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DA14531-00000FX2

Bluetooth 5.1 SoC

The DA14531-00000FX2 is a bluetooth 5.1 soc from Dialog Semiconductor. View the full DA14531-00000FX2 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

Official DA14531-00000FX2 datasheet (PDF) — the source this page was extracted from.

Category

Bluetooth 5.1 SoC

Package

WLCSP 17 balls, FCGQFN 24 pins

DA14531-00000FX2 Key Specifications

ParameterValue
ADC4-channel 10-bit
RAM48 kB
CPU CoreArm Cortex-M0+
OTP Memory32 kB
ROM Memory144 kB
RX Current2.2 mA
TX Current3.5 mA
RF Frequency2.4 GHz
CPU Frequency16 MHz
I2C Interface100 kHz and 400 kHz
SPI InterfaceMaster/Slave, up to 32 MHz (Master)
GPIOs (WLCSP17)6
UART Interfaces2
GPIOs (FCGQFN24)12
Bluetooth StandardBluetooth Low Energy 5.1
Receiver Sensitivity-94 dBm
Transmit Output Power-19.5 dBm to +2.5 dBm
Hibernation Current (Buck)270 nA
WLCSP17 Package Dimensions1.7 mm x 2.05 mm
FCGQFN24 Package Dimensions2.2 mm x 3 mm
Hibernation Current (Boost)240 nA
Supply Voltage Range (Buck)1.8 V to 3.6 V
Supply Voltage Range (Boost)1.1 V to 1.65 V

DA14531-00000FX2 Overview

Part: DA14531 (DA14531-00000FX2) — Dialog Semiconductor / Renesas

Type: Bluetooth 5.1 Low Energy SoC (Arm Cortex-M0+ with 2.4 GHz transceiver)

Description: Ultra-low-power Bluetooth LE 5.1 SoC with a 16 MHz Arm Cortex-M0+, 48 kB RAM, 32 kB OTP, integrated buck/boost DC-DC, and TX 3.5 mA / RX 2.2 mA system current.

Operating Conditions:

  • Supply voltage: buck VBAT_HIGH 1.8–3.6 V; boost VBAT_LOW 1.1–1.6 V; bypass VBAT 1.1–3.3 V (minimum boot voltage 1.8 V)
  • Operating temperature: -40 to 85 °C (ambient)
  • OTP programming: 2.25–3.6 V, -40 to 85 °C; OTP read: 1.62–3.6 V

Absolute Maximum Ratings:

  • Max supply voltage (VBAT limiting, buck and boost configurations): 3.6 V (min -0.2 V)
  • Max voltage on a pin: 3.6 V (min -0.2 V)
  • ESD HBM: 4 kV (FCGQFN24; RFIO pins up to 2.5 kV), 2 kV (WLCSP17)
  • ESD CDM: 500 V
  • Storage temperature: -50 to 150 °C

Key Specs:

  • CPU: 16 MHz 32-bit Arm Cortex-M0+, EEMBC IoTMark-BLE score 18300
  • Memory: 32 kB OTP, 48 kB retainable RAM, 144 kB ROM
  • Radio: TX 3.5 mA, RX 2.2 mA (with DC-DC, VBAT_HIGH = 3 V, 0 dBm)
  • TX output power: -19.5 to +2.5 dBm
  • Receiver sensitivity: -94 dBm
  • Hibernation current: 270 nA (buck), 240 nA (boost)
  • ADC: 4-channel 10-bit
  • Cold boot to radio active: 35 ms typical

Features:

  • Bluetooth LE 5.1 compliant, up to three connections
  • Integrated buck/boost DC-DC converter
  • Dedicated Link Layer and AES-128 encryption processor
  • 32 MHz crystal and RC oscillators, 32 kHz crystal and RC oscillators, 15 kHz RCX
  • 2× UART, SPI (up to 32 MHz master), I2C (100/400 kHz), quadrature decoder, keyboard controller
  • 2× general-purpose timers with capture and PWM
  • Built-in die temperature sensor
  • GPIOs: 6 (WLCSP17), 12 (FCGQFN24)

Applications:

  • Medical applications
  • Disposables
  • Beacons, proximity tags and trackers
  • Wireless sensor nodes, fitness trackers
  • Smartwatches
  • HID devices (stylus, keyboards, mice, trackpads)
  • Toys
  • Industrial appliances

Package:

  • WLCSP17: 17 balls, 1.7 × 2.05 mm, 0.5 mm pitch
  • FCGQFN24: 24 pins, 2.2 × 3 mm, 0.4 mm pitch

DA14531-00000FX2 Features

  • ■ Compatible with Bluetooth ® v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) ■

  • ■ Supports up to three Bluetooth ® LE connections

  • ■ Typical cold boot to radio active 35 ms

  • ■ Processing power

  • □ 16 MHz 32-bit Arm ® Cortex-M0+ with SWD interface

  • □ 18300 EEMBC IoTMark-BLE ® score

  • □ Dedicated Link Layer and AES-128 Encryption Processor

  • □ Software-based True Random Number Generator (TRNG)

  • ■ Memories

  • □ 32 kB One-Time-Programmable (OTP)

  • □ 48 kB Retainable System RAM

  • □ 144 kB ROM

  • ■ Power management

  • □ Integrated Buck/Boost DCDC converter

  • □ Buck: 1.8 V ≤ VBAT_HIGH ≤ 3.6 V

  • □ Boost: 1.1 V ≤ VBAT_LOW ≤ 1.65 V

  • □ Clock-less hibernation mode: Buck 270 nA, Boost 240 nA

  • □ Built-in temperature sensor for die temperature monitoring

DA14531-00000FX2 Applications

  • ■ Medical applications
  • ■ Disposables
  • ■ Beacons
  • ■ Proximity tags and trackers
  • ■ Wireless sensor nodes
  • □ Fitness trackers
  • □ Consumer health
  • ■ Smartwatches
  • ■ Human interface devices (HID)
  • □ Stylus pens
  • □ Keyboards
  • □ Mouse devices
  • □ Trackpads
  • ■ Toys
  • ■ Industrial appliances

DA14531-00000FX2 Pin Configuration

The Programmable Pin Assignment (PPA) provides a multiplexing function to the I/O pins of on-chip peripherals. Any peripheral input or output signal can be freely mapped to any I/O port bit by setting Pxy_MODE_REG[4-0]:

0x00 to 0x1F: Peripheral IO ID (PID)

Refer to the registers of Px_MODE_REG (x = 00, 01, 02, to 11) for an overview of the available PIDs. The analog ADC has a fixed pin assignment so that the interference with the digital domain is limited. The SWD interface (JTAG) is mapped on P0_5 (or P0_1 or P0_10, see chapter 2 Pinout) for the SWDIO and on P0_2 for the SWCLK.

Datasheet Revision 3.5

04-Mar-2022

Final

DA14531-00000FX2 Electrical Characteristics

ParameterDescriptionConditionsMinTypMaxUnit
I BAT_HIGH_HIB ERN_0kBbattery supply currentHibernation mode, no RAM retained, no oscillator running Note 1270nA
I BAT_HIGH_HIB ERN_48kBbattery supply currentHibernation mode, 48kB RAM retained, no oscillator running750nA
I BAT_LOW_HIB ERN_0kBbattery supply currentHibernation mode, no RAM retained, no oscillator running Note 2240nA
I BAT_LOW_HIB ERN_0kB_5DEGbattery supply currentHibernation mode at 5 0 C, 0kB RAM retained, no oscillator running150nA
I BAT_LOW_HIB ERN_48kBbattery supply currentHibernation mode, 48kB RAM retained, no oscillator running700nA
I BAT_LOW_DP_ SLP_0kBbattery supply currentDeep-sleep with 0 kB RAM retained, running on RCX0.9μA
I BAT_LOW_EX_ SLP_20kBbattery supply currentExtended-sleep with 20 kB RAM retained, running on RCX1.2μA
I BAT_LOW_EX_ SLP_48kBbattery supply currentExtended-sleep with 48 kB RAM retained, running on RCX1.6μA
I BAT_HIGH_DP_ SLP_0kBbattery supply currentDeep-sleep with no RAM retained, running on RCX1μA
I BAT_HIGH_EX_ SLP_20kBbattery supply currentExtended-sleep mode with 20 kB RAM retained, running on RCX1.2μA
I BAT_HIGH_EX_ SLP_48kBbattery supply currentExtended-sleep mode with 48 kB RAM retained, running on RCX1.6μA

Final

ParameterDescriptionConditionsMinTypMaxUnit
I BAT_LOW_ACT _RXbattery supply currentApplication with Receiver Active, CPU idle at 16MHz, DCDC off5mA
I BAT_LOW_ACT _TXbattery supply currentApplication with Pout = 0dBm, Power setting 9, Transmit continuous unmodulated output power, CPU idle at 16MHz, DCDC off8mA
I BAT_HIGH_ACT _RXbattery supply currentApplication with Receiver Active, CPU idle at 16MHz, DCDC on2.2mA
I BAT_HIGH_ACT _TXbattery supply currentApplication with Pout = 0dBm,Power setting 9, Transmit continuous unmodulated output power, CPU idle at 16MHz, DCDC on3.5mA
I BAT_LOW_RUN _16MHzbattery supply currentCPU executing code from RAM running on XTAL32M oscillator at 16MHz, DCDC off830μA
I BAT_HIGH_RU N_16MHzbattery supply currentCPU executing code from RAM running on XTAL32M oscillator at 16MHz380μA
I BAT_HIGH_IDL E_16MHzbattery supply currentCPU in Wait-for-Interrupt (WFI) state running on XTAL32M oscillator at 16MHz230μA
I BAT_LOW_IDLE _16MHzbattery supply currentCPU in Wait-for-Interrupt (WFI) state running on XTAL32M oscillator at 16MHz, DCDC off460μA
I BAT_HIGH_RSTbattery supply currentReset pin asserted, buck configuration, V BAT_HIGH = 3.0 V, at 25°C200μA
I BAT_LOW_RSTbattery supply currentReset pin asserted, boost configuration, V BAT_LOW = 1.5 V, at 25°C200μA

Note 1

IBAT_HIGH is Buck configuration at VBAT = 3 V, at 25 °C

Note 2 IBAT_LOW is Boost configuration at VBAT = 1.5 V, at 25 °C

DA14531-00000FX2 Absolute Maximum Ratings

ParameterDescriptionConditionsMinMaxUnit
V BAT_LIM_LOWlimiting supply voltageBattery voltage in boost configuration, supply voltage in buck configuration-0.23.6V
V BAT_LIM_HIG Hlimiting supply voltageBattery voltage in buck configuration, supply voltage in boost configuration-0.23.6V
V PIN_LIM_defau ltlimiting voltage on a pin-0.23.6V
V ESD_HBM_FC GQFN24electrostatic discharge voltage (Human Body Model)RFIOm and RFIOp pins only up to 2.5 kV4kV
V ESD_HBM_WL CSP17electrostatic discharge voltage (Human Body Model)2kV
V ESD_CDM_FC GQFN24electrostatic discharge voltage (Charged Device Model)500V
V ESD_CDM_WL CSP17electrostatic discharge voltage (Charged Device Model)500V
T STGstorage temperature-50150°C
ParameterDescriptionConditionsMinTypMaxUnit
I L_VBAT_HIGH_ BOOTINGMaximum external DC load current on V BAT_HIGH rail during booting in boost modeBoost mode booting sequence active50μA
V BAT_BYPASSSupply voltage.Battery voltage.For OTP functionality refer to V BAT_HIGH_OTP_Program/Read . Minimum boot voltage is 1.8V.1.13.3V
V BAT_HIGH_BO OSTDCDC output.For OTP functionality refer to V BAT_HIGH_OTP_Program/Read1.83.3V
V BAT_HIGH_BU CKSupply voltage.Battery voltage.For OTP functionality refer to V BAT_HIGH_OTP_Program/Read1.83.6V
V BAT_LOW_BO OSTSupply voltage.Battery voltage.1.11.6V
V BAT_LOW_BU CKDCDC or LDO_LOW output1.13.3V
V BAT_HIGH_OT P_ProgramVoltage range for OTP programming.Required temperature for programming: -40 o C to 85 o C2.253.6V

Final

Final

ParameterDescriptionConditionsMinTypMaxUnit
V BAT_HIGH_OT P_ReadVoltage range for OTP reading.1.623.6V
V PIN_defaultvoltage on a pin-0.2VBAT _HIGH +0.2V
T Aambient temperature-4085°C

DA14531-00000FX2 Package Information

Final

Figure 85: WLCSP17 Package Outline Drawing

Datasheet Revision 3.5

Final

Figure 86: FCGQFN24 Package Outline Drawing

Revision 3.5

Final

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
DA14531Dialog Semiconductor—

More datasheets

All Dialog Semiconductor datasheets (16)

Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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