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CSD13381F4T

N-Channel MOSFET

The CSD13381F4T is a n-channel mosfet from Texas Instruments. View the full CSD13381F4T datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

CSD13381F4T shares its datasheet with CSD13381F4, whose page lists every part number it covers.

Official CSD13381F4T datasheet (PDF) — the source this page was extracted from.

Manufacturer

Texas Instruments

Category

MOSFETs

Package

PICOSTAR-3 1.0x0.6mm

Lifecycle

Production (Last Updated: 1 day ago)

CSD13381F4T Key Specifications

ParameterValue
Case/PackageQFN
Continuous Drain Current (ID)2.1 A
Drain to Source Breakdown Voltage12 V
Drain to Source Resistance140 mΩ
Drain-Source Voltage (Vdss)12 V
Element ConfigurationSingle
Fall Time3.8 ns
Gate to Source Voltage (Vgs)8 V
Height350 µm
Input Capacitance200 pF
Lead FreeLead Free
Length1.035 mm
Lifecycle StatusProduction (Last Updated: 2 days ago)
Manufacturer Lifecycle StatusACTIVE (Last Updated: 2 days ago)
Max Junction Temperature (Tj)150 °C
Max Operating Temperature150 °C
Max Power Dissipation500 mW
Min Operating Temperature-55 °C
MountSurface Mount
Number of Channels1
Number of Elements1
Number of Pins3
PackagingMouseReel
Power Dissipation500 mW
Rds On Max180 mΩ
REACH SVHCNo
Rise Time1.5 ns
RoHSCompliant
Schedule B8541210040, 8541210040|8541210040|8541210040|8541210040|8541210040, 8541290080
Standard Pack Qty250
Threshold Voltage850 mV
Turn-Off Delay Time11 ns
Turn-On Delay Time3.7 ns
Width635 µm

CSD13381F4T Overview

Part: CSD13381F4 — Texas Instruments

Type: N-Channel Power MOSFET (FemtoFET)

Description: 12 V, 140 mΩ (typ, VGS = 4.5 V) N-channel FemtoFET MOSFET in a 1.0 mm × 0.6 mm (0402) ultra-low-profile package with integrated ESD protection diode.

Operating Conditions:

  • Supply voltage: not applicable (VDS up to 12 V, VGS up to 8 V)
  • Operating temperature: -55 to 150 °C
  • Gate drive: usable down to 1.8 V (RDS(on) specified at VGS = 1.8, 2.5, 4.5 V)

Absolute Maximum Ratings:

  • Drain-to-source voltage VDS: 12 V
  • Gate-to-source voltage VGS: 8 V
  • Continuous drain current ID (TA = 25 °C): 2.1 A
  • Pulsed drain current IDM: 7 A (≤300 μs, duty ≤2%)
  • Power dissipation PD: 500 mW
  • Operating junction and storage temperature: -55 to 150 °C

Key Specs:

  • RDS(on) at IDS = 0.5 A: 310 mΩ typ / 400 mΩ max (VGS = 1.8 V); 170 mΩ typ / 225 mΩ max (2.5 V); 140 mΩ typ / 180 mΩ max (4.5 V)
  • Threshold voltage VGS(th): 0.85 V typ, 1.10 V max (VDS = VGS, IDS = 250 μA)
  • IDSS: 100 nA max (VGS = 0 V, VDS = 9.6 V); IGSS: 50 nA max (VDS = 0 V, VGS = 8 V)
  • Qg: 1060 pC typ, 1400 pC max (VDS = 6 V, IDS = 0.5 A, 4.5 V); Qgd: 140 pC typ
  • Ciss 155 pF typ / Coss 47 pF typ / Crss 2.5 pF typ (VDS = 6 V, 1 MHz)
  • Switching (VDS = 6 V, VGS = 4.5 V, RG = 2 Ω): td(on) 3.7 ns, tr 1.5 ns, td(off) 11.0 ns, tf 3.8 ns
  • Body diode VSD: 0.73 V typ, 0.9 V max (ISD = 0.5 A)
  • Thermal resistance RθJA: 90 °C/W (1 in² 2 oz Cu pad) or 250 °C/W (minimum pad)

Features:

  • Low on-resistance
  • Low Qg and Qgd
  • Low threshold voltage
  • Ultra-small 0402 footprint (1.0 mm × 0.6 mm)
  • Maximum height 0.36 mm
  • Integrated ESD protection diode (HBM > 4 kV, CDM > 2 kV)
  • Lead and halogen free, RoHS compliant

Applications:

  • Load switches
  • General purpose switching
  • Single-cell battery applications
  • Handheld and mobile applications

Package:

  • PICOSTAR (YJC), 3-pin, Femto (0402) 1.0 mm × 0.6 mm SMD leadless
  • CSD13381F4: 3000 pcs on 7-inch reel; CSD13381F4T: 250 pcs

CSD13381F4T Features

  • Low on-resistance
  • Low Qg and Qgd
  • Low threshold voltage
  • Ultra-small footprint (0402 case size)
  • -1.0 mm × 0.6 mm
  • Ultra-low profile
  • -Maximum height: 0.36-mm
  • Integrated ESD protection diode
  • -Rated > 4-kV HBM
  • -Rated > 2-kV CDM
  • Lead and halogen free
  • RoHS compliant

CSD13381F4T Applications

  • Optimized for load switch applications
  • Optimized for general purpose switching applications
  • Single-cell battery applications
  • Handheld and mobile applications

CSD13381F4T Electrical Characteristics

(TA = 25°C unless otherwise stated)

PARAMETERPARAMETERTEST CONDITIONSTYPMAXUNIT
STATIC CHARACTERISTICSSTATIC CHARACTERISTICSSTATIC CHARACTERISTICSSTATIC CHARACTERISTICSSTATIC CHARACTERISTICSSTATIC CHARACTERISTICSSTATIC CHARACTERISTICS
BV DSSDrain-to-Source VoltageV GS = 0 V, I DS = 250 μAV
I DSSDrain-to-Source Leakage CurrentV GS = 0 V, V DS = 9.6 V100nA
I GSSGate-to-Source Leakage CurrentV DS = 0 V, V GS = 8 V50nA
V GS(th)Gate-to-Source Threshold VoltageV DS = V GS , I DS = 250 μA0.851.10V
R DS(on)Drain-to-Source On-ResistanceV GS = 1.8 V, I DS = 0.5 A310400mΩ
V GS = 2.5 V, I DS = 0.5 A170225mΩ
V GS = 4.5 V, I DS = 0.5 A140180mΩ
g ƒsTransconductanceV DS = 6 V, I DS = 0.5 A3.2S
DYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICS
C issInput CapacitanceV GS = 0 V, V DS = 6 V, ƒ = 1 MHz155200pF
C ossOutput CapacitanceV GS = 0 V, V DS = 6 V, ƒ = 1 MHz4762pF
C rssReverse Transfer CapacitanceV GS = 0 V, V DS = 6 V, ƒ = 1 MHz2.53.3pF
R GSeries Gate Resistance23Ω
Q gGate Charge Total (4.5 V)V DS = 6 V, I DS = 0.5 A10601400pC
Q gdGate Charge Gate-to-DrainV DS = 6 V, I DS = 0.5 A140pC
Q gsGate Charge Gate-to-SourceV DS = 6 V, I DS = 0.5 A230pC
Q g(th)Gate Charge at V th155pC
Q ossOutput ChargeV DS = 6 V, V GS = 0 V1120pC
t d(on)Turn On Delay TimeV DS = 6 V, V GS = 4.5 V, I DS = 0.5 A, R G = 2 Ω3.7ns
t rRise Time1.5ns
t d(off)Turn Off Delay Time11.0ns
t ƒFall Time3.8ns
DIODE CHARACTERISTICSDIODE CHARACTERISTICSDIODE CHARACTERISTICSDIODE CHARACTERISTICSDIODE CHARACTERISTICSDIODE CHARACTERISTICSDIODE CHARACTERISTICS
V SDDiode Forward VoltageI SD = 0.5 A, V GS = 0 V0.730.9V
Q rrReverse Recovery ChargeV DS = 6 V, I F = 0.5 A, di/dt = 300 A/μs1550pC
t rrReverse Recovery TimeV DS = 6 V, I F = 0.5 A, di/dt = 300 A/μs6ns

CSD13381F4T Absolute Maximum Ratings

T A = 25°C unless otherwise statedT A = 25°C unless otherwise statedVALUEUNIT
V DSDrain-to-source voltage12V
V GSGate-to-source voltage8V
I DContinuous drain current, T A = 25°C (1)2.1A
I DMPulsed drain current, T A = 25°C (2)7A
I GContinuous gate clamp current35mA
I GPulsed gate clamp current (2)350mA
P DPower dissipation (1)500mW
ESDHuman body model (HBM)4kV
RatingCharged device model (CDM)2kV
T J , T stgOperating junction and storage temperature range-55 to 150°C
E ASAvalanche energy, single pulse I D = 7.4 A, L = 0.1 mH, R G = 25 Ω2.7mJ
  • (1) Typical RθJA = 90°C/W on 1 inch 2 (6.45 cm 2 ), 2 oz. (0.071 mm thick) Cu pad on a 0.06 inch (1.52 mm) thick FR4 PCB.
  • (2) Pulse duration ≤ 300 μs, duty cycle ≤ 2%

CSD13381F4T Thermal Information

(TA = 25°C unless otherwise stated)

THERMAL METRICTHERMAL METRICTYPICAL VALUESUNIT
Junction-to-Ambient Thermal Resistance (1)90°C/W
Junction-to-Ambient Thermal Resistance (2)250°C/W

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
CSD13381F4Texas Instruments3-XFDFN

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All MOSFETs datasheetsAll Texas Instruments datasheets (2,418)

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