BNO08X
System in Package (SiP) Sensor HubThe BNO08X is a system in package (sip) sensor hub from CEVA Technologies, Inc.. View the full BNO08X datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
Manufacturer
CEVA Technologies, Inc.
Category
System in Package (SiP) Sensor Hub
Key Specifications
| Parameter | Value |
|---|---|
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C |
| Output Type | I2C, SPI, UART |
| Package / Case | 28-TFLGA Module |
| Sensor Type | Accelerometer, Gyroscope, Magnetometer, 9 Axis |
| Supplier Device Package | 28-LGA (5.2x3.8) |
| Supplier Device Package | 28-LGA (5.2x3.8) |
Overview
Part: BNO08X — CEVA's Hillcrest Labs business unit Type: System in Package (SiP) Sensor Hub Description: A System in Package (SiP) integrating a triaxial accelerometer, triaxial gyroscope, magnetometer, and a 32-bit ARM Cortex-M0+ microcontroller running SH-2 firmware with MotionEngine software for real-time 3D orientation, heading, and calibrated motion data.
Operating Conditions:
- Supply voltage: 1.62–3.6 V
- Operating temperature: -40 to +85 °C
Absolute Maximum Ratings:
- Max supply voltage: 4.3 V
- Max junction/storage temperature: 125 °C
Key Specs:
- Supply voltage (VDD): 1.62 V (min) to 3.6 V (max)
- I/O voltage (VDDIO): 1.62 V (min) to 3.6 V (max)
- Operating temperature: -40 °C (min) to +85 °C (max)
- Standby current: 100 μA (typical)
- Sleep current: 30 μA (typical)
- Full feature current: 30 mA (typical)
- Gyro rotation vector latency: < 3 ms
- Gyro rotation vector report rate: 1 kHz
Features:
- Android compliant 4.4 KitKat and above
- Variety of 3D orientation outputs (including linear acceleration, rotation vectors, gravity)
- Includes 'always-on' and classification features (step counter, stability and tap detectors, and a variety of gestures)
- Dynamically calibrates sensor data for temperature and aging
- Low latency, 1kHz gyro rotation vector for AR/VR applications
- Supports new sensors and features in Android 4.4 KitKat
- Includes power management to optimize power
- Support for device firmware upgrade (DFU)
- Supports I2C, UART-SHTP, SPI, and UART-RVC interfaces
Applications:
- Wearables such as head trackers for AR/VR applications, smartwatches, fitness bands, audio headsets
- Smartphones
- Tablets
- Ultrabooks
- Robotics
- Internet of Things (IoT)
Package:
- 28 pin LGA 3.8mm x 5.2mm x 1.1mm
Features
- Three sensors and microcontroller in a single device
- Supports new sensors and features in Android 4.4 KitKat
- Includes power management to optimize power
- Support for device firmware upgrade (DFU)
Applications
- Wearables such as head trackers for AR/VR applications, smartwatches, fitness bands, audio headsets
- Smartphones
- Tablets
- Ultrabooks
- Robotics
- Internet of Things (IoT)
Pin Configuration
Figure 1-6 describes the function of each pin.
Figure 1-6: BNO08X pin descriptions
| Pin Number | BNO08X Name | Mode | Description |
|---|---|---|---|
| 1 | RESV_NC | NC | Reserved. No connect. |
| 2 | GND | Input | Ground |
| 3 | VDD | Input | Supply voltage (sensors) (2.4V to 3.6V) |
| 4 | BOOTN | Input | Bootloader mode select |
| 5 | PS1 | Input | Protocol Select pin 1 |
| 6 | PS0/WAKE | Input | Protocol Select pin 0, also used to wake processor in SPI mode |
| 7 | RESV_NC | Input | Reserved. No connect. |
| 8 | RESV_NC | NC | Reserved. No connect. |
| 9 | CAP | External capacitor (100nF to GND) | |
| 10 | CLKSEL0 | Input | Clock source selection. Internal pulldown. |
| 11 | NRST | Input | Active low reset |
| 12 | RESV_NC | NC | Reserved. No connect. |
| 13 | RESV_NC | NC | Reserved. No connect. |
| 14 | H_INTN | Output | Interrupt to host device |
| 15 | ENV_SCL | Bidirectional | Environmental sensor I 2 C clock |
| 16 | ENV_SDA | Bidirectional | Environmental sensor I 2 C data |
| 17 | SA0/H_MOSI | Input | Lower address bit of device address. In SPI mode, data input |
| 18 | H_CSN | Input | SPI chip select, active low |
| 19 | H_SCL/SCK/RX | Bidirectional | Host Interface I 2 C clock, SPI clock or UART RX |
| 20 | H_SDA/H_MISO/TX | Bidirectional | Host Interface I 2 C data, SPI data out or UART TX |
| 21 | RESV_NC | NC | Reserved. No connect. |
| 22 | RESV_NC | NC | Reserved. No connect. |
| 23 | RESV_NC | NC | Reserved. No connect. |
| 24 | RESV_NC | NC | Reserved. No connect. |
| 25 | GND | Input | Ground |
| 26 | XOUT32/CLKSEL1 | Output | 32K crystal output / clock source selection. Internal pulldown. |
| 27 | XIN32 | Input | 32K crystal input. / external clock |
| 28 | VDDIO | Input | Supply voltage (core and I/O domain) (1.65V to 3.6V) |
The BNO08X can operate from an internal oscillator, an external 32.768 kHz clock or an external 32.768 kHz crystal. If an external clock is used it must be connected to pin 27. Hillcrest recommends a tolerance of 50ppm. If a crystal is used it must be connected across pins 26 and 27. Hillcrest recommends using a crystal with tolerance 50ppm with 12.5pF capacitor loading.
Figure 1-7: 32.768kHz crystal connection
Figure 1-6: BNO08X pin descriptions
Clock source selection is done during startup using the CLKSEL0 and CLKSEL1 pins. Figure 1-8 shows how to select each source. The internal clock source must not be used with the UART-SHTP or UART-RVC interfaces.
Figure 1-8: Clock Source Selection
| Source | CLKSEL0 | CLKSEL1 |
|---|---|---|
| Crystal | 0 or unconnected | Connected to crystal |
| External | 1 | 1 |
| Internal | 1 | 0 or unconnected |
CLKSEL0 is configured with an internal pulldown at startup. After CLKSEL0 has been sampled, if it is found to be a 1, the internal pulldown is disabled to avoid unnecessary power consumption. If either the external or internal clock sources are selected, then CLKSEL1 is configured as an input with a pulldown. CLSKSEL1 is then sample and the clock source determined. After CLKSEL1 has been sampled, if it is found to be a 1, the internal pulldown is disabled to avoid unnecessary power consumption.
Figure 1-9: External clock connection
Figure 1-8: Clock Source Selection
Electrical Characteristics
Figure 6-3: BNO08X electrical characteristics
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Input high voltage | V IH | V DDIO =1.7-2.7V | 0.7*V DDIO | V DDIO | ||
| Input high voltage | V IH | V DDIO =2.7-3.6V | 0.55*V DDIO | V DDIO | ||
| Input low voltage | V IL | V DDIO =1.7-2.7V | 0.25*V DDIO | V DDIO | ||
| Input low voltage | V IL | V DDIO =2.7-3.6V | 0.3*V DDIO | V DDIO | ||
| Output high voltage | V OH | V DDIO > 1.7V , I OH =10mA | 0.8*V DDIO | 0.9*V DDIO | V DDIO | |
| Output low voltage | V OL | V DDIO > 3V, I OL =20mA | 0.1*V DDIO | 0.2*V DDIO | V DDIO | |
| POR Voltage threshold on VDDIO-IN rising | V DDIO_POT+ | V DDIO falls at 1V/ms or slower | 1.45 | V | ||
| POR Voltage threshold on VDDIO-IN falling | V DDIO_POT- | V DDIO falls at 1V/ms or slower | 0.99 | V |
Absolute Maximum Ratings
Exposure to maximum rating conditions for extended periods may affect device reliability.
Figure 6-1: BNO08X maximum ratings
| Parameter | Symbol | Conditions | Rating | Unit |
|---|---|---|---|---|
| Voltage at supply pin | V DDIO | -0.3 to 3.63 | V | |
| Voltage at supply pin | V DD | -0.3 to 4.25 | V | |
| Voltage at any logic pin | V non-supply | V DDIO +0.3 | V | |
| Storage temperature | T rps | ≤ 65% rel. H | -50 to +150 | °C |
| Mechanical shock | MechShock 200μs | Duration ≤ 200μs | 10,000 | g |
| Mechanical shock | MechShock 1ms | Duration ≤ 1.0ms | 2,000 | g |
| Mechanical shock | MechShock freefall | Free fall onto hard surfaces | 1.8 | m |
| ESD | ESD HBM | HBM at any pin | 2 | kV |
| ESD | ESD CDM | CDM | 500 | V |
| ESD | ESD MM | MM | 200 | V |
Recommended Operating Conditions
Figure 6-2: BNO08X operating conditions
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply voltage (μC and I/O Domain) | V DDIO | 1.7 | 3.6 | V | ||
| Supply voltage (only sensors) | V DD | 2.4 | 3.6 | V | ||
| Operating temperature | -40 | 85 | °C |
Package Information
The BNO08X is available in a 28-pin Land Grid Array (LGA) package. Units are in mm. Note: Unless otherwise specified tolerance = decimal ±0.1mm.
Figure 7-1: 28 pin LGA package outline (Image from Bosch)
Related Variants
The following components are covered by the same datasheet.
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