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CSD18540

N-Channel NexFET Power MOSFET

The CSD18540 is a n-channel nexfet power mosfet from Texas Instruments. View the full CSD18540 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

Manufacturer

Texas Instruments

Category

N-Channel NexFET Power MOSFET

Key Specifications

ParameterValue
Continuous Drain Current100A (Ta)
Drain-Source Voltage (Vdss)60 V
Drive Voltage (Max Rds On, Min Rds On)4.5V, 10V
Drive Voltage (Max Rds On, Min Rds On)4.5V, 10V
FET TypeN-Channel
Gate Charge (Qg)53 nC @ 10 V
Input Capacitance (Ciss)4230 pF @ 30 V
Mounting TypeSurface Mount
Operating Temperature-55°C ~ 150°C (TJ)
Package / Case8-PowerTDFN
PackagingMouseReel
Power Dissipation (Max)3.1W (Ta), 195W (Tc)
Rds(on)2.2mOhm @ 28A, 10V Ω
Standard Pack Qty2500
Supplier Device Package8-VSON-CLIP (5x6)
Supplier Device Package8-VSON-CLIP (5x6)
Diode TechnologyMOSFET (Metal Oxide)
Vgs (Max)±20V
Gate Threshold Voltage2.3V @ 250µA

Overview

Part: CSD18540Q5B — Texas Instruments

Type: N-Channel NexFET™ Power MOSFET

Description: This 1.8 mΩ, 60 V, SON5x6 NexFET™ power MOSFET is designed to minimize losses in power conversion applications.

Operating Conditions:

  • Supply voltage: 60 V (Drain-to-Source)
  • Operating temperature: -55 to 150 °C

Absolute Maximum Ratings:

  • Max supply voltage: 60 V (Drain-to-Source)
  • Max continuous current: 100 A (Package limited)
  • Max junction/storage temperature: 150 °C

Key Specs:

  • Drain-to-Source On Resistance (RDS(on)): 1.8 mΩ (VGS = 10 V, ID = 28 A)
  • Drain-to-Source On Resistance (RDS(on)): 2.6 mΩ (VGS = 4.5 V, ID = 28 A)
  • Gate-to-Source Threshold Voltage (VGS(th)): 1.9 V (typ), 2.3 V (max) (VDS = VGS, ID = 250 μA)
  • Gate Charge Total (Qg): 41 nC (VDS = 30 V, ID = 28 A, VGS = 10 V)
  • Input Capacitance (Ciss): 3250 pF (typ), 4230 pF (max) (VGS = 0 V, VDS = 30 V, ƒ = 1 MHz)
  • Drain-to-Source Leakage Current (IDSS): 1 μA (max) (VGS = 0 V, VDS = 48 V)
  • Diode Forward Voltage (VSD): 0.8 V (typ), 1 V (max) (ISD = 28 A, VGS = 0 V)

Features:

  • Ultra-Low Qg and Qgd
  • Low Thermal Resistance
  • Avalanche Rated
  • Pb-Free Terminal Plating
  • RoHS Compliant
  • Halogen Free
  • SON 5-mm × 6-mm Plastic Package

Applications:

  • DC-DC Conversion
  • Secondary Side Synchronous Rectifier
  • Isolated Converter Primary Side Switch
  • Motor Control

Package:

  • SON 5 × 6 mm Plastic Package (8 pins)
  • VSON-CLIP (8 pins)

Features

  • 1 · Ultra-Low Qg and Qgd
  • Low Thermal Resistance
  • Avalanche Rated
  • Pb-Free Terminal Plating
  • RoHS Compliant
  • Halogen Free
  • SON 5-mm × 6-mm Plastic Package

Applications

  • DC-DC Conversion
  • Secondary Side Synchronous Rectifier
  • Isolated Converter Primary Side Switch
  • Motor Control

Electrical Characteristics

(TA = 25°C unless otherwise stated)

PARAMETERPARAMETERTEST CONDITIONSTYPMAXUNIT
STATIC CHARACTERISTICSSTATIC CHARACTERISTICSSTATIC CHARACTERISTICSSTATIC CHARACTERISTICSSTATIC CHARACTERISTICSSTATIC CHARACTERISTICS
BV DSSDrain-to-Source VoltageV GS = 0 V, I D = 250 μ AV
I DSSDrain-to-Source Leakage CurrentV GS = 0 V, V DS = 48 V1μ A
I GSSGate-to-Source Leakage CurrentV DS = 0 V, V GS = 20 V100nA
V GS(th)Gate-to-Source Threshold VoltageV DS = V GS , I D = 250 μ A1.92.3V
RDrain-to-Source On ResistanceV GS = 4.5 V, I D = 28 A2.63.3m Ω
DS(on)V GS = 10 V, I D = 28 A1.82.2m Ω
g fsTransconductanceV DS = 6 V, I D = 28 A116S
DYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICS
C issInput CapacitanceV GS = 0 V, V DS = 30 V, ƒ = 1 MHz32504230pF
C ossOutput Capacitance622808pF
C rssReverse Transfer Capacitance1520pF
R GSeries Gate Resistance0.81.6Ω
Q gGate Charge Total (4.5 V)V DS = 30 V, I D = 28 A2026nC
Q gGate Charge Total (10 V)4153nC
Q gdGate Charge Gate-to-Drain6.7nC
Q gsGate Charge Gate-to-Source8.8nC
Q g(th)Gate Charge at V th6.3nC
Q ossOutput ChargeV DS = 30 V, V GS = 0 V83nC
t d(on)Turn On Delay TimeV DS = 30 V, V GS = 10 V, I DS = 28 A, R G = 0 Ω6ns
t rRise Time9ns
t d(off)Turn Off Delay Time20ns
t fFall Time3ns
DIODE CHARACTERISTICSDIODE CHARACTERISTICSDIODE CHARACTERISTICSDIODE CHARACTERISTICSDIODE CHARACTERISTICSDIODE CHARACTERISTICS
V SDDiode Forward VoltageI SD = 28 A, V GS = 0 V0.81V
Q rrReverse Recovery ChargeV DS = 30 V, I F = 28 A,145nC
t rrReverse Recovery Timedi/dt = 300 A/ μ s82ns

Absolute Maximum Ratings

T A = 25°CT A = 25°CVALUEUNIT
V DSDrain-to-Source Voltage60V
V GSGate-to-Source Voltage±20V
I DContinuous Drain Current (Package limited)100A
I DContinuous Drain Current (Silicon limited), T C = 25°C221A
I DContinuous Drain Current (1)28A
I DMPulsed Drain Current, T A = 25°C (2)400A
P DPower Dissipation (1)3.1W
P DPower Dissipation, T C = 25°C195W
T J , T stgOperating Junction and Storage Temperature Range-55 to 150°C
E ASAvalanche Energy, single pulse I D = 80 A, L = 0.1 mH, R G = 25 Ω320mJ
  • (1) Typical R θ JA = 40°C/W on a 1-inch 2 , 2-oz. Cu pad on a 0.06inch thick FR4 PCB.
  • (2) Max R θ JC = 0.8°C/W, Pulse duration ≤ 100 μ s, duty cycle ≤ 1%

CSD18540Q5B

SLPS488 -JUNE 2014

Thermal Information

(TA = 25°C unless otherwise stated)

THERMAL METRICTHERMAL METRICMINTYPMAXUNIT
R θ JCJunction-to-Case Thermal Resistance (1)0.8°C/W
R θ JAJunction-to-Ambient Thermal Resistance (1)(2)500.8°C/W

Max R θ JA = 50°C/W when mounted on 1 inch 2 (6.45 cm 2 ) of 2-oz. (0.071-mm thick) Cu.

Package Information

DIMMILLIMETERSMILLIMETERSMILLIMETERS
DIMMINNOMMAX
A0.801.001.05
b0.360.410.46
c0.150.200.25
c10.150.200.25
c20.200.250.30
D14.905.005.10
D24.124.224.32
D33.904.004.10
d0.200.250.30
d10.085 TYP0.085 TYP0.085 TYP
d20.3190.3690.419
E4.905.005.10
E15.906.006.10
E23.483.583.68
e1.27 TYP1.27 TYP1.27 TYP
H0.360.460.56
L0.460.560.66
L10.570.670.77
θ--
K1.40 TYP1.40 TYP1.40 TYP

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
CSD18540Q5BTexas Instruments8-PowerTDFN
CSD18540Q5BTTexas Instruments8-PowerTDFN
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