BGS12WN6
The BGS12WN6 is an electronic component from Infineon Technologies. View the full BGS12WN6 datasheet below including absolute maximum ratings.
Manufacturer
Infineon Technologies
Category
RF Switches
Overview
The BGS12WN6 RF CMOS switch is specifically designed for UWB, WLAN, and Bluetooth applications. Any of the 2 ports can be used as termination of the diversity antenna handling up to 26 dBm. The chip integrates on-chip CMOS logic driven by a simple, single-pin CMOS or TTL compatible control input signal. Unlike GaAs technology, external DC blocking capacitors at the RF ports are only required if DC voltage is applied externally. The BGS12WN6 RF switch is manufactured in Infineon's patented MOStechnology, offering the performance of GaAs with the economy and integration of conventional CMOS including the inherent higher ESD robustness. The device has a very small size of only 0.7 × 1.1 mm 2 and a maximum height of 0.375 mm.
| Type | Marking | Package | Ordering information |
|---|---|---|---|
| BGS12WN6 | K | PG-TSNP-6-10 PG-TSNP-6-8 PG-TSNP-6-2 | BGS 12WN6 E6327 BGS 12WN6 E6329 BGS 12WN6 E6329 |
Features
- Suitable for WIFI, Bluetooth and UWB applications
- Fast switching speed
- High linearity up to 26 dBm input power
- Low insertion loss and high port to port isolation up to 9 GHz
- Low current consumption
- On-chip control logic
- Ultra low profile lead-less plastic package
- RoHS and WEEE compliant package
Applications
The BGS12WN6 RF switch is specifically designed for UWB, WIFI, and Bluetooth applications. Any of the 2 ports can be used as termination of the diversity antenna handling up to 26 dBm.
Pin Configuration
Figure 2: BGS12WN6 Pin configuration (top view)
Absolute Maximum Ratings
Table 1: Absolute maximum ratings at T A = 25 ◦ C , unless otherwise specified
- There is also a DC connection between switched paths. The DC voltage at RF ports V RFDC has to be 0 V.
| Parameter | Symbol | Values | Values | Values | Unit | Note / Test condition |
|---|---|---|---|---|---|---|
| Min. | Typ. | Max. | ||||
| Frequency range 1) | f | 0.05 | - | 9 | GHz | - |
| Supply voltage | V DD | 0 | - | 4.2 | V | - |
| Storage temperature range | T STG | -55 | - | 150 | ◦ C | - |
| RF input power at all RF ports | P RF,max | - | - | 30 | dBm | CW/VSWR1:1 / Z 0 = 50 Ω |
| ESD capability,CDM 2) | V ESD,CDM | -1 | - | +1 | kV | - |
| ESD capability,HBM 3) | V ESD,HBM | -1 | - | +1 | kV | - |
| ESD capability RF ports 4) | V ESD,RF | -8 | - | +8 | kV | Each single RF-in/out port ver- sus GND, with 27nH shunt in- ductor |
| ESD capability RF ports 4) | V ESD,RF | -6 | - | +6 | kV | Each single RF-in/out port ver- sus GND, with 56nH shunt in- ductor |
| Junction temperature | T j | - | - | 125 | ◦ C | - |
| Thermal resistance junction - soldering point | R thJS | - | - | 70 | K/W | - |
| Maximum DC-voltage on RF ports and RF-Ground | V RFDC | 0 | - | 0 | V | No DC voltages allowed on RF- Ports |
Package Information
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| X-dimension | X | 0.7 ± 0.05 | mm |
| Y-dimension | Y | 1.1 ± 0.05 | mm |
| Size | Size | 0.77 | mm 2 |
| Height PG-TSNP-6-10 | H | 0.37 +0.03 / - 0.02 | mm |
| Height PG-TSNP-6-8 | H | 0.375 ± 0.025 | mm |
| Height PG-TSNP-6-2 | H | 0.375 +0.025 / - 0.015 | mm |
Figure 3: PG-TSNP-6-10 package outline (top, side and bottom views)
Figure 3: PG-TSNP-6-10 package outline (top, side and bottom views)
Figure 4: PG-TSNP-6-8 package outline (top, side and bottom views)
Figure 4: PG-TSNP-6-8 package outline (top, side and bottom views)
Figure 5: PG-TSNP-6-2 package outline (top, side and bottom views)
Figure 6: Footprint recommendation
Figure 7: Marking specification (top view). Monthly date code specified in Table 13.
Table 13: Monthly date code marking
| Month | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
|---|---|---|---|---|---|---|---|---|---|
| 1 | P | a | p | A | P | a | p | A | P |
| 2 | Q | b | q | B | Q | b | q | B | Q |
| 3 | R | c | r | C | R | c | r | C | R |
| 4 | S | d | s | D | S | d | s | D | S |
| 5 | T | e | t | E | T | e | t | E | T |
| 6 | U | f | u | F | U | f | u | F | U |
| 7 | V | g | v | G | V | g | v | G | V |
| 8 | X | h | x | H | X | h | x | H | X |
| 9 | Y | j | y | J | Y | j | y | J | Y |
| 10 | Z | k | z | K | Z | k | z | K | Z |
| 11 | 4 | l | 2 | L | 4 | l | 2 | L | 4 |
| 12 | 5 | n | 3 | N | 5 | n | 3 | N | 5 |
Table 13: Monthly date code marking
Figure 8: PG-TSNP-6-10 carrier tape drawing (top, side and bottom Views)
Figure 8: PG-TSNP-6-10 carrier tape drawing (top, side and bottom Views)
Figure 9: PG-TSNP-6-8 carrier tape drawing (top, side and bottom Views)
Figure 10: PG-TSNP-6-2 carrier tape drawing (top, side and bottom Views)
| Revision History | Revision History |
|---|---|
| Revision 2.4, 2020-08-12 | Revision 2.4, 2020-08-12 |
| Page or Item | Subjects (major changes since previous revision) |
| Revision 2.5, 2021-12-21 | Revision 2.5, 2021-12-21 |
| Titlepage | Feature-list and potential applications extended by WIFI |
| 2 | Feature-list extended by WIFI |
| 3 | Abs-max RF input power |
| 4 | Supply current under nominal conditions, operational RF input power |
| 7 | Table 6, P0.1dB and WIFI Hx testcases added |
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| BGS12WN6E6327 | Infineon Technologies | — |
Get structured datasheet data via API
Get started free