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BNO080

System in Package (SiP) Sensor Hub

The BNO080 is a system in package (sip) sensor hub from CEVA Technologies, Inc.. View the full BNO080 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

Manufacturer

CEVA Technologies, Inc.

Category

System in Package (SiP) Sensor Hub

Package

28-TFLGA Module

Lifecycle

Obsolete

Key Specifications

ParameterValue
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 85°C
Output TypeI2C, SPI, UART
Package / Case28-TFLGA Module
Sensor TypeAccelerometer, Gyroscope, Magnetometer, 9 Axis
Supplier Device Package28-LGA (5.2x3.8)
Supplier Device Package28-LGA (5.2x3.8)

Overview

Part: BNO08X — CEVA's Hillcrest Labs business unit Type: System in Package (SiP) Sensor Hub Description: A System in Package (SiP) integrating a triaxial accelerometer, triaxial gyroscope, magnetometer, and a 32-bit ARM Cortex-M0+ microcontroller running SH-2 firmware with MotionEngine software for real-time 3D orientation, heading, and calibrated motion data.

Operating Conditions:

  • Supply voltage: 1.62–3.6 V
  • Operating temperature: -40 to +85 °C

Absolute Maximum Ratings:

  • Max supply voltage: 4.3 V
  • Max junction/storage temperature: 125 °C

Key Specs:

  • Supply voltage (VDD): 1.62 V (min) to 3.6 V (max)
  • I/O voltage (VDDIO): 1.62 V (min) to 3.6 V (max)
  • Operating temperature: -40 °C (min) to +85 °C (max)
  • Standby current: 100 μA (typical)
  • Sleep current: 30 μA (typical)
  • Full feature current: 30 mA (typical)
  • Gyro rotation vector latency: < 3 ms
  • Gyro rotation vector report rate: 1 kHz

Features:

  • Android compliant 4.4 KitKat and above
  • Variety of 3D orientation outputs (including linear acceleration, rotation vectors, gravity)
  • Includes 'always-on' and classification features (step counter, stability and tap detectors, and a variety of gestures)
  • Dynamically calibrates sensor data for temperature and aging
  • Low latency, 1kHz gyro rotation vector for AR/VR applications
  • Supports new sensors and features in Android 4.4 KitKat
  • Includes power management to optimize power
  • Support for device firmware upgrade (DFU)
  • Supports I2C, UART-SHTP, SPI, and UART-RVC interfaces

Applications:

  • Wearables such as head trackers for AR/VR applications, smartwatches, fitness bands, audio headsets
  • Smartphones
  • Tablets
  • Ultrabooks
  • Robotics
  • Internet of Things (IoT)

Package:

  • 28 pin LGA 3.8mm x 5.2mm x 1.1mm

Features

  • Three sensors and microcontroller in a single device
  • Supports new sensors and features in Android 4.4 KitKat
  • Includes power management to optimize power
  • Support for device firmware upgrade (DFU)

Applications

  • Wearables such as head trackers for AR/VR applications, smartwatches, fitness bands, audio headsets
  • Smartphones
  • Tablets
  • Ultrabooks
  • Robotics
  • Internet of Things (IoT)

Pin Configuration

Figure 1-6 describes the function of each pin.

Figure 1-6: BNO08X pin descriptions

Pin NumberBNO08X NameModeDescription
1RESV_NCNCReserved. No connect.
2GNDInputGround
3VDDInputSupply voltage (sensors) (2.4V to 3.6V)
4BOOTNInputBootloader mode select
5PS1InputProtocol Select pin 1
6PS0/WAKEInputProtocol Select pin 0, also used to wake processor in SPI mode
7RESV_NCInputReserved. No connect.
8RESV_NCNCReserved. No connect.
9CAPExternal capacitor (100nF to GND)
10CLKSEL0InputClock source selection. Internal pulldown.
11NRSTInputActive low reset
12RESV_NCNCReserved. No connect.
13RESV_NCNCReserved. No connect.
14H_INTNOutputInterrupt to host device
15ENV_SCLBidirectionalEnvironmental sensor I 2 C clock
16ENV_SDABidirectionalEnvironmental sensor I 2 C data
17SA0/H_MOSIInputLower address bit of device address. In SPI mode, data input
18H_CSNInputSPI chip select, active low
19H_SCL/SCK/RXBidirectionalHost Interface I 2 C clock, SPI clock or UART RX
20H_SDA/H_MISO/TXBidirectionalHost Interface I 2 C data, SPI data out or UART TX
21RESV_NCNCReserved. No connect.
22RESV_NCNCReserved. No connect.
23RESV_NCNCReserved. No connect.
24RESV_NCNCReserved. No connect.
25GNDInputGround
26XOUT32/CLKSEL1Output32K crystal output / clock source selection. Internal pulldown.
27XIN32Input32K crystal input. / external clock
28VDDIOInputSupply voltage (core and I/O domain) (1.65V to 3.6V)

The BNO08X can operate from an internal oscillator, an external 32.768 kHz clock or an external 32.768 kHz crystal. If an external clock is used it must be connected to pin 27. Hillcrest recommends a tolerance of 50ppm. If a crystal is used it must be connected across pins 26 and 27. Hillcrest recommends using a crystal with tolerance 50ppm with 12.5pF capacitor loading.

Figure 1-7: 32.768kHz crystal connection

Figure 1-6: BNO08X pin descriptions

Clock source selection is done during startup using the CLKSEL0 and CLKSEL1 pins. Figure 1-8 shows how to select each source. The internal clock source must not be used with the UART-SHTP or UART-RVC interfaces.

Figure 1-8: Clock Source Selection

SourceCLKSEL0CLKSEL1
Crystal0 or unconnectedConnected to crystal
External11
Internal10 or unconnected

CLKSEL0 is configured with an internal pulldown at startup. After CLKSEL0 has been sampled, if it is found to be a 1, the internal pulldown is disabled to avoid unnecessary power consumption. If either the external or internal clock sources are selected, then CLKSEL1 is configured as an input with a pulldown. CLSKSEL1 is then sample and the clock source determined. After CLKSEL1 has been sampled, if it is found to be a 1, the internal pulldown is disabled to avoid unnecessary power consumption.

Figure 1-9: External clock connection

Figure 1-8: Clock Source Selection

Electrical Characteristics

Figure 6-3: BNO08X electrical characteristics

ParameterSymbolConditionsMinTypMaxUnit
Input high voltageV IHV DDIO =1.7-2.7V0.7*V DDIOV DDIO
Input high voltageV IHV DDIO =2.7-3.6V0.55*V DDIOV DDIO
Input low voltageV ILV DDIO =1.7-2.7V0.25*V DDIOV DDIO
Input low voltageV ILV DDIO =2.7-3.6V0.3*V DDIOV DDIO
Output high voltageV OHV DDIO > 1.7V , I OH =10mA0.8*V DDIO0.9*V DDIOV DDIO
Output low voltageV OLV DDIO > 3V, I OL =20mA0.1*V DDIO0.2*V DDIOV DDIO
POR Voltage threshold on VDDIO-IN risingV DDIO_POT+V DDIO falls at 1V/ms or slower1.45V
POR Voltage threshold on VDDIO-IN fallingV DDIO_POT-V DDIO falls at 1V/ms or slower0.99V

Absolute Maximum Ratings

Exposure to maximum rating conditions for extended periods may affect device reliability.

Figure 6-1: BNO08X maximum ratings

ParameterSymbolConditionsRatingUnit
Voltage at supply pinV DDIO-0.3 to 3.63V
Voltage at supply pinV DD-0.3 to 4.25V
Voltage at any logic pinV non-supplyV DDIO +0.3V
Storage temperatureT rps≤ 65% rel. H-50 to +150°C
Mechanical shockMechShock 200μsDuration ≤ 200μs10,000g
Mechanical shockMechShock 1msDuration ≤ 1.0ms2,000g
Mechanical shockMechShock freefallFree fall onto hard surfaces1.8m
ESDESD HBMHBM at any pin2kV
ESDESD CDMCDM500V
ESDESD MMMM200V

Recommended Operating Conditions

Figure 6-2: BNO08X operating conditions

ParameterSymbolConditionsMinTypMaxUnit
Supply voltage (μC and I/O Domain)V DDIO1.73.6V
Supply voltage (only sensors)V DD2.43.6V
Operating temperature-4085°C

Package Information

The BNO08X is available in a 28-pin Land Grid Array (LGA) package. Units are in mm. Note: Unless otherwise specified tolerance = decimal ±0.1mm.

Figure 7-1: 28 pin LGA package outline (Image from Bosch)

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
BNO085CEVA Technologies, Inc.28-TFLGA Module
BNO08XCEVA Technologies, Inc.
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