ESP32-C3
Ultra-Low-Power SoC with RISC-V Single-Core CPUThe ESP32-C3 is a ultra-low-power soc with risc-v single-core cpu from Espressif Systems. View the full ESP32-C3 datasheet below including key specifications, pinout, electrical characteristics, absolute maximum ratings.
ESP32-C3 shares its datasheet with ESP32-C3-WROOM-02-H4, whose page lists every part number it covers.
Official ESP32-C3 datasheet (PDF) — the source this page was extracted from.
Manufacturer
Espressif SystemsCategory
Ultra-Low-Power SoC with RISC-V Single-Core CPU
Package
32-VFQFN Exposed Pad
Lifecycle
Active
ESP32-C3 Key Specifications
| Parameter | Value |
|---|---|
| Antenna Type | Antenna Not Included |
| Current - Receiving | 84mA ~ 87mA |
| Current - Transmitting | 276mA ~ 335mA |
| Data Rate | 54Mbps |
| DigiKey Programmable | Not Verified |
| Frequency | 2.402GHz ~ 2.48GHz |
| Memory Size | 400kB SRAM, 384kB ROM |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Package / Case | 32-VFQFN Exposed Pad |
| Packaging | Cut Tape |
| Power - Output | 21dBm |
| Protocol | 802.11b/g/n, Bluetooth v5.0 |
| RF Family/Standard | Bluetooth, WiFi |
| Sensitivity | -105dBm |
| Serial Interfaces | GPIO, I2C, I2S, SPI, JTAG, UART, USB |
| Standard Pack Qty | 5000 |
| Supply Voltage | 3V ~ 3.6V |
ESP32-C3 Overview
Part: ESP32-C3-WROOM-02-H4 — Espressif Systems
Type: Wi-Fi and Bluetooth LE Module (ESP32-C3 based)
Description: 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth 5 LE module built around the ESP32-C3 single-core 32-bit RISC-V CPU at up to 160 MHz, with 4 MB Quad SPI flash, 15 GPIOs and an on-board PCB antenna, rated for -40 to 105 °C ambient.
Operating Conditions:
- Supply voltage (VDD33): 3.0–3.6 V (3.3 V typ)
- Operating ambient temperature: -40 to 105 °C for the H4 variant (the N-variants are rated -40 to 85 °C)
- Current delivered by external power supply: 0.5 A min
Absolute Maximum Ratings:
- Max supply voltage (VDD33): 3.6 V (min -0.3 V)
- Storage temperature: -40 to 105 °C
Key Specs:
- CPU: 32-bit RISC-V single-core, up to 160 MHz
- Memory: 384 KB ROM, 400 KB SRAM (16 KB for cache), 8 KB RTC SRAM
- Flash: 4 MB Quad SPI (default max flash clock 80 MHz)
- Wi-Fi: IEEE 802.11b/g/n, 2412–2484 MHz, 1T1R, up to 150 Mbps, 20/40 MHz bandwidth
- Bluetooth LE 5 with 125 Kbps, 500 Kbps, 1 Mbps and 2 Mbps rates; Bluetooth mesh
- GPIOs: up to 15
- Module size: 18.0 × 20.0 × 3.2 mm
- Embedded chip revision: v0.4
- Strapping pin hold time (tH): 3 ms min
Features:
- On-board PCB antenna (the -02U variant uses an external antenna connector)
- Integrated 40 MHz crystal oscillator and SPI flash
- Peripherals: SPI, UART, I2C, I2S, remote control, LED PWM, general DMA, TWAI (ISO 11898-1 compatible), USB Serial/JTAG, temperature sensor, SAR ADC, timers, watchdogs
- Wi-Fi: WMM, A-MPDU/A-MSDU, 4 virtual interfaces, Station/SoftAP/Station+SoftAP/promiscuous modes, 802.11mc FTM
- Bluetooth LE: advertising extensions, multiple advertisement sets, channel selection algorithm #2
- Internal Wi-Fi/Bluetooth coexistence sharing the same antenna
- RoHS/REACH green certification
Applications:
- Smart home
- Industrial automation
- Health care
- Consumer electronics
- Smart agriculture
- POS machines
- Service robots
- Audio devices
- Low-power IoT sensor hubs
- Low-power IoT data loggers
Package:
- Module with 19 pins, 18.0 × 20.0 × 3.2 mm (ESP32-C3-WROOM-02 series)
ESP32-C3 Features
- Supports Single SPI, Dual SPI, and Quad SPI, QPI modes
- Configurable clock frequency with a maximum of 120 MHz in Single Transfer Rate (STR) mode
- Data transmission is in bytes
ESP32-C3 Applications
- Smart Home
- Industrial Automation
- Health Care
- Consumer Electronics
- Smart Agriculture
- POS Machines
- Service Robot
- Audio Devices
- Generic Low-power IoT Sensor Hubs
- Generic Low-power IoT Data Loggers
ESP32-C3 Pin Configuration
ESP32-C3FN4 Pinout
Package: 32-VFQFN Exposed Pad
| Pin Number | Pin Name | Type | Function |
|---|---|---|---|
| 1 | GND | P | Ground |
| 2 | GND | P | Ground |
| 3 | 3V3 | P | Power supply |
| 4 | NC | – | No Connect |
| 5 | IO2 | I/O/T | GPIO2, ADC1_CH2, FSPIQ |
| 6 | IO3 | I/O/T | GPIO3, ADC1_CH3 |
| 7 | NC | – | No Connect |
| 8 | EN | I | High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the EN pin floating. |
| 9 | NC | – | No Connect |
| 10 | NC | – | No Connect |
| 11 | GND | P | Ground |
| 12 | IO0 | I/O/T | GPIO0, ADC1_CH0, XTAL_32K_P |
| 13 | IO1 | I/O/T | GPIO1, ADC1_CH1, XTAL_32K_N |
| 14 | GND | P | Ground |
| 15 | NC | – | No Connect |
| 16 | IO10 | I/O/T | GPIO10, FSPICS0 |
| 17 | NC | – | No Connect |
| 18 | IO4 | I/O/T | GPIO4, ADC1_CH4, FSPIHD, MTMS |
| 19 | IO5 | I/O/T | GPIO5, ADC2_CH0, FSPIWP, MTDI |
| 20 | IO6 | I/O/T | GPIO6, FSPICLK, MTCK |
| 21 | IO7 | I/O/T | GPIO7, FSPID, MTDO |
| 22 | IO8 | I/O/T | GPIO8 |
| 23 | IO9 | I/O/T | GPIO9 |
| 24 | NC | – | No Connect |
| 25 | NC | – | No Connect |
| 26 | IO18 | I/O/T | GPIO18, USB_D− |
| 27 | IO19 | I/O/T | GPIO19, USB_D+ |
| 28 | NC | – | No Connect |
| 29 | NC | – | No Connect |
| 30 | RXD0 | I/O/T | GPIO20, U0RXD |
| 31 | TXD0 | I/O/T | GPIO21, U0TXD |
| 32 | NC | – | No Connect |
| 33 | NC | – | No Connect |
| 34 | NC | – | No Connect |
| 35 | NC | – | No Connect |
| 36–53 | GND | P | Ground |
Notes
- The datasheet states the module has 53 pins total; pins 36–53 are all GND (ground).
- Pin numbers are sourced directly from Table 2 in the datasheet ("No." column).
- Type "P" denotes power/ground pins; "I" denotes input; "I/O/T" denotes GPIO with input/output and 3.3V tolerance.
- EN pin (pin 8) must not be left floating.
- USB pins (IO18/IO19) support USB D−/D+ signaling.
ESP32-C3 Electrical Characteristics
Table 6-3. DC Characteristics (3.3 V, 25 °C)
| Parameter | Description | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| C IN | Pin capacitance | - | 2 | - | pF |
| V IH | High-level input voltage | 0.75 × VDD 1 | - | VDD 1 + 0.3 | V |
| V IL | Low-level input voltage | -0.3 | - | 0.25 × VDD 1 | V |
| I IH | High-level input current | - | - | 50 | nA |
| I IL | Low-level input current | - | - | 50 | nA |
| V OH 2 | High-level output voltage | 0.8 × VDD 1 | - | - | V |
| V OL 2 | Low-level output voltage | - | - | 0.1 × VDD 1 | V |
| I OH | High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3) | - | 40 | - | mA |
| I OL | Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3) | - | 28 | - | mA |
| R PU | Internal weak pull-up resistor | - | 45 | - | k Ω |
| R PD | Internal weak pull-down resistor | - | 45 | - | k Ω |
| V IH _ nRST | Chip reset release voltage CHIP_EN voltage is within the specified range) | 0.75 × VDD 1 | - | VDD 1 + 0.3 | V |
| V IL _ nRST | Chip reset voltage (CHIP_EN voltage is within the specified range) | -0.3 | - | 0.25 × VDD 1 | V |
|---|
ESP32-C3 Absolute Maximum Ratings
Stresses above those listed in T able 6-1 Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under T able 6-2 Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Table 6-1. Absolute Maximum Ratings
| Symbol | Parameter | Min | Max | Unit |
|---|---|---|---|---|
| VDD33 | Power supply voltage | -0.3 | 3.6 | V |
| T STORE | Storage temperature | -40 | 105 | °C |
ESP32-C3 Recommended Operating Conditions
Table 6-2. Recommended Operating Conditions
| Symbol | Parameter | Min Typ | Max | Unit | ||
|---|---|---|---|---|---|---|
| VDD33 | Power supply voltage | Power supply voltage | 3.0 | 3.3 | 3.6 | V |
| I VDD | Current delivered by external power supply | Current delivered by external power supply | 0.5 | - | - | A |
| T A | Operating ambient temperature | 85 °C version 105 °C version | -40 | - | 85 105 | °C |
ESP32-C3 Package Information
This section provides the following resources for your reference:
- Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 11-1 ESP32-C3-WROOM-02 Recommended PCB Land Pattern and Figure 11-2 ESP32-C3-WROOM-02U Recommended PCB Land Pattern .
- Source files of recommended PCB land patterns to measure dimensions not covered in Figure 11-1 and Figure 11-2. You can view the source files for ESP32-C3-WROOM-02 and ESP32-C3-WROOM-02U with Autodesk Viewer.
- 3D models of ESP32-C3-WROOM-02 and ESP32-C3-WROOM-02U. Please make sure that you download the 3D model file in .STEP format. Beware that some browsers might add .txt.
Figure 11-1. ESP32-C3-WROOM-02 Recommended PCB Land Pattern
Figure 11-2. ESP32-C3-WROOM-02U Recommended PCB Land Pattern
Variants on the same datasheet
These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.
| Part Number | Manufacturer | Package |
|---|---|---|
| ESP32 | Espressif Systems | ESP32-WROOM-32E (18.0 x 25.5 x 3.1 mm) |
| ESP32-C3-WROOM-02-H4 | Espressif Systems | 32-SMD Module |
| ESP32-C3-WROOM-02-N4 | Espressif Systems | 19-SMD Module |
| ESP32-C3FH4 | Espressif Systems | 32-VFQFN Exposed Pad |
| ESP32-C3FN4 | Espressif Systems | 32-VFQFN Exposed Pad |
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