CY8C6347BZI-BLD53
Microcontroller (MCU)The CY8C6347BZI-BLD53 is a microcontroller (mcu) from Infineon Technologies. View the full CY8C6347BZI-BLD53 datasheet below including key specifications, pinout, electrical characteristics, absolute maximum ratings.
Manufacturer
Infineon Technologies
Category
Microcontroller (MCU)
Package
1
Lifecycle
Active
Key Specifications
| Parameter | Value |
|---|---|
| Connectivity | I2C, LINbus, QSPI, SPI, UART/USART, USB |
| Core Processor | ARM® Cortex®-M4/M0 |
| Core Size | 32-Bit Dual-Core |
| Data Converters | A/D 8x12b SAR; D/A 1x12b |
| DigiKey Programmable | Not Verified |
| DigiKey Programmable | Not Verified |
| DigiKey Programmable | Not Verified |
| DigiKey Programmable | Not Verified |
| DigiKey Programmable | Not Verified |
| DigiKey Programmable | Not Verified |
| DigiKey Programmable | Not Verified |
| DigiKey Programmable | Not Verified |
| EEPROM Size | 32K x 8 |
| EEPROM Size | 32K x 8 |
| EEPROM Size | 32K x 8 |
| EEPROM Size | 32K x 8 |
| EEPROM Size | 32K x 8 |
| EEPROM Size | 32K x 8 |
| EEPROM Size | 32K x 8 |
| EEPROM Size | 32K x 8 |
| Mounting Type | Surface Mount |
| Number of I/O | 78 |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Oscillator Type | Internal |
| Oscillator Type | Internal |
| Oscillator Type | Internal |
| Oscillator Type | Internal |
| Oscillator Type | Internal |
| Oscillator Type | Internal |
| Oscillator Type | Internal |
| Oscillator Type | Internal |
| Package / Case | 116-WFBGA |
| Packaging | Tray |
| Packaging | Tray |
| Packaging | Tray |
| Peripherals | Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT |
| Flash Memory Size | 1MB (1M x 8) |
| Program Memory Type | FLASH |
| RAM Size | 288K x 8 B |
| Clock Speed | 100MHz, 150MHz |
| Standard Pack Qty | 3640 |
| Standard Pack Qty | 3640 |
| Standard Pack Qty | 3640 |
| Supplier Device Package | 116-BGA (5.2x6.4) |
| Supplier Device Package | 116-BGA (5.2x6.4) |
| Supplier Device Package | 116-BGA (5.2x6.4) |
| Supplier Device Package | 116-BGA (5.2x6.4) |
| Supplier Device Package | 116-BGA (5.2x6.4) |
| Supplier Device Package | 116-BGA (5.2x6.4) |
| Supplier Device Package | 116-BGA (5.2x6.4) |
| Supplier Device Package | 116-BGA (5.2x6.4) |
| Supply Voltage | 1.7V ~ 3.6V |
Overview
Part: PSoC™ 6 MCU: CY8C63x6, CY8C63x7 — Infineon
Type: Microcontroller (MCU)
Description: High-performance, ultra-low-power and secured MCU platform with dual 150-MHz Arm Cortex-M4F and 100-MHz Cortex-M0+ CPUs, 1 MB Flash, 288 KB SRAM, and Bluetooth LE 5.0 connectivity.
Operating Conditions:
- Supply voltage: 1.7–3.6 V
- Operating temperature: -40 to +85 °C
- CM4 CPU frequency: up to 150 MHz
- CM0+ CPU frequency: up to 100 MHz
Absolute Maximum Ratings:
- Max supply voltage: 3.8 V
- Max junction temperature: +125 °C
Key Specs:
- CM4 CPU frequency: 150 MHz
- CM0+ CPU frequency: 100 MHz
- Application Flash: 1 MB
- SRAM: 288 KB
- Deep Sleep current: 7 μA (with 64-KB SRAM retention)
- SAR ADC resolution: 12-bit, 1 Msps
- Bluetooth LE TX power: up to 4 dBm
- Bluetooth LE RX sensitivity: -95 dBm
Features:
- 32-bit Dual CPU subsystem (150-MHz Arm Cortex-M4F, 100-MHz Cortex-M0+)
- 1-MB application flash, 288-KB SRAM
- Bluetooth® Low Energy 5.0 subsystem
- On-chip Single-In Multiple Out (SIMO) DC-DC buck converter
- Nine run-time configurable serial communication blocks (SCBs)
- USB full-speed device interface
- 12-bit 1-Msps SAR ADC
- CAPSENSE™ capacitive sensing
- Hardware cryptography accelerator and True random number generation (TRNG)
Package:
- 124-BGA
- 104-M-CSP
- 116-BGA
- 68-QFN
Features
- 32-bit Dual CPU subsystem
- 150-MHz Arm® Cortex®-M4F (CM4) CPU with single-cycle multiply, floating point, and memory protection unit (MPU)
- 100-MHz Cortex®-M0+ (CM0+) CPU with single-cycle multiply and MPU
- -User-selectable core logic operation at either 1.1 V or 0.9 V
- Active CPU current slope with 1.1-V core operation
- Cortex®-M4: 40 μA/MHz
- Cortex®-M0+: 20 μA/MHz
- Active CPU current slope with 0.9-V core operation
- Cortex®-M4: 22 μA/MHz
- Cortex®-M0+: 15 μA/MHz
- Two DMA controllers with 16 channels each
- Memory subsystem
- 1-MB application flash, 32-KB auxiliary flash (AUXflash), and 32-KB supervisory flash (SFlash); read-while-write (RWW) support. Two 8-KB flash caches, one for each CPU.
- 288-KB SRAM with power and data retention control
- One-time-programmable (OTP) 1-Kb eFuse array
- Bluetooth® Low Energy subsystem
- -2.4-GHz RF transceiver with 50- antenna drive
- Digital PHY
- Link Layer engine supporting master and slave modes
- Programmable TX power: up to 4 dBm
- RX sensitivity: -95 dBm
- RSSI: 4-dB resolution
- 5.7-mA Tx (0 dBm) and 6.7 mA RX (2 Mbps) current with 3.3-V supply and internal SIMO Buck converter
- Link Layer engine supports four connections simultaneously
- Supports 2 Mbps data rate
- Low-power 1.7-V to 3.6-V operation
- Six power modes for fine-grained power management
- Deep Sleep mode current of 7 μA with 64-KB SRAM retention
- On-chip Single-In Multiple Out (SIMO) DC-DC buck converter, <1 μA quiescent current
- Backup domain with 64 bytes of memory and real-time clock
- Flexible clocking options
- 8-MHz Internal Main Oscillator (IMO) with ±2% accuracy
- Ultra-low-power 32-kHz Internal Low-speed Oscillator (ILO)
- -On-chip crystal oscillators (16 to 35 MHz, and 32 kHz)
Pin Configuration
I appreciate your detailed request, but I need to be transparent about a limitation: the pin diagram image you've attached does not contain readable pin numbers or labels that I can extract with confidence.
The image shows the Infineon logo but does not display:
- Pin numbers (1, 2, 3, …)
- Pin names (P0.0, P1.1, etc.)
- Package outline with labeled pins
- Any other pinout information
What I can tell you:
From the text provided, I can confirm:
- Part number: CY8C6347BZI-BLD53 (CY8C63x6 family)
- Package type: Not explicitly stated in the excerpt (listed as "Package: 1")
- GPIO Port Power Distribution: P0–P14 with specific supply pins (VBACKUP, VDDD, VDDIO1, VDDIOA, VDDUSB, etc.)
What I cannot do:
Without a readable pin diagram showing pin numbers or a text table with Pin Number column, I cannot create an accurate pinout table. The datasheet excerpt references "a spreadsheet with a consolidated list of pinouts and pin alternate functions" but that spreadsheet is not included here.
Recommendation:
Please provide:
- A clearer/higher-resolution pin diagram image showing pin numbers and names, OR
- The actual pinout table from the datasheet (the spreadsheet mentioned in the note), OR
- A different section of the datasheet that lists pins with their numbers
I will not fabricate pin assignments—every pin in the output must be traceable to source material.
Electrical Characteristics
All specifications are valid for -40°C ≤ T A ≤ 85°C and for 1.71 V to 3.6 V except where noted.
Absolute Maximum Ratings
| Spec ID# | Parameter | Description | Min | Typ | Max | Unit | Details / Conditions |
|---|---|---|---|---|---|---|---|
| SID1 | V DD_ABS | Analog or digital supply relative to V SS (V SSD = V SSA ) | -0.5 | - | 4 | V | |
| SID2 | V CCD_ABS | Direct digital core voltage input relative to V SSD | -0.5 | - | 1.2 | V | |
| SID3 | V GPIO_ABS | GPIO voltage; V DDD or V DDA | -0.5 | - | V DD + 0.5 | V | |
| SID4 | I GPIO_ABS | Current per GPIO | -25 | - | 25 | mA | |
| SID5 | I GPIO_injection | GPIO injection current per pin | -0.5 | - | 0.5 | mA | |
| SID3A | ESD_HBM | Electrostatic dischargeHuman Body Model | 2200 | - | - | V | |
| SID3B | ESD_HB- M_ANT | Electrostatic dischargeHuman Body Model; Antenna Pin | 500 | - | - | V | RF pin |
| SID4A | ESD_CDM | ElectrostaticdischargeCharged Device Model | 500 | - | - | V | |
| SID4B | ESD_ CDM_ANT | ElectrostaticdischargeCharged Device Model; Antenna Pin | 200 | - | - | V | RF pin |
| SID4C | ESD_CDM_X | ElectrostaticdischargeCharged Device Model; XI, XO pins | 200 | - | - | V | XI, XO Pins |
| SID5A | LU | Pin current for latchup-free operation | -100 | - | 100 | mA |
Package Information
| Spec ID# | Package | Description | Package Drawing Number |
|---|---|---|---|
| PKG_1 | 124-BGA | 124-BGA, 9 9 1 mmheight with 0.65-mm pitch | 001-97718 |
| PKG_2 | 104-M-CSP | 104-M-CSP, 3.8 5 0.65 mmheight with 0.35-mm pitch | 002-16508 |
| PKG_4 | 116-BGA | 116-BGA, 5.2 6.4 0.70 mmheight with 0.5-mm pitch | 002-16574 |
| PKG_5 | 68-QFN | 68-QFN, 8 8 1 mmheight with 0.4-mm pitch | 001-96836 |
Ordering Information
No ordering information table or specific part numbers were found in the provided text. The text refers to "Table 59" but does not include it.
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| CY8C6347BZI-BLD33 | Infineon Technologies | 116-WFBGA |
| CY8C6347BZI-BLD34 | Infineon Technologies | — |
| CY8C6347BZI-BLD43 | Infineon Technologies | 116-WFBGA |
| CY8C6347BZI-BLD44 | Infineon Technologies | — |
| CY8C6347BZI-BLD54 | Infineon Technologies | — |
| CY8C6347FMI-BLD13 | Infineon Technologies | — |
| CY8C6347FMI-BLD33 | Infineon Technologies | — |
| CY8C6347FMI-BLD43 | Infineon Technologies | — |
| CY8C6347FMI-BLD53 | Infineon Technologies | — |
| CY8C6347FMI-BUD13 | Infineon Technologies | — |
| CY8C6347FMI-BUD33 | Infineon Technologies | — |
| CY8C6347FMI-BUD43 | Infineon Technologies | — |
| CY8C6347FMI-BUD53 | Infineon Technologies | — |
| CY8C6347LQI-BLD52 | Infineon Technologies | — |
| CY8C63X6 | Infineon Technologies | — |
| CY8C63X6, | Infineon Technologies | — |
| CY8C63X7 | Infineon Technologies | — |
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