EFM32PG23B310F512IM48

Part: EFM32PG23 Gecko Family — Silicon Labs Type: ARM Cortex-M33 Microcontroller Description: Energy-friendly 32-bit ARM Cortex-M33 MCU with 80 MHz maximum operating frequency, up to 512 kB Flash, 64 kB RAM, and a robust peripheral set including a 16-channel ADC and Secure Vault.

Operating Conditions:

• Supply voltage: 1.71 V to 3.8 V
• Operating temperature: -40 °C to 125 °C
• Max operating frequency: 80 MHz

Absolute Maximum Ratings:

Key Specs:

• Core: ARM Cortex-M33 with DSP and FPU
• Max Flash memory: 512 kB
• Max RAM data memory: 64 kB
• Active Mode (EM0) current: 21 μA/MHz at 80 MHz
• DeepSleep (EM2) current: 1.03 μA (16 kB RAM retention, RTC from LFRCO)
• GPIO pins: Up to 34
• ADC resolution: 12, 16, or 20-bit
• ADC High Speed Mode: Up to 2 Msps
• ADC High Accuracy Mode: Up to 16 bits ENOB at 3.8 ksps

Features:

• Low Power System-on-Chip
• Low Energy Consumption
• Secure Vault with Hardware Cryptographic Acceleration, TRNG, ARM TrustZone, Secure Boot, Secure Debug Unlock, DPA Countermeasures, Secure Key Management with PUF, Anti-Tamper, Secure Attestation
• Wide Operating Range
• Wide selection of MCU peripherals including IADC, ACMP, VDAC, LESENSE, DMA, PRS, Timers, PCNT, Watchdog, EUSART, USART, I2C, LCD Controller, Keypad scanner, Die temperature sensor.

Applications:

• Metering
• Industrial Automation
• Test and Measurement
• Appliances
• Portable Medical Devices

Package:

• QFN40 (5 mm × 5 mm × 0.85 mm)
• QFN48 (6 mm × 6 mm × 0.85 mm)

• 32-bit ARM® Cortex®-M33 core with 80 MHz maximum operating frequency
• Up to 512 kB of flash and 64 kB of RAM
• Robust peripheral set and up to 34 GPIO
• Low energy operation
• 21 μA/MHz (EM0)
• 1.03 μA sleep (EM2)
• 16-channel ADC with options for 12, 16, or 20-bit resolution
• Best-in-class security with Secure Vault

• Metering
• Industrial Automation
• Test and Measurement
• Appliances
• Portable Medical Devices

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:

• Typical values are based on T A =25 °C and all supplies at 3.3 V, by production test and/or technology characterization.
• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise.

Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at https://www.silabs.com/about-us/corporate-responsibility/commitment-toquality.

Table 4.1. Absolute Maximum Ratings

1. When operating as an LCD driver, the output voltage on a GPIO may safely exceed this specification. The pin output voltage may be up to 3.8 V in this case.

2. The RESETn pin has a pull-up device to the DVDD supply. For minimum leakage, RESETn should not exceed the voltage at DVDD.

Table 4.4. Thermal Characteristics

1. Based on 4 layer PCB with dimension 3" x 4.5", PCB Thickness of 1.6 mm, per JEDEC. PCB Center Land with 9 Via to top internal plane of PCB.

Figure 7.1. QFN40 Package Drawing

Table 7.1. QFN40 Package Dimensions

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.

3. This drawing conforms to the JEDEC Solid State Outline MO-220, Variation VKKD-4.

4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.

5. Package external pad (epad) may have pin one chamfer.