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CSD13381F4

The CSD13381F4 is an electronic component from Texas Instruments. View the full CSD13381F4 datasheet below including key specifications, pinout, electrical characteristics, absolute maximum ratings.

Manufacturer

Texas Instruments

Category

Discrete Semiconductor Products

Package

3-XFDFN

Lifecycle

Active

Key Specifications

ParameterValue
Continuous Drain Current2.1A (Ta)
Drain-Source Voltage (Vdss)12 V
Drive Voltage (Max Rds On, Min Rds On)1.8V, 4.5V
Drive Voltage (Max Rds On, Min Rds On)1.8V, 4.5V
Drive Voltage (Max Rds On, Min Rds On)1.8V, 4.5V
FET TypeN-Channel
Gate Charge (Qg)1.4 nC @ 4.5 V
Input Capacitance (Ciss)200 pF @ 6 V
Mounting TypeSurface Mount
Operating Temperature-55°C ~ 150°C (TJ)
Package / Case3-XFDFN
Power Dissipation (Max)500mW (Ta)
Rds(on)180mOhm @ 500mA, 4.5V Ω
Supplier Device Package3-PICOSTAR (1x0.60)
Supplier Device Package3-PICOSTAR (1x0.60)
Supplier Device Package3-PICOSTAR (1x0.60)
Diode TechnologyMOSFET (Metal Oxide)
Vgs (Max)8V
Gate Threshold Voltage1.1V @ 250µA

Overview

This 140 mΩ, 12 V N-channel FemtoFET ™ MOSFET technology is designed and optimized to minimize the footprint in many handheld and mobile applications. This technology is capable of replacing standard small signal MOSFETs while providing at least a 60% reduction in footprint size.

Features

  • Low On-Resistance
  • Low Qg and Qgd
  • Low Threshold Voltage
  • Ultra-Small Footprint (0402 Case Size)
  • -1.0 mm × 0.6 mm
  • Ultra-Low Profile
  • -0.35 mm Height
  • Integrated ESD Protection Diode
  • -Rated >4 kV HBM
  • -Rated >2 kV CDM
  • Lead and Halogen Free
  • RoHS Compliant

Applications

  • Optimized for Load Switch Applications
  • Optimized for General Purpose Switching Applications
  • Single-Cell Battery Applications
  • Handheld and Mobile Applications

Pin Configuration

CSD13381F4 Pinout — 3-XFDFN (PicoStar) Package

Pin NumberPin NameTypeDescription
1GIGate
2SPSource
3DPDrain

Notes

  • Package: 3-XFDFN (PicoStar), 1.0 mm × 0.6 mm, 0.35 mm max height
  • Pin 1 orientation: Top-right quadrant (Q2) of tape enclosure, closest to sprocket holes
  • Device type: 12 V N-channel MOSFET with integrated ESD protection diode (>4 kV HBM, >2 kV CDM)
  • RDS(on): 140 mΩ @ VGS = 4.5 V, IDS = 0.5 A
  • Pin names extracted from device function (Gate, Source, Drain) and confirmed against package diagram showing 3 pads in standard MOSFET configuration.

Electrical Characteristics

(TA = 25°C unless otherwise stated)

PARAMETERPARAMETERTEST CONDITIONSTYPMAXUNIT
STATIC CHARACTERISTICSSTATIC CHARACTERISTICSSTATIC CHARACTERISTICSSTATIC CHARACTERISTICSSTATIC CHARACTERISTICSSTATIC CHARACTERISTICS
BV DSSDrain-to-Source VoltageV GS = 0 V, I DS = 250 μAV
I DSSDrain-to-Source Leakage CurrentV GS = 0 V, V DS = 9.6 V100nA
I GSSGate-to-Source Leakage CurrentV DS = 0 V, V GS = 8 V50nA
V GS(th)Gate-to-Source Threshold VoltageV DS = V GS , I DS = 250 μA0.851.10V
R DS(on)Drain-to-Source On-ResistanceV GS = 1.8 V, I DS =0.5 A310400
V GS = 2.5 V, I DS =0.5 A170225
V GS = 4.5 V, I DS = 0.5 A140180
g ƒsTransconductanceV DS = 6 V, I DS = 0.5 A3.2S
DYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICS
C issInput CapacitanceV GS = 0 V, V DS = 6 V, ƒ = 1 MHz155200pF
C ossOutput CapacitanceV GS = 0 V, V DS = 6 V, ƒ = 1 MHz4762pF
C rssReverse Transfer CapacitanceV GS = 0 V, V DS = 6 V, ƒ = 1 MHz2.53.3pF
R GSeries Gate Resistance23Ω
Q gGate Charge Total (4.5 V)V DS = 6 V, I DS = 0.5 A10601400pC
Q gdGate Charge Gate-to-DrainV DS = 6 V, I DS = 0.5 A140pC
Q gsGate Charge Gate-to-SourceV DS = 6 V, I DS = 0.5 A230pC
Q g(th)Gate Charge at V th155pC
Q ossOutput ChargeV DS = 6 V, V GS = 0 V1120pC
t d(on)Turn On Delay TimeV DS = 6 V, V GS = 4.5 V, I DS = 0.5 A, R G = 2 Ω3.7ns
t rRise Time1.5ns
t d(off)Turn Off Delay Time11.0ns
t ƒFall Time3.8ns
DIODE CHARACTERISTICSDIODE CHARACTERISTICSDIODE CHARACTERISTICSDIODE CHARACTERISTICSDIODE CHARACTERISTICSDIODE CHARACTERISTICS
V SDDiode Forward VoltageI SD = 0.5 A, V GS = 0 V0.730.9V
Q rrReverse Recovery ChargeV DS = 6 V, I F = 0.5 A, di/dt = 300 A/μs1550pC
t rrReverse Recovery TimeV DS = 6 V, I F = 0.5 A, di/dt = 300 A/μs6ns

Absolute Maximum Ratings

T A = 25°C unless otherwise statedT A = 25°C unless otherwise statedVALUEUNIT
V DSDrain-to-Source Voltage12V
V GSGate-to-Source Voltage8V
I DContinuous Drain Current, T A = 25°C (1)2.1A
I DMPulsed Drain Current, T A = 25°C (2)7A
I GContinuous Gate Clamp Current35mA
I GPulsed Gate Clamp Current (2)350mA
P DPower Dissipation (1)500mW
ESDHuman Body Model (HBM)4kV
RatingCharged Device Model (CDM)2kV
T J , T stgOperating Junction and Storage Temperature Range-55 to 150°C
E ASAvalanche Energy, single pulse I D = 7.4 A, L = 0.1 mH, R G = 25 Ω2.7mJ
  • (1) Typical RθJA = 90°C/W on 1 inch 2 (6.45 cm 2 ), 2 oz. (0.071 mm thick) Cu pad on a 0.06 inch (1.52 mm) thick FR4 PCB.
  • (2) Pulse duration ≤300 μs, duty cycle ≤2%

Figure 3-2. Top View

Thermal Information

(TA = 25°C unless otherwise stated)

THERMAL METRICTHERMAL METRICTYPICAL VALUESUNIT
Junction-to-Ambient Thermal Resistance (1)90°C/W
Junction-to-Ambient Thermal Resistance (2)250°C/W

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
CSD13381F4TTexas Instruments
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