Overview

Part: ESP32-C3-MINI-1 / ESP32-C3-MINI-1U from Espressif

Type: Smallsized 2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 module

Key Specs:

CPU: 32-bit RIS

Features

CPU and OnChip Memory

ESP32-C3FH4 or ESP32-C3FN4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz
384 KB ROM
400 KB SRAM (16 KB for cache)
8 KB SRAM in RTC
4 MB embedded flash

WiFi

IEEE 802.11 b/g/n-compliant
Center frequency range of operating channel: 2412 ~ 2484 MHz
Supports 20 MHz, 40 MHz bandwidth in 2.4 GHz band
1T1R mode with data rate up to 150 Mbps
Wi-Fi Multimedia (WMM)
TX/RX A-MPDU, TX/RX A-MSDU
Immediate Block ACK
Fragmentation and defragmentation
Transmit opportunity (TXOP)
Automatic Beacon monitoring (hardware TSF)
4 × virtual Wi-Fi interfaces
Simultaneous support for Infrastructure BSS in Station mode, SoftAP mode, Station + SoftAP mode, and promiscuous mode

Note that when ESP32-C3 series scans in Station mode, the SoftAP channel will change along with

the Station channel

Antenna diversity
802.11mc FTM

Applications

Smart Home
- Light control
- Smart button
- Smart plug
- Indoor positioning
Industrial Automation
- Industrial robot
- Mesh network
- Human machine interface (HMI)
- Industrial field bus
Health Care
- Health monitor
- Baby monitor
Consumer Electronics
- Smart watch and bracelet
- Over-the-top (OTT) devices
Wi-Fi and bluetooth speaker
Logger toys and proximity sensing toys
Smart Agriculture
- Smart greenhouse
- Smart irrigation
- Agriculture robot
Retail and Catering
- POS machines
- Service robot
Audio Device
- Internet music players
- Live streaming devices
- Internet radio players
Generic Low-power IoT Sensor Hubs
Generic Low-power IoT Data Loggers

Pin Configuration

The module has 53 pins. See pin definitions in Table 2.

For peripheral pin configurations, please refer to ESP32-C3 Series Datasheet.

Table 2: Pin Definitions

Name	No.	Type ¹	Function
GND	1, 2, 11, 14, 36-53	P	Ground
3V3	3	P	Power supply

Cont'd on next page

Name No. Type¹ Function NC 4, 7, 9, 10, 15, 17, 24, 25, 28, 29, 32-35 — NC IO2 5 I/O/T GPIO2, ADC1_CH2, FSPIQ IO3 6 I/O/T GPIO3, ADC1_CH3 EN 8 I High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the EN pin floating. IO0 12 I/O/T GPIO0, ADC1_CH0, XTAL_32K_P IO1 13 I/O/T GPIO1, ADC1_CH1, XTAL_32K_N IO10 16 I/O/T GPIO10, FSPICS0 IO4 18 I/O/T GPIO4, ADC1_CH4, FSPIHD, MTMS IO5 19 I/O/T GPIO5, ADC2_CH0, FSPIWP, MTDI IO6 20 I/O/T GPIO6, FSPICLK, MTCK IO7 21 I/O/T GPIO7, FSPID, MTDO IO8 22 I/O/T GPIO8 IO9 23 I/O/T GPIO9 IO18 26 I/O/T GPIO18, USB_D-IO19 27 I/O/T GPIO19, USB_D+ RXD0 30 I/O/T GPIO20, U0RXD TXD0 31 I/O/T GPIO21, U0TXD

Table 2 – cont'd from previous page

Electrical Characteristics

4.1 Absolute Maximum Ratings

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Table 5: Absolute Maximum Ratings

Symbol	Parameter	Min	Max	Unit
VDD33	Power supply voltage	–0.3	3.6	V
TST ORE	Storage temperature	–40	105	°C

4.2 Recommended Operating Conditions

Table 6: Recommended Operating Conditions

| Symbol | Parameter | Min | Typ | Max | Unit | |----------|-------------------------------------------------------|---------------|-----|-----|------|----| | VDD33 | Power supply voltage | | 3.0 | 3.3 | 3.6 | V | | IV DD | Current delivered by external power supply | | 0.5 | — | — | A | | | | 85 °C version | | | 85 | | | TA
Operating ambient temperature
105 °C version | | –40 | — | 105 | °C | | Humidity | Humidity condition | — | — | 85 | %RH |

4.3 DC Characteristics (3.3 V, 25 °C)

Table 7: DC Characteristics (3.3 V, 25 °C)

Symbol	Parameter	Min	Typ	Max	Unit
CIN	Pin capacitance	—	2	—	pF
VIH	High-level input voltage	0.75 × VDD1	—	VDD1+ 0.3	V
VIL	Low-level input voltage	–0.3	—	0.25 × VDD1	V
IIH	High-level input current	—	—	50	nA
IIL	Low-level input current	—	—	50	nA
2 VOH	High-level output voltage	0.8 × VDD1	—	—	V
2 VOL	Low-level output voltage	—	—	0.1 × VDD1	V
	High-level source current (VDD1= 3.3 V,
IOH	VOH >= 2.64 V, PAD_DRIVER = 3)	—	40	—	mA
	Low-level sink current (VDD1= 3.3 V, VOL =
IOL	0.495 V, PAD_DRIVER = 3)	—	28	—	mA
RP U	Pull-up resistor	—	45	—	kΩ
RPD	Pull-down resistor	—	45	—	kΩ
VIH_nRST	Chip reset release voltage	0.75 × VDD1	—	VDD1+ 0.3	V

Cont'd on next page

Table 7 – cont'd from previous page

Symbol	Parameter	Min	Typ	Max	Unit
VIL_nRST	Chip reset voltage	–0.3	—	0.25 × VDD1	V

¹ VDD is the I/O voltage for a particular power domain of pins.

4.4 Current Consumption Characteristics

With the use of advanced power-management technologies, the module can switch between different power modes. For details on different power modes, please refer to Section Low Power Management in ESP32-C3 Series Datasheet.

Table 8: Current Consumption Depending on RF Modes

Work mode	Description		Peak (mA)
		802.11b, 1 Mbps, @20.5 dBm	350
		802.11g, 54 Mbps, @18 dBm	295
	TX	802.11n, HT20, MCS7, @17.5 dBm	290
Active (RF working)		802.11n, HT40, MCS7, @17 dBm	290
		802.11b/g/n, HT20	82
	RX	802.11n, HT40	84

¹ The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF port. All transmitters' measurements are based on a 100% duty cycle.

Table 9: Current Consumption Depending on Work Modes

Work mode	Description			Unit
	The CPU is	160 MHz	20	mA
Modem-sleep1, 2	powered on3	80 MHz	15	mA
Light-sleep	—			µA
Deep-sleep	RTC timer + RTC memory		5	µA
Power off		CHIP_PU is set to low level, the chip is powered off		µA

¹ The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on and the cache idle.

² VOH and VOL are measured using high-impedance load.

² The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle.

² When Wi-Fi is enabled, the chip may switch between Active and Modem-sleep modes. Therefore, current consumption changes accordingly.

³ In practice, software can adjust CPU's frequency according to CPU load to reduce current consumption.

4.5 WiFi Radio

4.5.1 WiFi RF Standards

Table 10: WiFi RF Standards

| Name | | Description | |-----------------------------------------------|--------|--------------------------------------------|--| | Center frequency range of operating channel 1 | | 2412 ~ 2484 MHz | | Wi-Fi wireless standard | | IEEE 802.11b/g/n | | | | 11b: 1, 2, 5.5 and 11 Mbps | | | 20 MHz | 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps | | Data rate | | 11n: MCS0-7, 72.2 Mbps (Max) | | | 40 MHz | 11n: MCS0-7, 150 Mbps (Max) | | Antenna type | | PCB antenna and external antenna connector | ¹ Device should operate in the center frequency range allocated by regional regulatory authorities. Target center frequency range is configurable by software.

4.5.2 WiFi RF Transmitter (TX) Specifications

Target TX power is configurable based on device or certification requirements. The default characteristics are provided in Table 11.

Table 11: TX Power with Spectral Mask and EVM Meeting 802.11 Standards

	Min	Typ	Max
Rate	(dBm)	(dBm)	(dBm)
802.11b, 1 Mbps	—	20.5	—
802.11b, 11 Mbps	—	20.5	—
802.11g, 6 Mbps	—	20.0	—
802.11g, 54 Mbps	—	18.0	—
802.11n, HT20, MCS0	—	19.0	—
802.11n, HT20, MCS7	—	17.5	—
802.11n, HT40, MCS0	—	18.5	—
802.11n, HT40, MCS7	—	17.0	—

Table 12: TX EVM Test

	Min	Typ	SL1
Rate	(dB)	(dB)	(dB)
802.11b, 1 Mbps, @20.5 dBm	—	–24.5	–10
802.11b, 11 Mbps, @20.5 dBm	—	–25.0	–10
802.11g, 6 Mbps, @20 dBm	—	–23.0	–5
802.11g, 54 Mbps, @18 dBm	—	–28.0	–25
802.11n, HT20, MCS0, @19 dBm	—	–23.5	–5
802.11n, HT20, MCS7, @17.5 dBm	—	–30.5	–27

Cont'd on next page

Table 12 – cont'd from previous page

Rate	Min (dB)	Typ (dB)	SL1 (dB)
802.11n, HT40, MCS0, @18.5 dBm	—	–26.5	–5
802.11n, HT40, MCS7, @17 dBm	—	–30.5	–27

¹ SL stands for standard limit value.

4.5.3 WiFi RF Receiver (RX) Specifications

Table 13: RX Sensitivity

	Min	Typ	Max
Rate	(dBm)	(dBm)	(dBm)
802.11b, 1 Mbps	—	–98.0	—
802.11b, 2 Mbps	—	–96.0	—
802.11b, 5.5 Mbps	—	–93.0	—
802.11b, 11 Mbps	—	–88.6	—
802.11g, 6 Mbps	—	–92.8	—
802.11g, 9 Mbps	—	–91.8	—
802.11g, 12 Mbps	—	–90.8	—
802.11g, 18 Mbps	—	–88.4	—
802.11g, 24 Mbps	—	–85.4	—
802.11g, 36 Mbps	—	–82.0	—
802.11g, 48 Mbps	—	–77.8	—
802.11g, 54 Mbps	—	–76.2	—
802.11n, HT20, MCS0	—	–92.6	—
802.11n, HT20, MCS1	—	–90.6	—
802.11n, HT20, MCS2	—	–88.0	—
802.11n, HT20, MCS3	—	–84.8	—
802.11n, HT20, MCS4	—	–81.6	—
802.11n, HT20, MCS5	—	–77.4	—
802.11n, HT20, MCS6	—	–75.6	—
802.11n, HT20, MCS7	—	–74.4	—
802.11n, HT40, MCS0	—	–90.0	—
802.11n, HT40, MCS1	—	–87.6	—
802.11n, HT40, MCS2	—	–84.8	—
802.11n, HT40, MCS3	—	–81.8	—
802.11n, HT40, MCS4	—	–78.4	—
802.11n, HT40, MCS5	—	–74.2	—
802.11n, HT40, MCS6	—	–72.6	—
802.11n, HT40, MCS7	—	–71.2	—

Table 14: Maximum RX Level

	Min	Typ	Max
Rate	(dBm)	(dBm)	(dBm)
802.11b, 1 Mbps	—	5	—
802.11b, 11 Mbps	—	5	—
802.11g, 6 Mbps	—	5	—
802.11g, 54 Mbps	—	0	—
802.11n, HT20, MCS0	—	5	—
802.11n, HT20, MCS7	—	0	—
802.11n, HT40, MCS0	— 5		—
802.11n, HT40, MCS7	—	0	—

Table 15: RX Adjacent Channel Rejection

	Min	Typ	Max
Rate	(dB)	(dB)	(dB)
802.11b, 1 Mbps	—	35	—
802.11b, 11 Mbps	—	35	—
802.11g, 6 Mbps	—	31	—
802.11g, 54 Mbps	—	14	—
802.11n, HT20, MCS0	—	31	—
802.11n, HT20, MCS7	—	13	—
802.11n, HT40, MCS0	—	19	—
802.11n, HT40, MCS7	—	8	—

4.6 Bluetooth LE Radio

4.6.1 Bluetooth LE RF Transmitter (TX) Specifications

Table 16: Transmitter General Characteristics

Parameter	Min	Typ	Max	Unit
RF transmit power	—	0	—	dBm
Gain control step	—	3	—	dB
RF power control range	–27	—	18	dBm

Table 17: Transmitter Characteristics Bluetooth LE 1 Mbps

Parameter	Description	Min	Typ	Max	Unit
	F = F0 ± 2 MHz	—	–37.62	—	dBm
In-band emissions	F = F0 ± 3 MHz	—	–41.95	—	dBm
F = F0 ± > 3 MHz ∆ f1avg Modulation characteristics ∆ f2max ∆ f2avg/∆ f1avg Carrier frequency offset — f0 − fn n=2, Carrier frequency drift f1 − f0		—	–44.48	—	dBm
		—	245.00	—	kHz
		—	208.00	—	kHz
		—	0.93	—	—
		—	–9.00	—	kHz
	3, 4,k	—	1.17	—	kHz
		—	0.30	—	kHz
	fn − fn−5 n=6, 7, 8,k	—	4.90	—	kHz

Table 18: Transmitter Characteristics Bluetooth LE 2 Mbps

Parameter	Description	Min	Typ	Max	Unit
	F = F0 ± 4 MHz	—	–43.55	—	dBm
In-band emissions	F = F0 ± 5 MHz	—	–45.26	—	dBm
	F = F0 ± > 5 MHz	—	–47.00	—	dBm
	∆ f1avg	—	497.00	—	kHz
Modulation characteristics	∆ f2max	—	398.00	—	kHz
	∆ f2avg/∆ f1avg	—	0.95	—	—
Carrier frequency offset	—	—	–9.00	—	kHz
	f0 − fn n=2, 3, 4,k	—	0.46	—	kHz
Carrier frequency drift	f1 − f0	—	0.70	—	kHz
	fn − fn−5 n=6, 7, 8,k	—	6.80	—	kHz

Table 19: Transmitter Characteristics Bluetooth LE 125 Kbps

Parameter	Description	Min	Typ	Max	Unit
	F = F0 ± 2 MHz	—	–37.90	—	dBm
In-band emissions Modulation characteristics	F = F0 ± 3 MHz	—	–41.00	—	dBm
	F = F0 ± > 3 MHz	—	–42.50	—	dBm
	∆ f1avg	—	252.00	—	kHz
	∆ f1max	—	200.00	—	kHz
Carrier frequency offset	—	—	–13.70	—	kHz
	f0 − fn n=1, 2, 3,k	—	1.52	—	kHz
Carrier frequency drift	f0 − f3	—	0.65	—	kHz
	fn − fn−3 n=7, 8, 9,k	—	0.70	—	kHz

Table 20: Transmitter Characteristics Bluetooth LE 500 Kbps

Parameter	Description	Min	Typ	Max	Unit
In-band emissions	F = F0 ± 2 MHz	—	–37.90	—	dBm
	F = F0 ± 3 MHz	—	–41.30	—	dBm
	F = F0 ± > 3 MHz	—	–42.80	—	dBm
	∆ f2avg	—	220.00	—	kHz
Modulation characteristics	∆ f2max	—	205.00	—	kHz
Carrier frequency offset	—	—	–11.90	—	kHz
	f0 − fn n=1, 2, 3,k	—	1.37	—	kHz
Carrier frequency drift	f0 − f3	—	1.09	—	kHz
	fn − fn−3 n=7, 8, 9,k	—	0.51	—	kHz

4.6.2 Bluetooth LE RF Receiver (RX) Specifications

Table 21: Receiver Characteristics Bluetooth LE 1 Mbps

Parameter	Description	Min	Typ	Max	Unit
Sensitivity @30.8% PER	—	—	–96	—	dBm
Maximum received signal @30.8% PER	—	—	10	—	dBm
Co-channel C/I	—	—	8	—	dB
	F = F0 + 1 MHz	—	–4	—	dB
	F = F0 – 1 MHz	—	–3	—	dB
	F = F0 + 2 MHz	—	–32	—	dB
Adjacent channel selectivity C/I	F = F0 – 2 MHz	—	–36	—	dB
	F ≥ F0 + 3 MHz(1)	—	—	—	dB
	F ≤ F0 – 3 MHz	—	–39	—	dB
Image frequency	—	—	–29	—	dB
	F = Fimage + 1 MHz	—	–38	—	dB
Adjacent channel to image frequency	F = Fimage – 1 MHz	—	–34	—	dB
	30 MHz ~ 2000 MHz	—	–9	—	dBm
	2003 MHz ~ 2399 MHz	—	–18	—	dBm
Out-of-band blocking performance	2484 MHz ~ 2997 MHz	—	–16	—	dBm
	3000 MHz ~ 12.75 GHz	—	–6	—	dBm
Intermodulation	—	—	–44	—	dBm

¹ Refer to the value of Adjacent channel to image frequency when F = Fimage – 1 MHz.

Table 22: Receiver Characteristics Bluetooth LE 2 Mbps

Parameter	Description	Min	Typ	Max	Unit
Sensitivity @30.8% PER	—	—	–93	—	dBm
Maximum received signal @30.8% PER	—	—	0	—	dBm
Co-channel C/I	—	—	10	—	dB
	F = F0 + 2 MHz	—	–7	—	dB
	F = F0 – 2 MHz	—	–7	—	dB
	F = F0 + 4 MHz(1)	—	—	—	dB
Adjacent channel selectivity C/I	F = F0 – 4 MHz	—	–34	—	dB
	F ≥ F0 + 6 MHz	—	–39	—	dB
	F ≤ F0 – 6 MHz	—	–39	—	dB
Image frequency	—	—	–27	—	dB
	F = Fimage + 2 MHz	—	–39	—	dB
Adjacent channel to image frequency	– 2 MHz(2) F = Fimage	—	—	—	dB
	30 MHz ~ 2000 MHz	—	–17	—	dBm
	2003 MHz ~ 2399 MHz	—	–19	—	dBm
Out-of-band blocking performance	2484 MHz ~ 2997 MHz	—	–16	—	dBm
	3000 MHz ~ 12.75 GHz	—	–22	—	dBm
Intermodulation	—	—	–40	—	dBm

¹ Refer to the value of Image frequency.

Table 23: Receiver Characteristics Bluetooth LE 125 Kbps

Parameter	Description	Min	Typ	Max	Unit
Sensitivity @30.8% PER	—	—	–104	—	dBm
Maximum received signal @30.8% PER	—	—	10	—	dBm
Co-channel C/I	—	—	2	—	dB
	F = F0 + 1 MHz	—	–6	—	dB
	F = F0 – 1 MHz	—	–5	—	dB
	F = F0 + 2 MHz	—	–40	—	dB
Adjacent channel selectivity C/I	F = F0 – 2 MHz	—	–42	—	dB
	F ≥ F0 + 3 MHz(1)	—	—	—	dB
	F ≤ F0 – 3 MHz	—	–46	—	dB
Image frequency	—	—	–34	—	dB
	F = Fimage + 1 MHz	—	–44	—	dB
Adjacent channel to image frequency	F = Fimage – 1 MHz	—	–37	—	dB

¹ Refer to the value of Adjacent channel to image frequency when F = Fimage – 1 MHz.

Table 24: Receiver Characteristics Bluetooth LE 500 Kbps

Parameter	Description	Min	Typ	Max	Unit
Sensitivity @30.8% PER	—	—	–99	—	dBm

Cont'd on next page

² Refer to the value of Adjacent channel selectivity C/I when F = F0 + 2 MHz.

Table 24 – cont'd from previous page

Parameter	Description	Min	Typ	Max	Unit
Maximum received signal @30.8% PER	—	—	10	—	dBm
Co-channel C/I	—		3	—	dB
Adjacent channel selectivity C/I	F = F0 + 1 MHz	—	–5	—	dB
	F = F0 – 1 MHz	—	–7	—	dB
	F = F0 + 2 MHz	—	–39	—	dB
	F = F0 – 2 MHz	—	–40	—	dB
	F ≥ F0 + 3 MHz(1)	—	—	—	dB
	F ≤ F0 – 3 MHz	—	–40	—	dB
Image frequency	—	—	–34	—	dB
Adjacent channel to image frequency	F = Fimage + 1 MHz	—	–43	—	dB
	F = Fimage – 1 MHz	—	–38	—	dB

¹ Refer to the value of Adjacent channel to image frequency when F = Fimage – 1 MHz.

5 Module Schematics

This is the reference design of the module.

S

Module Schematics

Figure 5: ESP32-C3-MINI-1 Schematics

5

Figure 6: ESP32-C3-MINI-1U Schematics

6 Peripheral Schematics

This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface).

Figure 7: Peripheral Schematics

Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal performance. If you choose to solder it, please apply the correct amount of soldering paste.
• To ensure that the power supply to the ESP32-C3 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 k $\Omega$ and C = 1 $\mu$ F. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32-C3's power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP32-C3 Series Datasheet.

Absolute Maximum Ratings

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Table 5: Absolute Maximum Ratings

Symbol	Parameter	Min	Max	Unit
VDD33	Power supply voltage	–0.3	3.6	V
TST ORE	Storage temperature	–40	105	°C

Recommended Operating Conditions

Table 6: Recommended Operating Conditions

| Symbol | Parameter | Min | Typ | Max | Unit | |----------|-------------------------------------------------------|---------------|-----|-----|------|----| | VDD33 | Power supply voltage | | 3.0 | 3.3 | 3.6 | V | | IV DD | Current delivered by external power supply | | 0.5 | — | — | A | | | | 85 °C version | | | 85 | | | TA
Operating ambient temperature
105 °C version | | –40 | — | 105 | °C | | Humidity | Humidity condition | — | — | 85 | %RH |

ESP32-C3-MINI-1-N4

Overview

Features

CPU and OnChip Memory

WiFi

Applications

Pin Configuration

Electrical Characteristics

4.1 Absolute Maximum Ratings

4.2 Recommended Operating Conditions

4.3 DC Characteristics (3.3 V, 25 °C)

4.4 Current Consumption Characteristics

4.5 WiFi Radio

4.5.1 WiFi RF Standards

4.5.2 WiFi RF Transmitter (TX) Specifications

4.5.3 WiFi RF Receiver (RX) Specifications

4.6 Bluetooth LE Radio

4.6.1 Bluetooth LE RF Transmitter (TX) Specifications

4.6.2 Bluetooth LE RF Receiver (RX) Specifications

5 Module Schematics

6 Peripheral Schematics

Absolute Maximum Ratings

Recommended Operating Conditions