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DAC8552IDGSR

The DAC8552IDGSR is an electronic component. View the full DAC8552IDGSR datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

DAC8552IDGSR shares its datasheet with DAC8552, whose page lists every part number it covers.

Official DAC8552IDGSR datasheet (PDF) — the source this page was extracted from.

DAC8552IDGSR Key Specifications

ParameterValue
Resolution16 bits, monotonic; DNL ±0.35 LSB typ (±1 LSB max)
Relative accuracy±4 LSB typ, ±12 LSB max
Zero code error±2.5 mV typ, ±12 mV max; gain error ±0.08 % FSR typ, ±0.2 % FSR max
Settling time8 μs typ, 10 μs max (to ±0.003% FSR, RL = 2 kΩ, 0–200 pF)
Slew rate1.8 V/μs; code change glitch impulse 0.15 nV-s
AC crosstalk-100 dB; SNR 95 dB, THD -85 dB (VDD = 5 V, fOUT = 1 kHz)
IDD normal mode340 μA typ, 500 μA max (VDD = 3.6–5.5 V, no load, excludes reference current)
IDD power-down0.7 μA typ, 2 μA max (VDD = 3.6–5.5 V)
Reference input impedance62 kΩ; reference current 90 μA typ (VREF = VDD = 5.5 V)

DAC8552IDGSR Overview

Part: DAC8552 — Texas Instruments

Type: 16-Bit Dual Channel Voltage Output DAC

Description: 16-bit, dual channel, ultra-low glitch (0.15 nV-s) voltage output DAC with 2.7–5.5 V supply, rail-to-rail output buffers, 4 LSB typical relative accuracy and a 30 MHz SPI-compatible 3-wire interface.

Operating Conditions:

  • Supply voltage: 2.7–5.5 V
  • Operating temperature: -40 to +105 °C
  • Reference input range: 0 to VDD V
  • Maximum SCLK frequency: 30 MHz (VDD = 3.6–5.5 V), 20 MHz (VDD = 2.7–3.6 V)

Absolute Maximum Ratings:

  • Max supply voltage: VDD to GND -0.3 V to 6 V
  • Digital input voltage: -0.3 V to VDD + 0.3 V
  • VOUTA/VOUTB to GND: -0.3 V to VDD + 0.3 V
  • Max junction temperature: +150 °C
  • Storage temperature: -65 to +150 °C

Key Specs:

  • Resolution: 16 bits, monotonic; DNL ±0.35 LSB typ (±1 LSB max)
  • Relative accuracy: ±4 LSB typ, ±12 LSB max
  • Zero code error: ±2.5 mV typ, ±12 mV max; gain error ±0.08 % FSR typ, ±0.2 % FSR max
  • Settling time: 8 μs typ, 10 μs max (to ±0.003% FSR, RL = 2 kΩ, 0–200 pF)
  • Slew rate: 1.8 V/μs; code change glitch impulse 0.15 nV-s
  • AC crosstalk: -100 dB; SNR 95 dB, THD -85 dB (VDD = 5 V, fOUT = 1 kHz)
  • IDD normal mode: 340 μA typ, 500 μA max (VDD = 3.6–5.5 V, no load, excludes reference current)
  • IDD power-down: 0.7 μA typ, 2 μA max (VDD = 3.6–5.5 V)
  • Reference input impedance: 62 kΩ; reference current 90 μA typ (VREF = VDD = 5.5 V)

Features:

  • Power-on reset to zero-scale
  • On-chip rail-to-rail output buffer amplifiers
  • Double-buffered input architecture
  • Simultaneous or sequential output update and power-down
  • Low-power serial interface with Schmitt-triggered inputs
  • Compatible with SPI, QSPI, Microwire and most DSPs
  • Flexible power-down via serial interface

Applications:

  • Portable instrumentation
  • Closed-loop servo control
  • Process control
  • Data acquisition systems
  • Programmable attenuation
  • PC peripherals

Package:

  • MSOP-8 (DGK)

DAC8552IDGSR Applications

  • Portable Instrumentation
  • Closed-Loop Servo Control
  • Process Control
  • Data Acquisition Systems
  • Programmable Attenuation
  • PC Peripherals

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

SPI, QSP are trademarks of Motorola, Inc.

Microwire is a trademark of National Semiconductor.

All other trademarks are the property of their respective owners.

The DAC8552 is a 16-bit, dual channel, voltage output digital-to-analog converter (DAC) offering low power operation and a flexible serial host interface. Each on-chip precision output amplifier allows rail-to-rail output swing to be achieved over the supply range of 2.7V to 5.5V. The device supports a standard 3-wire serial interface capable of operating with input data clock frequencies up to 30MHz for VDD = 5V.

The DAC8552 requires an external reference voltage to set the output range of each DAC channel. Also incorporated into the device is a power-on reset circuit which ensures that the DAC outputs power up at zero-scale and remain there until a valid write takes place. The DAC8552 provides a flexible power-down feature, accessed over the serial interface, that reduces the current consumption of the device to 700nA at 5V.

The low-power consumption of this device in normal operation makes it ideally suited for portable, battery-operated equipment and other low-power applications. The power consumption is 0.5mW per channel at 2.7V, reducing to 1 μ W in power-down mode.

The DAC8552 is available in a MSOP-8 package with a specified operating temperature range of -40 ° C to +105 ° C.

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

DAC8552IDGSR Pin Configuration

DGK PACKAGE MSOP-8 (Top View)

1

2

3

4

DAC8552

8

7

6

5

V

V

V

V

B

A

DD

REF

OUT

OUT

GND

D

SCLK

SYNC

IN

DAC8552IDGSR Electrical Characteristics

VDD = 2.7V to 5.5V, all specifications -40 ° C to +105 ° C (unless otherwise noted).

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
STATIC PERFORMANCE (1)
Resolution16Bits
Relative accuracyMeasured by line passing through codes 513 and 64741± 4± 12LSB
Differential nonlinearity16-bit monotonic± 0.35± 1LSB
Zero code errorMeasured by line passing through codes 485 and 64741± 2.5± 12mV
Zero code error drift± 5μ V/ ° C
Full-scale errorMeasured by line passing through codes 485 and 64741± 0.1± 0.5% of FSR
Gain errorMeasured by line passing through codes 485 and 64741± 0.08± 0.2% of FSR
Gain temperature coefficient± 1ppm of FSR/ ° C
PSRROutput unloaded0.75mV/V

DAC8552IDGSR Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted). (1)

UNIT
V DD to GNDV DD to GND-0.3V to 6V
Digital input voltage to GNDDigital input voltage to GND-0.3V to V DD + 0.3V
V OUTA or V OUTB to GNDV OUTA or V OUTB to GND-0.3V to V DD + 0.3V
Operating temperature rangeOperating temperature range-40 ° C to +105 ° C
Storage temperature rangeStorage temperature range-65 ° C to +150 ° C
Junction temperature (T J max)Junction temperature (T J max)+150 ° C
Power dissipationPower dissipation(T J max - T A )/ θ JA
Thermalθ JA206 ° C/W
Thermalθ JC44 ° C/W

DAC8552IDGSR Typical Application

In addition, the DAC8552 can achieve typical ac performance of 96dB signal-to-noise ratio (SNR) and -85dB total harmonic distortion (THD), making the DAC8552 a solid choice for applications requiring high SNR at output frequencies at or below 10kHz.

Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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