EFR32MG1P232F256GM32
The EFR32MG1P232F256GM32 is an electronic component from Silicon Labs. View the full EFR32MG1P232F256GM32 datasheet below including electrical characteristics, absolute maximum ratings.
Manufacturer
Silicon Labs
Overview
Part: EFR32MG1 Mighty Gecko Multi-Protocol SoC Family — Silicon Labs Type: Multi-Protocol Wireless System-on-Chip (SoC) Description: Energy-friendly multi-protocol, multi-band SoC featuring a 32-bit ARM Cortex-M4 core at 40 MHz, 256 kB Flash, 32 kB RAM, and integrated radio supporting Zigbee, Thread, and Bluetooth Low Energy with up to 20 dBm TX power.
Operating Conditions:
- Supply voltage: 1.85 V to 3.8 V
- Operating temperature: -40 to +125 °C (Extended grade)
- Max operating frequency: 40 MHz (ARM Cortex-M4)
Absolute Maximum Ratings:
Key Specs:
- Core: 32-bit ARM Cortex-M4 with DSP and FPU
- Flash memory: 256 kB
- RAM data memory: 32 kB
- Max TX power (2.4 GHz): 19 dBm
- Max TX power (Sub-GHz): 20 dBm
- RX current (250 kbps, DSSS-OQPSK, 2.4 GHz): 9.8 mA
- EM2 DeepSleep current (4 kB RAM retention, RTCC): 2.2 μA
- Sensitivity (1 Mbit/s GFSK, 2.4 GHz): -92.5 dBm
- Sensitivity (600 bps, GFSK, 915 MHz): -126.4 dBm
Features:
- Integrated DC-DC converter
- Autonomous Hardware Crypto Accelerator and Random Number Generator
- 12-channel Peripheral Reflex System (PRS)
- 12-bit 1 Msps SAR Analog to Digital Converter (ADC)
- 2 × Universal Synchronous/Asynchronous Receiver/Transmitter (USART)
- I2C interface with SMBus support and address recognition in EM3 Stop
Applications:
- Connected Home
- Lighting
- Health and Wellness
- Metering
- Building Automation and Security
Package:
- QFN32 5x5 mm
- QFN48 7x7 mm
Electrical Characteristics
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
- Typical values are based on T AMB =25 °C and V DD = 3.3 V, by production test and/or technology characterization.
· Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna. · Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise. Refer to 4.1.2.1 General Operating Conditions for more details about operational supply and temperature limits. Not Recommended for New Designs
Absolute Maximum Ratings
Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Storage temperature range | T STG | -50 | - | 150 | °C | |
| Voltage on any supply pin | V DDMAX | -0.3 | - | 3.8 | V | |
| Voltage ramp rate on any supply pin | V DDRAMPMAX | - | - | 1 | V / μs | |
| DC voltage on any GPIO pin | V DIGPIN | 5V tolerant GPIO pins 1 2 3 | -0.3 | - New | Min of 5.25 and IOVDD +2 | V |
| DC voltage on any GPIO pin | V DIGPIN | Standard GPIO pins | -0.3 | - | IOVDD+0.3 | V |
| Voltage on HFXO pins | V HFXOPIN | -0.3 | - | 1.4 | V | |
| Input RF level on pins 2G4RF_IOP and 2G4RF_ION | P RFMAX2G4 | - | - | 10 | dBm | |
| Voltage differential between RF pins (2G4RF_IOP - 2G4RF_ION) | V MAXDIFF2G4 | for | -50 | - | 50 | mV |
| Absolute voltage on RF pins 2G4RF_IOP and 2G4RF_ION | V MAX2G4 | Recommended | -0.3 | - | 3.8 | V |
| Absolute voltage on Sub- GHz RF pins | V MAXSUBG | Pins SUBGRF_OP and SUBGRF_ON | -0.3 | - | 3.8 | V |
| Absolute voltage on Sub- GHz RF pins | V MAXSUBG | Pins SUBGRF_IP and SUBGRF_IN, | -0.3 | - | 0.3 | V |
| Total current into VDD power lines | I VDDMAX | Source | - | - | 200 | mA |
| Total current into VSS ground lines | I VSSMAX | Sink | - | - | 200 | mA |
| Current per I/O pin | I IOMAX | Sink | - | - | 50 | mA |
| Current per I/O pin | I IOMAX | Source | - | - | 50 | mA |
| Current for all I/O pins | I IOALLMAX | Sink | - | - | 200 | mA |
| Current for all I/O pins | I IOALLMAX | Source | - | - | 200 | mA |
| Junction temperature | T J | -G grade devices | -40 | - | 105 | °C |
| T J | -I grade devices | -40 | - | 125 | °C |
Parameter
Thermal Information
Table 4.3. Thermal Characteristics
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Thermal resistance, QFN48 Package | THETA JA_QFN48 | 2-Layer PCB, Air velocity = 0 m/s | - | 64.5 | - | °C/W |
| Thermal resistance, QFN48 Package | THETA JA_QFN48 | 2-Layer PCB, Air velocity = 1 m/s | - | 51.6 | - | °C/W Designs |
| Thermal resistance, QFN48 Package | THETA JA_QFN48 | 2-Layer PCB, Air velocity = 2 m/s | - | 47.7 | - | °C/W |
| Thermal resistance, QFN48 Package | THETA JA_QFN48 | 4-Layer PCB, Air velocity = 0 m/s | - | 26.2 | - | °C/W |
| Thermal resistance, QFN48 Package | THETA JA_QFN48 | 4-Layer PCB, Air velocity = 1 m/s | - | 23.1 | - | °C/W |
| Thermal resistance, QFN48 Package | THETA JA_QFN48 | 4-Layer PCB, Air velocity = 2 m/s | - | 22.1 | - | °C/W |
| Thermal resistance, QFN32 Package | THETA JA_QFN32 | 2-Layer PCB, Air velocity = 0 m/s | - | 79 | - | °C/W |
| Thermal resistance, QFN32 Package | THETA JA_QFN32 | 2-Layer PCB, Air velocity = 1 m/s | - | 62.2 | - | °C/W |
| Thermal resistance, QFN32 Package | THETA JA_QFN32 | 2-Layer PCB, Air velocity = 2 m/s | - New | 54.1 | - | °C/W |
| Thermal resistance, QFN32 Package | THETA JA_QFN32 | 4-Layer PCB, Air velocity = 0 m/s | - | 32 | - | °C/W |
| Thermal resistance, QFN32 Package | THETA JA_QFN32 | 4-Layer PCB, Air velocity = 1 m/s | - | 28.1 | - | °C/W |
| Thermal resistance, QFN32 Package | THETA JA_QFN32 | 4-Layer PCB, Air velocity = 2 m/s | - | 26.9 | - | °C/W |
Parameter Thermal resistance, QFN48 Package Thermal resistance, QFN32 Package Not Recommended for New Designs
Package Information
Table 7.1. QFN48 Package Dimensions
| Dimension | Min | Typ | Max |
|---|---|---|---|
| A | 0.80 | 0.85 | 0.90 |
| A1 | 0.00 | 0.02 | 0.05 |
| A3 | 0.20 REF | 0.20 REF | 0.20 REF |
| b | 0.18 | 0.25 | 0.30 |
| D | 6.90 | 7.00 | 7.10 |
| E | 6.90 | 7.00 | 7.10 |
| D2 | 4.60 | 4.70 | 4.80 |
| E2 | 4.60 | 4.70 | 4.80 |
| e | 0.50 BSC New Designs | 0.50 BSC New Designs | 0.50 BSC New Designs |
| L | 0.30 | 0.40 | 0.50 |
| K | 0.20 | - | - |
| R | 0.09 | - | 0.14 |
| aaa | 0.15 | 0.15 | 0.15 |
| bbb | 0.10 | 0.10 | 0.10 |
| ccc | 0.10 for | 0.10 for | 0.10 for |
| ddd | 0.05 | 0.05 | 0.05 |
| eee | 0.08 | 0.08 | 0.08 |
| fff | 0.10 | 0.10 | 0.10 |
Note: 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing per ANSI Y14.5M-1994. 3. This drawing conforms to the JEDEC Solid State Outline MO-220, Variation VKKD-4. 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. Not Recommended for New Designs
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| EFR32MG1P232F256GM48 | Silicon Labs | — |
| EFR32MG1P232F256GM48-C0 | Silicon Labs | — |
| EFR32MG1P232F256IM48 | Silicon Labs | — |
| EFR32MG1P232F256IM48-C0 | Silicon Labs | — |
| EFR32MG1P233F230GIVI40-CU | Silicon Labs | — |
| EFR32MG1P233F256GM48 | Silicon Labs | — |
| EFR32MG1P233F256GM48-C0 | Silicon Labs | — |
| EFR32MG1P233F256IM48 | Silicon Labs | — |
| EFR32MG1P233F256IM48-C0 | Silicon Labs | — |
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