HS1_STROBE |
| VDD3P3_CPU | 37 | P | Input power supply for CPU IO (1.8 V ~ 3.6 V) |
| IO19 | 38 | I/O | GPIO19, VSPIQ, U0CTS, EMAC_TXD0 |
| IO22 | 39 | I/O | GPIO22, VSPIWP, U0RTS, EMAC_TXD1 |
| U0RXD | 40 | I/O | GPIO3, U0RXD, CLK_OUT2 |
| Name | No. | Type | Function |
| U0TXD | 41 | I/O | GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 |
| IO21 | 42 | I/O | GPIO21, VSPIHD, EMAC_TX_EN |
| VDDA | 43 | P | Analog power supply (2.3 V ~ 3.6 V) |
| XTAL_N_NC | 44 | - | NC |
| XTAL_P_NC | 45 | - | NC |
| VDDA | 46 | P | Analog power supply (2.3 V ~ 3.6 V) |
| CAP2_NC | 47 | - | NC |
| CAP1_NC | 48 | - | NC |
Electrical Characteristics
Table 6: DC Characteristics (3.3 V, 25 °C)
| Symbol | Parameter | Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| C IN | Pin capacitance | Pin capacitance | - | 2 | - | pF |
| V IH | High-level input voltage | High-level input voltage | 0.75×VDD 1 | - | VDD 1 +0.3 | V |
| V IL | Low-level input voltage | Low-level input voltage | -0.3 | - | 0.25×VDD 1 | V |
| I IH | High-level input current | High-level input current | - | - | 50 | nA |
| I IL | Low-level input current | Low-level input current | - | - | 50 | nA |
| V OH | High-level output voltage | High-level output voltage | 0.8×VDD 1 | - | - | V |
| V OL | Low-level output voltage | Low-level output voltage | - | - | 0.1×VDD 1 | V |
| I OH | High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum) | VDD3P3_CPU power domain 1 , 2 | - | 40 | - | mA |
| I OH | High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum) | VDD3P3_RTC power domain 1 , 2 | - | 40 | - | mA |
| I OH | High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum) | VDD_SDIO power domain 1 , 3 | - | 20 | - | mA |
| Symbol | Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| I OL | Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum) | - | 28 | - | mA |
| R PU | Resistance of internal pull-up resistor | - | 45 | - | k Ω |
| R PD | Resistance of internal pull-down resistor | - | 45 | - | k Ω |
| V IL _ nRST | Low-level input voltage of CHIP_PU to power off the chip | - | - | 0.6 | V |
Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions.
Table 4: Absolute Maximum Ratings
| Symbol | Parameter | Min | Max | Unit |
|---|---|---|---|---|
| VDD33 | Power supply voltage | -0.3 | 3.6 | V |
| I output 1 | Cumulative IO output current | - | 1100 | mA |
| T store | Storage temperature | -40 | 150 | °C |
Recommended Operating Conditions
Table 5: Recommended Operating Conditions
| Symbol | Parameter | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| VDD33 | Power supply voltage | 3 | 3.3 | 3.6 | V |
| I VDD | Current delivered by external power supply | 0.5 | - | - | A |
| T | Operating temperature | -40 | - | 85 | °C |
Package Information
Figure 7: ESP32-PICO-D4 Package
Ordering Information
| MPN | Package | Temperature Range | Packing |
|---|---|---|---|
| ESP32-PICO-D4 | System-in-Package (SiP) module, 7.000x7.000x0.940 mm (nominal) | -40 °C ~ 85 °C | null |
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| ESP32 | Espressif Systems | ESP32-WROOM-32E (18.0 x 25.5 x 3.1 mm) |
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