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CH32V307VCT6

32-bit RISC-V Microcontroller

The CH32V307VCT6 is a 32-bit risc-v microcontroller from WCH. View the full CH32V307VCT6 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

Official CH32V307VCT6 datasheet (PDF) — the source this page was extracted from.

Manufacturer

WCH

Package

LQFP-100

CH32V307VCT6 Key Specifications

ParameterValue
ADC2x 12-bit, 16 external + 2 internal channels
CAN2 (2.0B active)
DAC2x 12-bit
DMA2 groups of 18-channel
I2C2 (SMBus/PMBus)
SPI3 (SPI2/SPI3 shared with I2S2/I2S3)
USBUSB2.0 full-speed OTG, USB2.0 high-speed host/device with built-in 480Mbps PHY
CoreQingKe V4F 32-bit RISC-V with single-precision FPU
GPIO80 I/O ports, 16 external interrupts
SRAMup to 128KB
EthernetGigabit MAC with built-in 10M PHY
CodeFlash480KB (zero-wait application area + non-zero-wait data area)
Touch Key16 channels
BootLoader28KB
UART/USART8 (including 5 UARTs)
OPA/Comparator4 groups
Advanced Timers4x 16-bit
Other InterfacesSDIO, FSMC, DVP
GPIO Supply (VI/O)3.3V
Package Dimensions14x14mm, 0.5mm pitch
Max Clock Frequency144MHz (zero wait)
Supply Voltage (VDD)3.3V
Operating Temperature-40°C to 85°C
General-Purpose Timers4x 16-bit

CH32V307VCT6 Overview

Part: CH32V307VCT6 — WCH (WCH-IC)

Type: 32-bit RISC-V Microcontroller

Description: Industrial-grade general-purpose microcontroller based on QingKe RISC-V4F core, operating at up to 144 MHz with 480 KB CodeFlash, up to 128 KB SRAM, and extensive peripherals including USB2.0 high-speed, Gigabit Ethernet, and dual 12-bit ADCs/DACs.

Operating Conditions:

  • Supply voltage: 3.3V
  • Operating temperature: -40 to +85 °C
  • CPU main frequency: Max 144MHz

Absolute Maximum Ratings:

Key Specs:

  • Core: QingKe 32-bit RISC-V4F
  • CPU main frequency: Max 144MHz
  • Program memory (CodeFlash): Up to 480KB (zero-wait + non-zero-wait)
  • Volatile data storage (SRAM): Up to 128KB
  • ADC: 2 units, 12-bit, 16 external channels + 2 internal signals
  • DAC: 2 units, 12-bit
  • USB: USB2.0 full-speed host/device, USB2.0 high-speed host/device (built-in 480Mbps PHY)
  • Ethernet: Gigabit Ethernet MAC controller, 10M PHY transceiver

Features:

  • Single-precision floating-point unit (FPU)
  • Fast programmable interrupt controller (PFIC)
  • Multiple low-power modes: Sleep, Stop, Standby
  • Built-in 8MHz RC oscillator and 40kHz RC oscillator
  • 2 groups of 18-channel general-purpose DMA controllers
  • 4 groups of 16-bit advanced timers for motor control
  • 8 USART interfaces (including 5 UARTs)
  • 2 I2C interfaces (support SMBus/PMBus)
  • 3 SPI interfaces (SPI2, SPI3 for I2S2, I2S3)
  • 2 CAN interfaces (2.0B active)
  • SDIO host interface
  • Digital video port (DVP)
  • FSMC memory interface
  • 80 GPIO ports, mapping 16 external interrupts
  • CRC unit, 96-bit unique ID
  • 2-wire serial debug interface (SDI)

Applications:

Package:

  • LQFP100

CH32V307VCT6 Electrical Characteristics

Table 4-41 ADC characteristics

SymbolParameterConditionMin.Typ.Max.Unit
V DDASupply voltage2.43.6V
V REF+Positive reference voltageV REF+ cannot be more thanV DDA2.4V DDAV
I VREFReference current160220μA
I DDASupply current480530μA
f ADCADC clock frequency14MHz
f SSampling rate0.051MHz
f TRIGExternal trigger frequency161/f ADC
V AINConversion voltage range0V REF+V
R AINExternal input impedance50kΩ
R ADCSampling switch resistance0.61kΩ
C ADCInternal sample and capacitor8pF

Table 4-41 ADC characteristics

V3.4 78

CALCalibration timet1/f ADC
IatInjected trigger conversion latencyt21/f ADC
IatrRegular trigger conversion latencyt21/f ADC
t sSampling time1.5239.51/f ADC
STABPower-on timet1us
CONVTotal conversion time (including sampling time)t142521/f ADC

Note: Above parameters are guaranteed by design.

Formula: Maximum RAIN

The above formula is used to determine the maximum external impedance so that the error can be less than 1/4 LSB. Where N=12 (representing 12-bit resolution).

Table 4-42 Maximum RAIN when fADC = 14MHz

  • T S (cycle) t S (us) Maximum R AIN (kΩ)
  • 1.5 0.11 0.4
  • 7.5 0.54 5.9
  • 13.5 0.96 11.4
  • 28.5 2.04 25.2
  • 41.5 2.96 37.2
  • 55.5 3.96 50
  • 71.5 5.11 Invalid
  • 239.5 17.1 Invalid

Table 4-43 ADC error

SymbolParameterConditionMin.Typ.Max.Unit
EOOffset errorf PCLK2 = 56MHz,±4LSB
EDDifferential nonlinearity errorf ADC = 14MHz,±0.5±3LSB
ELIntegral nonlinearity errorR AIN < 10kΩ,V DDA = 3.3V±1±4LSB

Cp represents the parasitic capacitance on the PCB and the pad (about 5pF), which may be related to the quality of the pad and PCB layout. A larger Cp value will reduce the conversion accuracy, the solution is to reduce the f ADC value.

V3.4 79

Figure 4-29 ADC typical connection diagram

Figure 4-30 Analog power supply and decoupling circuit reference

CH32V307VCT6 Absolute Maximum Ratings

Stresses at or above the absolute maximum ratings listed in the table below may cause permanent damage to the device.

Table 4-1 Absolute maximum ratings

SymbolDescriptionDescriptionMin.Max.Unit
T AAmbient temperature during operationAmbient temperature during operation-4085°C
T SAmbient temperature during storageAmbient temperature during storage-40125°C
V DD -V SSExternal main supply voltage (includingV DDA and V DD )External main supply voltage (includingV DDA and V DD )-0.34.0V
V I/O -V SSI/O supply voltageI/O supply voltage-0.34.0V
V DD_ETH -V SSInternal 10/100M Ethernet PHY supply voltageCH32V317-0.34.0V
V DDKVoltage at decoupling end of internal power supply LDOCH32V317-0.21.5V
V INInput voltage on the FT (5V tolerance) pinInput voltage on the FT (5V tolerance) pinV SS -0.35.5V
V IN10/100M Ethernet PHY differential pinV SS -0.3V DD_ETH +0.3VV
V INInput voltage onPHY pin of USB and 10M EthernetInput voltage onPHY pin of USB and 10M EthernetV SS -0.3V DD +0.3V
V INInput voltage on other pinsInput voltage on other pinsV SS -0.3V IO +0.3V
\△ V DD_x \Variations between different main power supply pinsVariations between different main power supply pins
\△ V I/O_x \Variations between different I/O power supply pinsVariations between different I/O power supply pins
\△ V SS_x \Variations between different ground pinsVariations between different ground pins
V ESD(HBM)Electrostatic discharge voltage (HBM, non-contact)Electrostatic discharge voltage (HBM, non-contact)4K4KV
V ESD(HBM)USB pins (PA11, PA12)USB pins (PA11, PA12)3K3KV

Table 4-1 Absolute maximum ratings

V3.4 51

I VDDTotal current intoV DD /V DDA /V IO power lines (source)150mA
I VssTotal current out ofV SS ground lines (sink)150mA
I I/OSink current on any I/O and control pin25mA
I I/OSource current on any I/O and control pin-25mA
I INJ(PIN)Injected current on NRST pin+/-5mA
I INJ(PIN)Injected current on HSE's OSC_IN pin and LSE's OSC_IN pin+/-5mA
I INJ(PIN)Injected current on other pins+/-5mA
∑I INJ(PIN)Total injected current on all I/Os and control pins+/-25mA

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
CH32V303WCH—
CH32V305WCH—
CH32V307WCHTSSOP20
CH32V307/317WCH—
CH32V307RCT6WCHLQFP-64M(10x10)
CH32V307WCU6WCHQFN-68(8x8)
CH32V317WCH—

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Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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